Patents Assigned to Solid State System Co., Ltd.
  • Publication number: 20200385263
    Abstract: A package structure of micro-electro-mechanical-system microphone includes a ceramic packaging substrate, embedded with a first circuit route, wherein the first circuit route includes a first metal sealing ring on a surface of the ceramic packaging substrate. An integrated circuit is disposed on the surface of the ceramic packaging substrate. A MEMS microphone die is disposed on the surface of the ceramic packaging substrate, wherein the MEMS microphone die is electrically connected to the integrated circuit. A cap structure is disposed on the first metal sealing ring of the ceramic packaging substrate, wherein the cap structure has a second metal sealing ring on a surface of the cap structure, wherein the second metal sealing ring is disposed on the first metal sealing ring, so that the cap structure covers on the ceramic packaging substrate.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 10, 2020
    Applicant: Solid State System Co., Ltd.
    Inventors: Chien-Hsing Lee, Tsung-Min Hsieh
  • Patent number: 10841710
    Abstract: A package structure of MEMS microphone is provided. The MEMS microphone includes a MEMS microphone chip disposed on a circuit board. The MEMS microphone chip comprises a first bonding pad, including a metal pad on a top of the MEMS microphone chip; and a protection layer fully enclosing a sidewall of the metal pad and also partially disposed on a top of the metal pad. A circuit chip is disposed on the circuit board, wherein the circuit chip comprises a second bonding pad. A bonding wire is connected between the first bonding pad and the second bonding pad.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 17, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Chien-Hsing Lee, Tsung-Min Hsieh, Cheng-Wei Tsai
  • Patent number: 10798493
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: October 6, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 10728674
    Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: July 28, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Publication number: 20200068317
    Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
    Type: Application
    Filed: August 27, 2018
    Publication date: February 27, 2020
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Patent number: 10390145
    Abstract: A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: August 20, 2019
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Cheng-Wei Tsai, Chien-Hsing Lee
  • Publication number: 20190124452
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Application
    Filed: December 18, 2018
    Publication date: April 25, 2019
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 10250998
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: April 2, 2019
    Assignee: Solid State Systems Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Publication number: 20180115836
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Application
    Filed: October 26, 2016
    Publication date: April 26, 2018
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 9955268
    Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: April 24, 2018
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai, Jhyy-Cheng Liou
  • Publication number: 20160360417
    Abstract: A mobile storage device with access control includes a portable storage device and an access control device. The access control device has a non-volatile memory for storing an access-control setting information. If the access-control setting information has already been set with required parameters and when the portable storage device with the access control device is connected to a master equipment, the portable storage device is automatically switched to a secured private zone for the master equipment to access the secured private zone. Further, an agreement to recognize the access-control setting information is made in each time of access if the access control device requires the agreement.
    Type: Application
    Filed: August 22, 2016
    Publication date: December 8, 2016
    Applicant: Solid State System Co., Ltd.
    Inventors: Tai-Yao Lee, Ting-Chung Hu
  • Patent number: 9321635
    Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.
    Type: Grant
    Filed: November 28, 2013
    Date of Patent: April 26, 2016
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Patent number: 9271087
    Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: February 23, 2016
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Chih-Hsien Chung, Yong-Wei Chen, Jhyy-Cheng Liou
  • Patent number: 9264832
    Abstract: A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 16, 2016
    Assignee: Solid State System Co., Ltd.
    Inventors: Cheng-Wei Tsai, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Patent number: 9126827
    Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: September 8, 2015
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Publication number: 20150147841
    Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.
    Type: Application
    Filed: November 28, 2013
    Publication date: May 28, 2015
    Applicant: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Publication number: 20150118780
    Abstract: A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
    Type: Application
    Filed: October 30, 2013
    Publication date: April 30, 2015
    Applicant: Solid State System Co., Ltd.
    Inventors: Cheng-Wei Tsai, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Patent number: 8987842
    Abstract: A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The structural dielectric layer has a space above the cavity of the silicon substrate and holds a plurality of structure elements within the space, including: a conductive backplate, over the silicon substrate, having a plurality of venting holes and a plurality of protrusion structures on top of the conductive backplate; and a diaphragm, located above the conductive backplate by a distance, wherein a chamber is formed between the diaphragm and the conductive backplate, and is connected to the cavity of the silicon substrate through the venting holes. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate and a second side of the diaphragm is exposed to an environment space.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 24, 2015
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Patent number: 8934649
    Abstract: A MEMS device includes substrate having a cavity. A dielectric layer is disposed on a second side of substrate at periphery of the cavity. A backplate structure is formed with the dielectric layer on a first side of the substrate and exposed by the cavity. The backplate structure includes at least a first backplate and a second backplate. The first backplate and the second backplate are electric disconnected and have venting holes to connect the cavity and the chamber. A diaphragm is disposed above the backplate structure by a distance, so as to form a chamber between the backplate structure and the diaphragm. A periphery of the diaphragm is embedded in the dielectric layer. The diaphragm serves as a common electrode. The first backplate and the second backplate respectively serve as a first electrode unit and a second electrode unit in conjugation with the diaphragm to form separate two capacitors.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: January 13, 2015
    Assignee: Solid State System Co., Ltd.
    Inventors: Chien-Hsing Lee, Tsung-Min Hsieh, Jhyy-Cheng Liou
  • Patent number: 8823388
    Abstract: A calibration circuit and a calibration method are provided. The calibration circuit has a delay circuit, a phase detector, and a controller. The delay circuit delays an input signal to output an output signal, wherein a delay time between the input signal and the output signal is related to an equivalent capacitance and an equivalent resistance of the delay circuit. The phase detector coupled to the delay circuit compares the phases of the input signal and the output signal. The controller coupled to the delay circuit and the phase detector generates a control signal according to the comparison result of the phase detector to adjust the equivalent resistance of the delay circuit.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: September 2, 2014
    Assignee: Solid State System Co., Ltd.
    Inventor: Yu-Wei Lin