Patents Assigned to Skyworks Solution, Inc.
  • Control of under-fill using a film during fabrication for a dual-sided ball grid array package
    Patent number: 11244835
    Abstract: Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use a film during fabrication to control the distribution of an under-fill material between one or more components and a packaging substrate. The method includes mounting components to a first side of a packaging substrate and applying a film to a second side of a packaging substrate. The method also includes mounting a lower component to the second side of the packaging substrate and under-filling the lower component mounted on the second side of the packaging substrate with an under-filling agent. The method also includes removing the film on the second side of the packaging substrate and mounting solder balls to the second side of the packaging substrate after removal of the film.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: February 8, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Robert Francis Darveaux, Howard E. Chen, Hoang Mong Nguyen
  • Radio frequency device with integrated antenna tuner and multiplexer
    Patent number: 11245432
    Abstract: Radio frequency communication systems with a combined antenna impedance tuning and antenna multiplexing functionality are provided. In certain embodiments, a packaged radio frequency module includes an antenna multiplexer and an antenna impedance tuner. The module can be configured to provide impedance matching between one or more radio frequency front end modules and an antenna. The antenna impedance tuner can supplement antenna tuning provided by an antenna aperture separately connected to the antenna.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: February 8, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Shayan Farahvash, Weimin Sun, John C. Baldwin, Joel Richard King
  • Sounding reference signal switching
    Patent number: 11245552
    Abstract: Apparatus and methods for sounding reference signal (SRS) switching are provided. In certain embodiments, transmit path resources of UE are used to reduce or eliminate the impairment of SRS upon transport capacity. Furthermore, the transmit path resources can be used for other purposes, and thus SRS switching time can be reduced by re-using transmit path resources that may be included for other purposes. The teachings herein can be used to achieve SRS switching of 0 ?s, thereby eliminating the impact of switching timing constraints for SRS symbols on transport capacity.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: February 8, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Dominique Michel Yves Brunel, Laurent Noel
  • Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
    Patent number: 11245433
    Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.
    Type: Grant
    Filed: March 15, 2020
    Date of Patent: February 8, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventor: James Phillip Young
  • Acoustic wave device with spinel layer and temperature compensation layer
    Patent number: 11245378
    Abstract: An acoustic wave device that includes a spinel layer, a piezoelectric layer, a temperature compensating layer between the spinel layer and the piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of ?. The piezoelectric layer can have a thickness that is less than ?. In some embodiments, the spinel layer can be a polycrystalline spinel layer.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: February 8, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura, Keiichi Maki
  • Planar end fire antenna for wideband low form factor applications
    Patent number: 11245190
    Abstract: An end-fire antenna for wideband low form factor applications includes a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. An open cavity formed in the dielectric layer that is filled with air, the cavity defined by a pair of sidewalls that extend from an aperture of the cavity to a rear wall of the cavity, where the depth of the aperture is defined between the aperture and the rear wall. The cavity is formed by selecting the width of the aperture of the cavity and the depth of the cavity such that the antenna achieves the same gain during operation irrespective of a variation in the thickness of the antenna.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 8, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Foad Arfaei Malekzadeh, Stephen Joseph Kovacic, Abdulhadi Ebrahim Abdulhadi, Dinhphuoc Vu Hoang
  • Power amplifier bias modulation for low bandwidth envelope tracking
    Patent number: 11239800
    Abstract: Apparatus and methods for power amplifier bias modulation for low bandwidth envelope tracking are provided herein. In certain embodiments, an envelope tracking system includes a power amplifier that amplifies an RF signal and a low bandwidth envelope tracker that generates a power amplifier supply voltage for the power amplifier based on an envelope of the RF signal. The envelope tracking system further includes a bias modulation circuit that modulates a bias signal of the power amplifier based on a voltage level of the power amplifier supply voltage.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: February 1, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Serge Francois Drogi, Philip John Lehtola, Florinel G. Balteanu
  • Power management systems including a plurality of converters for providing dual integrated multi-mode power management
    Patent number: 11239755
    Abstract: A power management device is disclosed, including a first DC-DC converter coupled to a first output voltage line, a second DC-DC converter coupled to a second output voltage line, a first set of switches associated with the first DC-DC converter, and a second set of switches associated with the second DC-DC converter. The power management device may further include a controller configured to toggle one or more switches of the first set of switches and one or more switches of the second set of switches, and a multi-mode radio-frequency front-end block communicatively coupled to the controller.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 1, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventor: David Steven Ripley
  • Low loss temperature compensated surface acoustic wave filter and duplexer
    Patent number: 11239817
    Abstract: A surface acoustic wave resonator comprises at least one set of interdigital transducer (IDT) electrodes disposed on an upper surface of a piezoelectric substrate between first and second reflector gratings, a layer of silicon nitride disposed over the at least one set of IDT electrodes and the first and second reflector gratings, and a continuous trench formed in the layer of silicon nitride over portions of bus bar electrodes and tips of electrode fingers of the at least one set of IDT electrodes and over portions of bus bar electrodes and electrode fingers of the first and second reflector gratings to reduce acoustic leakage at electrode fingers of the first and second reflector gratings proximate the at least one set of IDT electrodes.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: February 1, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Koichi Hatano
  • Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same
    Patent number: 11233014
    Abstract: Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 25, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, David Viveiros, Jr., Russ Alan Reisner, Robert Francis Darveaux
  • Receiver front end for digital isolators
    Patent number: 11233482
    Abstract: A receiver front-end includes a first peaking gain stage configured to amplify a received differential pair of signals received on an input differential pair of nodes. The first peaking gain stage has a first frequency response including a first peak gain at or near a carrier frequency in a first pass band. The first peak gain occurs just prior to a first cutoff frequency. A second peaking gain stage is configured to amplify a differential pair of signals generated by the first peaking gain stage. The second peaking gain stage has a high input impedance and a second frequency response including a second peak gain at or near the carrier frequency in a second pass band. The second peak gain occurs just prior to a second cutoff frequency. The first peaking gain stage and the second peaking gain stage have a cascaded peak gain at or near the carrier frequency.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: January 25, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventor: Mohammad Al-Shyoukh
  • Concurrent electrostatic discharge and surge protection clamps in power amplifiers
    Patent number: 11233486
    Abstract: Concurrent electrostatic discharge and surge protection clamps in power amplifiers. In some embodiments, a semiconductor die can include a semiconductor substrate and an integrated circuit implemented on the semiconductor substrate. The integrated circuit can include a power amplifier and a controller. The semiconductor die can further include a clamp circuit implemented on the semiconductor substrate and configured to provide electrostatic discharge protection and surge protection for at least some of the integrated circuit.
    Type: Grant
    Filed: February 1, 2020
    Date of Patent: January 25, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Myunghwan Park, Jermyn Tseng, John Tzung-Yin Lee, David Steven Ripley
  • Jitter self-test using timestamps
    Patent number: 11228403
    Abstract: A method for estimating jitter of a clock signal includes generating a phase-adjusted clock signal based on an input clock signal and a feedback clock signal using a frequency-divided clock signal. The method generating N digital time codes for each phase adjustment of P phase adjustments of the phase-adjusted clock signal using a reference clock signal. Each digital time code of the N digital time codes corresponds to a first edge of a clock signal based on the frequency-divided clock signal. P is a first integer greater than zero and N is a second integer greater than zero. The method includes generating a jitter indicator based on an expected period of the clock signal and the N digital time codes for each phase adjustment of the P phase adjustments.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: January 18, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Raghunandan K. Ranganathan, Kannanthodath V. Jayakumar, Srisai R. Seethamraju
  • Multi-level envelope tracking with analog interface
    Patent number: 11223324
    Abstract: Multi-level envelope trackers with an analog interface are provided herein. In certain embodiments, an envelope tracking system for generating a power amplifier supply voltage for a power amplifier is provided. The envelope tracking system includes a multi-level supply (MLS) DC-to-DC converter that outputs multiple regulated voltages, an MLS modulator that controls selection of the regulated voltages over time based on an analog envelope signal corresponding to an envelope of the RF signal amplified by the power amplifier, and a modulator output filter coupled between an output of the MLS modulator and the power amplifier supply voltage.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: January 11, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Florinel G. Balteanu, Serge Francois Drogi, Shayan Farahvash, David Richard Pehlke
  • Multi-level envelope tracking systems with adjusted voltage steps
    Patent number: 11223325
    Abstract: Multi-level envelope tracking systems with adjusted voltage steps are provided. In certain embodiments, an envelope tracking system for generating a power amplifier supply voltage for a power amplifier is provided. The envelope tracking system includes a multi-level supply (MLS) DC-to-DC converter that outputs multiple regulated voltages, an MLS modulator that controls selection of the regulated voltages over time based on an envelope signal corresponding to an envelope of a radio frequency (RF) signal amplified by the power amplifier, and a modulator output filter coupled between an output of the MLS modulator and the power amplifier supply voltage. The envelope tracking system further includes a switching point adaptation circuit configured to control the voltage level of the regulated voltages outputted by the MLS DC-to-DC converter based on a power level of the RF signal.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: January 11, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Serge Francois Drogi, Florinel G. Balteanu
  • Multi-level envelope tracking systems with separate DC and AC paths
    Patent number: 11223323
    Abstract: Multi-level envelope tracking systems with separate DC and AC paths are provided. In certain embodiments, an envelope tracking system for generating a power amplifier supply voltage for a power amplifier is provided. The envelope tracking system includes a multi-level supply (MLS) DC-to-DC converter that outputs multiple regulated voltages, an MLS modulator that controls selection of the regulated voltages over time based on an envelope signal corresponding to an envelope of a radio frequency (RF) signal amplified by the power amplifier, an AC path filter coupled between an output of the MLS modulator and the power amplifier supply voltage, and a DC path filter coupled between a DC voltage and the power amplifier supply voltage.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: January 11, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Serge Francois Drogi, Florinel G. Balteanu
  • Moisture barrier for bond pads and integrated circuit having the same
    Patent number: 11222855
    Abstract: A semiconductor die includes a substrate layer, one or more metal layers disposed over the substrate layer, and a pair of polyimide layers disposed over the substrate so that they define an interface therebetween. One or both of the pair of polyimide layers have a trench that separates the interface from the one or more metal layers. The trench can be formed by etching the polyimide layer(s). A topcoat insulation layer is disposed over the one or more metal layers and polyimide layers. The topcoat insulation layer is impervious to moisture and the trench inhibits migration of moisture along the interface to the one or more metal layers, thereby preventing metal migration from the one or more metal layers along the interface.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 11, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jiro Yota, Shiban Kishan Tiku
  • Fast ramping power amplifier boost converter
    Patent number: 11218116
    Abstract: A power management integrated circuit (PMIC) can improve the ramp up speed of a boost converter with the inclusion of a controllable switch that may modify the connection of an output capacitor to reduce the ramp time as the output voltage is ramping to a desired boost setpoint. The switch may be controlled using jump start logic to switch a first plate or terminal of the output capacitor from a ground connection to a voltage supply connection. Once a threshold voltage is reached, the first plate of the capacitor may be switched from the supply voltage to ground. The PMIC may further include a quick start assembly that can drive the boost converter at a high duty-cycle.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: January 4, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Wendy Ng, James Jason LoCascio
  • Devices and methods for layout-dependent voltage handling improvement in switch stacks
    Patent number: 11217581
    Abstract: Devices and methods for layout-dependent voltage handling improvement in switch stacks. In some embodiments, a switching device can include a first terminal and a second terminal, a radio-frequency signal path implemented between the first terminal and the second terminal, and a plurality of switching elements connected in series to form a stack between the second terminal and ground. The stack can have an orientation relative to the radio-frequency signal path, and the switching elements can have a non-uniform distribution of a first parameter based in part on the orientation of the stack.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: January 4, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Guillaume Alexandre Blin, Ambarish Roy, Seungwoo Jung
  • Soft-start for isolated power converter
    Patent number: 11218077
    Abstract: Current flowing through an inductor on a primary side of a voltage converter is sensed and compared to a threshold peak current value to determine when to end an ON portion of the voltage converter. The secondary side of the voltage converter supplies an indication of output voltage for use in determining the threshold peak current value. On start-up the primary side detects when the indication of output voltage is supplied by the secondary side across on isolation channel. Prior to detecting the indicating is being supplied, the primary side uses an increasing threshold peak current as the threshold peak current value. After detection that the indication of output voltage is being provided by the secondary side, the threshold peak current value is based on the indication of the output voltage.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: January 4, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Riad S. Wahby, Jeffrey L. Sonntag, Tufan C. Karalar, Michael J. Mills, Eric B. Smith, Ion C. Tesu, Donald E. Alfano