Patents Assigned to Sony Chemical & Information Device Corporation
  • Patent number: 8773624
    Abstract: A thin image display apparatus capable of high luminance and high contrast display of a display part, which does not produce display defects resulting from deformation of the image display part. The thin image display apparatus has an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the image display part and the protective part. The cured resin layer has a transmittance in the visible region of 90% or higher and a storage modulus at 25° C. of 1.0×107 Pa or less. The cured resin layer is formed from a resin composition which has a curing shrinkage ratio of 5.0% or less.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: July 8, 2014
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yoshihisa Shinya, Yusuke Kamata
  • Publication number: 20140147662
    Abstract: A high-hardness hard coat film having a reduced degree of curling and an ionizing ray polymerizable resin composition for forming the hard coat layer of such a hard coat film are provided. The hard coat film includes a resin film and a hard coat layer disposed on the surface of the resin film. The hard coat layer is formed of a cured product of a photopolymerizable composition containing an acrylic component, a hyperbranched acrylate resin, a silicone component, and silica particles. The cured product is produced by exposure to ionizing rays.
    Type: Application
    Filed: February 3, 2014
    Publication date: May 29, 2014
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Kentaroh ISHIKAWA, Ikuo KAKEFUDA, Shinichi MATSUMURA
  • Patent number: 8715833
    Abstract: A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: May 6, 2014
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasunobu Yamada, Yasushi Akutsu, Kouichi Miyauchi
  • Publication number: 20140103266
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.
    Type: Application
    Filed: December 19, 2013
    Publication date: April 17, 2014
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu NAMIKI, Shiyuki KANISAWA, Hideaki UMAKOSHI
  • Patent number: 8686108
    Abstract: An aluminum chelate latent curing agent is configured such that an aluminum chelating agent and a specific arylsilane compound or a hydrolysate thereof are held in a polymer obtained by subjecting the aluminum chelating agent, the arylsilane compound, and a polyfunctional isocyanate compound to an emulsifying treatment, and then subjecting the polyfunctional isocyanate to interfacial polymerization. The aluminum chelating agent does not have an alkoxy group bonded to the aluminum. The arylsilane compound is a compound represented by the formula (A). (Ar)mSi(OR)n ??(A) In the formula (A), m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group. R represents a hydrogen atom, a methyl group, or an ethyl group. When n is two, the two Rs may be the same or different.
    Type: Grant
    Filed: July 5, 2010
    Date of Patent: April 1, 2014
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Kazunobu Kamiya
  • Patent number: 8670094
    Abstract: A thin image display apparatus capable of high luminance and high contrast display of a display part, which does not produce display defects resulting from deformation of the image display part. The thin image display apparatus has an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the image display part and the protective part. The cured resin layer has a transmittance in the visible region of 90% or higher and a storage modulus at 25° C. of 1.0×107 Pa or less. The cured resin layer is formed from a resin composition which has a curing shrinkage ratio of 5.0% or less.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: March 11, 2014
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yoshihisa Shinya, Yusuke Kamata
  • Patent number: 8613623
    Abstract: A radical-polymerizable acrylic insulating adhesive for NCF-bonding an electronic part to a circuit board includes a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The amount of the inorganic filler is 70 to 160 parts by mass with respect to a total of 100 parts by mass of the (meth)acrylate monomer and the film-forming resin. A radical polymerization cured product of the acrylic insulating adhesive exhibits a glass transition temperature of 150 to 185° C., a linear expansion coefficient (?1) of 30 to 35 ppm in a temperature range that is lower than the glass transition temperature, and a linear expansion coefficient (?2) of 105 to 125 ppm in a temperature range that is equal to or higher than the glass transition temperature. Further, ?2/?1 is greater than or equal to 3.4.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: December 24, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Daisuke Sato
  • Publication number: 20130126789
    Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.
    Type: Application
    Filed: January 2, 2013
    Publication date: May 23, 2013
    Applicant: Sony Chemical & Information Device Corporation
    Inventor: Sony Chemical & Information Device Corporation
  • Patent number: 8444882
    Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: May 21, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Shiyuki Kanisawa, Hiroyuki Kumakura, Hidetsugu Namiki
  • Patent number: 8445621
    Abstract: A novel polyimide resin is formed by imidizing a diamine component including an amide group-containing siloxane diamine compound represented by the following formula (1) and an acid dianhydride component including an aromatic acid dianhydride such as 3,3?,4,4?-diphenylsulfone tetracarboxylic dianhydride. This novel polyimide resin utilizes a novel polyimide resin into which a reaction group capable of reacting with a crosslinking agent to form a crosslinking point is pre-introduced before imidization. The novel polyimide resin can confer a comparatively low elastic modulus and heat resistance to a dry film or a photosensitive cover film formed from a photosensitive polyimide resin composition containing the novel polyimide resin. In the formula (1), R1 and R2 are each independently an optionally-substituted alkylene group, m denotes an integer of 1 to 30, and n denotes an integer of 0 to 20.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: May 21, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Tomoyasu Sunaga, Hiroki Kanaya, Mamiko Nomura, Junichi Ishii
  • Publication number: 20130113365
    Abstract: To provide a coated phosphor having good phosphor characteristics that can maintain light emitting characteristic for a long period of time. A mixing process is prepared in which a phosphor and aluminum alkoxide are mixed in a solvent so that the phosphor is coated with an aluminum oxide formed from the aluminum alkoxide, and the phosphor contains Group II element (M), europium (Eu), silicon (Si) and oxygen (O) in atomic weight ratios represented by the following composition formula (1): [(M)1-xEux]aSibOc ??Composition Formula (1) In the composition formula (1), a, b, c and x satisfy relationships: 1.8<a<3.3; 0.9<b<1.1; 3.6<c <5.5; and 0<x<0.09.
    Type: Application
    Filed: September 21, 2012
    Publication date: May 9, 2013
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Sony Chemical & Information Device Corporation
  • Publication number: 20130105841
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.
    Type: Application
    Filed: April 20, 2011
    Publication date: May 2, 2013
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
  • Patent number: 8432516
    Abstract: An image display device has an image display part and a protective part on the image display part. The image display device suppresses image unevenness and cured resin peeling caused by internal stress generated due to curing shrinkage of a cured resin between the protective part and the image display part or external stress applied on the image display part due to warping of the protective part. A cured resin layer is arranged between the image display part and the protective part. The cured resin layer has a light transmittance in the visible region of 90% or more, an elongation ratio of 700% or more at 25° C. and 400% or more at 80° C., and an adhesive force with respect to the protective part of 0.4 N/cm or more at 25° C. and 0.3 N/cm or more at 80° C.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: April 30, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki Toyoda, Yoshihisa Shinya, Yusuke Kamata
  • Patent number: 8431654
    Abstract: An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: April 30, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yoshihisa Shinya, Jun Yamamoto, Ryota Aizaki, Naoki Hayashi, Misao Konishi
  • Patent number: 8415706
    Abstract: An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: April 9, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Hideaki Umakoshi
  • Patent number: 8415195
    Abstract: In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: April 9, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Hideaki Okumiya, Satoshi Yamamoto, Masao Saito
  • Patent number: 8409932
    Abstract: A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: April 2, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasuhiro Suga, Kazunori Hamazaki
  • Patent number: 8402645
    Abstract: A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: March 26, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Masaki Taniguchi, Kazutaka Furuta
  • Publication number: 20130056686
    Abstract: To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan ? in a viscoelastic spectrum and a value of the tan ? at ?40° C. thereof is 0.1 or more.
    Type: Application
    Filed: April 13, 2011
    Publication date: March 7, 2013
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Akira Ishigami, Hideaki Umakoshi, Shiyuki Kanisawa
  • Publication number: 20130055298
    Abstract: An information recording medium excellent in long storage and capable of high-density recording, method of manufacturing the information recording medium, and information recording material are provided. Pulse laser light is focused onto a recording layer in which a thermosetting epoxy resin having a skeleton with high planarity and a curing agent are polymerized to form a recording mark. With a molecular weight between cross-linking points of a cured material of the recording layer being set to be equal to or smaller than 2000 and, more preferably, equal to or smaller than 500, a distance between recording marks (cavities) can be shortened.
    Type: Application
    Filed: June 9, 2011
    Publication date: February 28, 2013
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Kouki Hatsuda, Kyungsung Yun