Abstract: Envelope tracking systems for power amplifiers are provided herein. In certain embodiments, an envelope tracker is provided for a power amplifier that amplifies an RF signal. The envelope tracker includes an error amplifier that controls a voltage level of a power amplifier supply voltage of the power amplifier based on amplifying a difference between a reference signal and an envelope signal indicating an envelope of the RF signal. The envelope tracker further includes a multi-level switching circuit that generates an error amplifier supply voltage based on sensing a current of the error amplifier, and uses the error amplifier supply voltage to power the error amplifier.

Abstract: A semiconductor die includes a substrate layer, one or more metal layers disposed over the substrate layer, and a pair of polyimide layers disposed over the substrate so that they define an interface therebetween. One or both of the pair of polyimide layers have a trench that separates the interface from the one or more metal layers. The trench can be formed by etching the polyimide layer(s). A topcoat insulation layer is disposed over the one or more metal layers and polyimide layers. The topcoat insulation layer is impervious to moisture and the trench inhibits migration of moisture along the interface to the one or more metal layers, thereby preventing metal migration from the one or more metal layers along the interface.

Abstract: Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

Abstract: Unpowered switching module. A switching module can include a first input terminal, a second input terminal, and an output terminal. The output terminal can be configured to output a radio-frequency (RF) component of an input signal received on the first input terminal or the second input terminal in response to the input signal including a positive direct-current (DC) voltage.

Abstract: Voltage converter having overcurrent protection. In some embodiments, a voltage converter can include a voltage converting circuit configured to receive an input voltage and generate an output voltage. The voltage converter can further include an overcurrent protection circuit coupled to the voltage converting circuit and having a detection unit configured to detect an overcurrent condition associated with the voltage converting circuit. The overcurrent protection circuit can further include a consumption unit configured to selectively consume and thereby reduce a current in a path associated with the voltage converting circuit based on the detection of the overcurrent condition.

Abstract: A transmit/receive switching assembly includes a symmetrical PIN diode-based switch to selectively connect an antenna port to one of a transmit port and a receive port, transmit bias control circuitry that receives a first bias control signal, receive bias control circuitry that receives a second bias control signal, and shunt bias control circuitry coupled between the symmetrical PIN diode-based switch and a reference node. The first and second bias control signals are simultaneously and oppositely switchable between first and second voltage values and together configured to operate the switch between a transmit mode where RF signal flow is enabled from the transmit port to the antenna port and isolation is provided between the antenna port and the receive port, and a receive mode where RF signal flow is enabled from the antenna port to the receive port and isolation is provided between the antenna port and the transmit port.

Abstract: According to one aspect, embodiments of the invention provide an amplifier system comprising a first phase shifter configured to generate, based on an input signal, a first signal and a second signal, the second signal being out of phase with the first signal, a first amplifier configured to apply a first gain to the first signal to produce a gain adjusted first signal, a second amplifier configured to apply a second gain to the second signal to produce a gain adjusted second signal, a second phase shifter configured to combine the gain adjusted first and second signals to produce an output signal, and a controller configured to identify a high voltage swing across the first amplifier and, in response to identifying the high voltage swing, adjust the first gain to reduce output power of the first amplifier and adjust the second gain to increase output power of the second amplifier.

Abstract: Disclosed herein are embodiments of materials having high thermal conductivity along with a high dielectric constants. In some embodiments, a two phase composite ceramic material can be formed having a contiguous aluminum oxide phase with a secondary phase embedded within the continuous phase. Example secondary phases include calcium titanate, strontium titanate, or titanium dioxide.

Abstract: Envelope tracking systems for power amplifiers are provided herein. In certain embodiments, an envelope tracker supplies power to a power amplifier that amplifies an RF signal. The envelope tracker includes a multi-level switching circuit that generates an output current based on an envelope signal indicating an envelope of the RF signal. The envelope tracker further includes a combiner that combines a DC voltage with the output current of the multi-level switching circuit to generate a power amplifier supply voltage for the power amplifier. Accordingly, the output current of the multi-level switching circuit and a DC voltage are combined to generate the power amplifier supply voltage. Implementing the envelope tracking system in this manner can provide enhanced efficiency and/or higher bandwidth relative to an envelope tracking system in which a multi-level switching circuit directly outputs a power amplifier supply voltage.

Abstract: Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic stepped impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be, for example, tapered, sectioned, or stair-stepped in order to provide different impedances in the ceramic resonator.

Abstract: A Radio Frequency (RF) circuit including a receive path, a transmit path, a switching circuit, and an output configured to receive RF signals from an antenna in a receive mode of operation, and to provide RF signals to the antenna in a transmit mode of operation. The receive path is configured to be coupled between a low-noise amplifier and the output. The switching circuit is located in the receive path and is configured, in the receive mode, to selectively couple the low-noise amplifier to the output and to pass the received RF signals from the output to the low-noise amplifier. The transmit path is configured to be coupled between a power amplifier and the output, to provide, in the transmit mode, signals from the power amplifier to the output, bypassing the switching circuit, and to have, in receive mode of operation, an off-state impedance of at least 200+j*13 Ohm.

Abstract: Disclosed are embodiments of synthetic garnet materials for use in radiofrequency applications. In some embodiments, increased amounts of gadolinium can be added into specific sites in the crystal structure of the synthetic garnet by incorporating indium, a trivalent element. By including both indium and increased amounts of gadolinium, the dielectric constant can be improved. Thus, embodiments of the disclosed material can be advantageous in both above and below resonance applications, such as for isolators and circulators.

Abstract: Low noise charge pumps are disclosed. In certain embodiments, a charge pump includes a charge pump output terminal that provides a charge pump voltage, a switched capacitor, and a plurality of switches that charge the switched capacitor during a charging operation of the charge pump and that connect the switched capacitor to the charge pump output terminal during a discharging operation of the charge pump. The switches operate with non-overlap between the charging operation and the discharging operation so that the charge pump operates with low noise.

Abstract: Shielding for flip chip devices. In some embodiments, a shielded assembly can include a substrate and a flip chip die having a front side and a back side, with the including an integrated circuit implemented on the front side, and the front side of the flip chip die being mounted to the substrate. The shielded assembly can further include a shielding component implemented over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.

Abstract: A printed circuit board includes a mounting surface, a transceiver mounted on the mounting surface and configured to process radio-frequency signals, and a radio-frequency module mounted on the mounting surface in communication with the transceiver, the radio-frequency module including an interface including M inputs and N outputs, each of the quantities M and N greater than 1, the interface configured so that each of at least two of the M inputs is coupled to a separate output through a separate switch.

Abstract: Apparatus and methods for modulation partition and transmission via multiple antennas for enhanced transmit power capability are provided herein. In certain embodiments, an RF communication system includes a transceiver that generates a first RF signal and a second RF signal corresponding to partitions of a modulated RF signal. For example, the first RF signal and the second RF signal can be associated with different RB allocations of one or more channels of a frequency band. The RF communication system further includes a first transmit chain that processes the first RF signal to generate a first RF output signal for transmission on a first antenna, and a second transmit chain that processes the second RF signal to generate a second RF output signal for transmission on a second antenna.

Abstract: Aspects of this disclosure relate to a coupler circuit configured to receive an output of a radio frequency coupler. The coupler circuit can be arranged in a daisy chain with other coupler circuits. The coupler circuit can include a switch configured to turn on based on a signal level of a direct current component of a coupler signal from another coupler circuit and pass a radio frequency component of the coupler signal when on. The coupler circuit can pass the coupler signal while a module that includes the coupler circuit is otherwise inactive.

Abstract: An acoustic wave device comprises a piezoelectric material and a second material disposed on the piezoelectric material and having a temperature coefficient of frequency of a sign opposite a sign of a temperature coefficient of frequency of the piezoelectric material, the second material including one or more of Si1-x-yTixPyO2-zFz (x,y,z<0.1), Si1-x-yGexPyO2-zFz, Si1-x-yBxPyO2-zFz (x=y<0.04), Si1-3xZnxP2xO2-yFy, Si1-xPxO2-yFy, Si1-2yGaxPxO4, Si1-2yGay-xBxPyO4, Si1-2yGay-xBxPyO4-zFz, TiNb10O29, Si1-xTixO2-yFy, Si1-x-yTixPyO2, Si1-xBxO2-yFy, Si1-x-yBxPyO2, GeO2, GeO2-yFy, Si1-xGexO2, Si1-xGexO2-yFy, Si1-x-yGexPyO2, ZnP2O6, Si1-3xZnxP2xO2, Ge1-3xZnxP2xO2, TeOx, Si1-xTexO2+y, Ge1-xTexO2+y, Si1-3x-yGeyZnxP2xO2, Si1-xPxO2-xNx, Si—O—C, Si1-2yAlxPxO4, or BeF2.

Abstract: Aspects of this disclosure relate to an acoustic wave device with transverse mode suppression. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode, a temperature compensation layer, and a multi-layer mass loading strip. The mass loading strip has a density that is higher than a density of the temperature compensation layer. The mass loading strip can overlap edge portions of fingers of the interdigital transducer electrode. The mass loading strip can include a first layer for adhesion and a second layer for mass loading. The mass loading strip can suppress a transverse mode.

Abstract: A method for driving a high-power drive device includes providing a signal having a first predetermined signal level to an output node during a first phase of a multi-phase transition process. The method includes generating a first indication of a first parameter associated with the signal provided to the output node. The method includes generating a second indication of a second parameter associated with the signal provided to the output node. The method includes providing the signal having a second predetermined signal level to the output node during a second phase of the multi-phase transition process. The method includes transitioning from the first phase to the second phase based on the first indication and the second indication. A multi-die, distributed package technique addresses power dissipation requirements for a driver product based on size and associated power dissipation needs of the high-power drive device in a target application.