Abstract: An atomic layer deposition equipment and an atomic layer deposition process method are disclosed. The atomic layer deposition equipment includes a chamber, a heater, a support unit, a hollow component, a bottom pumping port, and a shower head component, wherein the support unit is disposed on the top surface of the heater for supporting a substrate. There is an upper exhaust path formed between the hollow component and the support unit for exhausting process fluid such as precursors, so that the flow field of the process fluid in the atomic layer deposition process can be adjusted stably to make a uniform deposition on the substrate.

Abstract: The present disclosure relates to a substrate transfer system, which includes a main body, a tray cassette base, a tray aligner, a tray robot, a substrate cassette base, a substrate aligner, a substrate robot and a Bernoulli robot. The tray can be transferred to the tray aligner by the tray robot. The substrate can be transferred to the substrate aligner by the substrate robot. By the Bernoulli robot, the substrate can be transferred from the substrate aligner to the tray on the tray aligner.