Abstract: A method for producing a matrix of electromagnetic radiation detectors made up of a plurality of elementary detection modules mounted on an interconnection substrate. The method includes depositing on the interconnection substrate a predefined number of quantities of solder or hybridization material, intended to constitute hybridization bumps for the elementary modules, in at least a first array for the nominal hybridization, and at least one second array, with the deposits of solder or hybridization material of the second array being lower in volume than those of the first array, depositing a liquid flux on the interconnection substrate, mounting the elementary modules to be hybridized on the interconnection substrate, and raising the temperature of a chamber in which the various elements to be hybridized are positioned until reaching at least the melting point of the solder or hybridization material to join the modules and interconnection substrate together by reflow effect.

Abstract: Disclosed is a method for producing an array for detecting electromagnetic radiation, the array including a elementary detection modules mounted on an interconnect substrate, the modules comprising at least one circuit for detecting the radiation, connected to a read circuit by hybridization, the read circuits being attached to the interconnect substrate, the method including making, on the rear face of read circuit of each of the elementary modules grooves or slots, and areas without such grooves or slots; mounting, on the front face of the interconnect substrate, and on the front face of the detection circuit, registration features that ensure accurate positioning of each of the elementary modules on the interconnect substrate; pressing each elementary module onto the interconnect substrate after positioning; ensuring migration of the adhesive through grooves or slots; raising the temperature of the chamber used to produce the array to cure of the adhesive.

Abstract: The acquisition circuit comprises a second and third electronic switch connected in series between a photodetector and a first input terminal of an amplifier. A reference voltage is applied to a second input terminal of the amplifier, the reference voltage being applied between the photodetector and the second electronic switch by means of a fourth electronic switch. An integration capacitor and a first electronic switch are connected in parallel between the first input terminal and an output terminal of the amplifier. A buffer capacitor is connected between a common terminal of the second and third electronic switches and a secondary voltage. The electrical capacitance of the buffer capacitor is at least equal to that of the integration capacitor.

Abstract: A device for reading electric currents including a capacitive element to integrate the current, the terminals of the capacitive element being connected to the mass and to an output branch of the device respectively, and a differential pair including: a first transistor mounted between the input branch of the input stage and the capacitive element, the transistor being controlled by a polarized impulse voltage, capable of putting the first transistor alternately into the off state and then into the on state; and a second transistor mounted between the input branch of the input stage and a potential other than that of the capacitive element, said transistor also being controlled by a polarized impulse voltage, capable of putting the second transistor alternately into the off state and then into the on state, wherein the second transistor is mounted in phase opposition relative to the first transistor.

Abstract: The invention relates to a device for reading electronic charges, comprising an input for receiving the electronic charges, at least one capacitor for storing the electronic charges and at least one circuit based on MOS transistors, whereof the maximum operating voltage determines the maximum voltage at the terminals of the at least one capacitor (20, 38), and wherein the or each MOS transistor-based circuit is constituted by cascode-mounted transistors.

Abstract: This method for producing an array for detecting electromagnetic radiation comprises a plurality of elementary detection modules 2 mounted on an interconnect substrate, said modules 2 themselves comprising at least one circuit 4 for detecting said radiation, connected to a read circuit 3 by hybridization, said read circuits themselves being attached to the interconnect substrate, involves: making, on the rear face 15 of read circuit 3 of each of the elementary modules 2: grooves or slots 16, and areas 17 without such grooves or slots; mounting, firstly on the front face of the interconnect substrate, and secondly on the front face of the detection circuit, registration features 12, designed to ensure accurate positioning, especially on the X and Y axes, of each of the elementary modules 2 on said interconnect substrate; bringing about pressing of each of elementary modules 2 onto the interconnect substrate after positioning of said modules; ensuring migration of the adhesive through grooves or slots 1

Abstract: A method for producing a matrix of electromagnetic radiation detectors made up of a plurality of elementary detection modules mounted on an interconnection substrate. The method includes depositing on the interconnection substrate a predefined number of quantities of solder or hybridization material, intended to constitute hybridization bumps for the elementary modules, in at least a first array for the nominal hybridization, and at least one second array, with the deposits of solder or hybridization material of the second array being lower in volume than those of the first array, depositing a liquid flux on the interconnection substrate, mounting the elementary modules to be hybridized on the interconnection substrate, and raising the temperature of a chamber in which the various elements to be hybridized are positioned until reaching at least the melting point of the solder or hybridization material to join the modules and interconnection substrate together by reflow effect.

Abstract: This device for producing the growth of a semiconductor material, in particular of type II-VI, uses a melt of the said semiconductor placed in a sealed bulb under vacuum or under controlled atmosphere, the said bulb being subjected to a sufficient temperature gradient for first maintaining the melt in the liquid state, then causing its progressive crystallization from the surface towards the bottom. The said device further comprises an element (3) capable of floating on the surface of the said melt, and equipped with a substantially central bore (4), intended on the one hand for receiving a seed crystal (5) or for permitting the nucleation leading to the preparation of a seed crystal (5?), and also of supporting the said seed crystal (5, 5?) above the melt while maintaining it in contact with the said melt in order to permit the continued crystallization from the said seed crystal (5, 5?) by lowering the temperature gradient.

Abstract: A device for detecting electromagnetic radiations implements a detection circuit associated with a reading circuit. The detection circuit includes an array of detection pixels, each comprising a thermal detector of biased bolometric type, and delivering an electric current signal representative of detected radiation. The signal undergoes a double baselining, respectively: a global baselining carried out by means of a thermally isolated bolometer, ensuring extraction from the signal, of a first current of constant value inherent to the biasing of the thermal detector, and an adaptive baselining specific to each of the pixels, carried out by a programmable current generator generating a current for subtraction from the current signal, as a function of the dispersion inherent to the pixel considered relative to a reference signal and stored in an associated memory integrated at the level of each of the pixels.

Abstract: An electrical or electronic component with sealed encapsulation includes a support for housing one or more electrical or electronic components from which electrically conducting tracks radiate towards a periphery of the support. Also included is a protective and sealing casing attached to the support and hermetically sealed with respect to the latter by a peripheral metal bead. A main part of the casing is intended to be placed opposite the support which is provided with hollow conducting elements passing through the thickness of the casing. Electrically conducting metal tracks radiate from external upper ends of the elements towards the periphery of the casing and the internal lower end of the elements are connected to at least one electrical connection track provided on the support via a metal hybridization ball.

Abstract: This electrical or electronic component with sealed encapsulation comprises:

Abstract: This electrical or electronic component with sealed encapsulation comprises: a support (1) intended to house one or more electrical or electronic components (5) from which electrically conducting tracks (6) radiate towards the periphery of the said support; and a protective and sealing casing (2) attached to the said support and hermetically sealed with respect to the latter by means of a peripheral metal bead (7), the main part of the casing, intended to be placed opposite the said support (1), being provided with hollow conducting elements (3) which pass right through the thickness of the said casing, and from the external upper end of which elements (3) electrically conducting metal tracks (9) radiate towards the periphery of the casing, the internal lower end of which elements (3) being connected to at least one electrical connection track (6) provided on the said support via a metal hybridization ball (8).

Abstract: An electromagnetic detection unit for detecting infrared radiation having an electronic detection circuit with a readout joined thereto by indium microspheres, and further having a thermally conducting support, affixed to a cold source, having a good thermally conducting intermediary component located thereon and fastened to a detection unit by adhesive bonding and to the support by adhesive or brazing wherein the dimensions of the elements of the intermediary component are selected to compensate for the intrinsic effects of differential expansion of each of the constituent materials.

Abstract: Production process for the reversible assembly of an electronic read and/or operating circuit board having a front face with conductive tracks and a rear face which is metallized and an electrically conductive or nonconductive support or substrate which may include metallized conductive tracks. The assembly is achieved by use of an electrically insulating silicone adhesive layer. A conductive foil is interposed between the rear face of the circuit board and the adhesive layer and is connected to a terminal in the support.

Abstract: A low temperature infrared detector for use in a cryostat having a cold finger. A cold plane is mounted upon the cold finger in heat transfer relationship therewith. A read circuit board is mounted upon the cold plane and a detector circuit board is placed over the read circuit and is connected thereto both electrically and thermally. A screen is fitted over the detector circuit board. The screen has a shoulder formed in its bottom wall into which the detection board is press-fitted and a window that frames the detecting circuitry through which the circuitry can be viewed by an IR source. Preferably, the screen is produced using electroforming techniques.