Patents Assigned to Sony Chemical & Information Device Corporation
  • Patent number: 8309224
    Abstract: There is disclosed a conductive particle used for an anisotropic conductive connection material for establishing conductive interconnection between e.g. a substrate and an electrical component. The conductive particle includes a base particle (2) exhibiting electrical conductivity at least on its surface and a continuous insulating resin film (3) formed by welding of fine particles (3a) of an insulating resin that composes the resin film. The surface of the base particle is coated with the continuous insulating resin film. There are formed voids at least between neighboring fine particles.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: November 13, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasushi Akutsu, Hidetsugu Namiki
  • Patent number: 8309638
    Abstract: To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: November 13, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Tomoyuki Ishimatsu
  • Publication number: 20120279653
    Abstract: To improve the tact time of a heating apparatus, provided is a heating apparatus comprising a first pressing member that heats a heating target; a second pressing member that includes an elastic body, and sandwiches the heating target between the first pressing member and the elastic body; and a floating jig that thermally separates the first pressing member from the heating target, holds the heating target between the first pressing member and the second pressing member, and when one of the first pressing member and the second pressing member presses the heating target toward the other of the first pressing member and the second pressing member, thermally connects the heating target and the first pressing member.
    Type: Application
    Filed: July 19, 2012
    Publication date: November 8, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Takashi MATSUMURA
  • Publication number: 20120281376
    Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.
    Type: Application
    Filed: December 20, 2010
    Publication date: November 8, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Taichi Koyama, Hironobu Moriyama, Takashi Matsumura, Takayuki Saito
  • Publication number: 20120279781
    Abstract: To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.
    Type: Application
    Filed: July 19, 2012
    Publication date: November 8, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Hiroki Ozeki, Tomoyuki Ishimatsu, Reiji Tsukao
  • Patent number: 8296939
    Abstract: Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device 100 includes a lower pressurizing section 102 as a first pressurizing section and an upper pressurizing section 104 as a second pressurizing section, and pressurizes a substrate, a plurality of electronic components, and the like, sandwiched between the lower pressurizing section 102 and the upper pressurizing section 104, thereby mounting the substrate to the plurality of electronic components. The lower pressurizing section 102 or the upper pressurizing section 104 includes a dilatancy fluid 116.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: October 30, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Kazutaka Furuta
  • Patent number: 8295786
    Abstract: The present invention provides a magnetic sheet with improved resistance to folding while maintaining good magnetic characteristics and reliability; a method for producing the magnetic sheet; an antenna; and a portable communication device. A magnetic sheet of the present invention includes a flat magnetic powder, and a resin binder capable of dissolving in a solvent, wherein the magnetic sheet has a gradient of the content ratio of the magnetic powder to the resin binder in a thickness direction thereof, wherein, in use, the magnetic sheet is folded so that, of the front and back surfaces thereof, one surface whose magnetic powder content is lower than that of the other is folded inward, and wherein the difference in glossiness measured at a light-incident angle of 60° between the front and back surfaces is 9.4 or more.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: October 23, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Keisuke Aramaki, Junichiro Sugita, Morio Sekiguchi
  • Publication number: 20120262931
    Abstract: An anisotropic conductive adhesive including conductive particles dispersed in an epoxy-based adhesive containing an epoxy compound and a curing agent gives a cured product having the elastic modulus satisfying the expressions (1) to (5), in which EM35, EM55, EM95, and EM150 are values of the elastic modulus of the cured product at 35° C., 55° C., 95° C., and 150° C., respectively, ?EM55-95 is the rate of change in the elastic modulus between 55° C. and 95° C., and ?EM95-150 is the rate of change in the elastic modulus between 95° C. and 150° C., 700 MPa?EM35?3000 MPa??(1) EM150<EM95<EM55<EM35??(2) ?EM55-95<?EM95-150??(3) 20%??EM55-95??(4) 40%??EM95-150??(5).
    Type: Application
    Filed: January 15, 2010
    Publication date: October 18, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Genki Katayanagi
  • Publication number: 20120263956
    Abstract: A display having high re-workability, a method for producing the display, and a transparent resin filler, are provided. A transparent resin filler (5), in which a value obtained on multiplying a hardness of an as-cured resin, expressed as Shore E, with a bonding strength, is not greater than 400, is used as a material of a transparent resin layer (4) to be charged between a picture image display panel (2) and a front side panel (3). In case an undesirable situation, such as mixing of foreign matter in the transparent resin layer (4), has occurred, a re-working member may be moved with ease through a space between the picture image display panel (2) and the front side panel (3) to separate picture image display panel (2) and the front side panel (3) from each other.
    Type: Application
    Filed: October 16, 2009
    Publication date: October 18, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Yuki Watanabe, Yoshihisa Shinya, Kenji Kamiya
  • Publication number: 20120263964
    Abstract: The present invention prevents air bubbles from being mixed in at the time of resin filling. In a supplying step (FIGS. 5D, 5E), a transparent resin filler is dispensed and supplied from supply means so that the transparent resin filler comes into contact with both of an image display panel and a front panel to draw a predetermined pattern, and the transparent resin filler is maintained in contact with both of the panels until drawing of the predetermined pattern is completed.
    Type: Application
    Filed: October 12, 2010
    Publication date: October 18, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Tomoyuki Toyoda, Yoshihisa Shinya, Yasumi Endo
  • Publication number: 20120261171
    Abstract: To provide an anisotropic conductive film, which contains: an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent, wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni.
    Type: Application
    Filed: June 27, 2012
    Publication date: October 18, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Yasunobu YAMADA, Koichi Miyauchi
  • Publication number: 20120255766
    Abstract: In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.
    Type: Application
    Filed: June 3, 2011
    Publication date: October 11, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Satoshi Igarashi
  • Publication number: 20120248495
    Abstract: A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition.
    Type: Application
    Filed: May 27, 2011
    Publication date: October 4, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hideaki Umakoshi, Hidetsugu Namiki, Akira Ishigami, Masaharu Aoki, Shiyuki Kanisawa, Yoshihisa Shinya
  • Publication number: 20120249283
    Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position, enabling a speedy and precise blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to a power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. In addition, the protection element is provided with a protrusive stripe portion 20 which is formed on an interior face of the insulation cover 14 in opposite to the soluble conductor 13 and in which a stepped portion 20a for retaining the flux 19 is formed at a predetermined position while in contact with the flux 19.
    Type: Application
    Filed: January 14, 2010
    Publication date: October 4, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Yuji Kimura, Takahiro Asada, Kazuaki Suzuki
  • Publication number: 20120247644
    Abstract: A bonding device for charging a liquid material into a space between plate-shaped members for bonding them together in situ, in which the liquid material may be prevented from exuding from the space between the plate-shaped members. The bonding device includes pair retaining base members for retaining the pair plate-shaped members facing each other, and a retaining base member movement unit for causing movement of the retaining base members towards and away from each other. The bonding device also includes an illumination unit that illuminates curing light to a photo-curable liquid material charged between the pair plate-shaped members held by the pair retaining base members, and a sensor that detects the wetting spreading state of the liquid material charged between the pair plate-shaped members.
    Type: Application
    Filed: October 4, 2010
    Publication date: October 4, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hiroyuki Usui, Yoshihisa Shinya, Yasumi Endo
  • Publication number: 20120247683
    Abstract: In an apparatus for charging and coating a liquid material into a gap between plate-shaped members with an emission nozzle, damages to the plate-shaped members by contact with the emission nozzle, drooping of the liquid material or a decreased coating speed is to be prevented. To this end, the apparatus includes a plurality of holding members (4, 5) for holding a plurality of plate-shaped members (2, 3) so that the major surfaces of the plate-shaped members (2, 3) will face each other, and a movement member (6) for causing movement of the holding members (4, 5) towards and away from each other. The apparatus also includes an emission nozzle (10) introduced into a gap defined between the plate-shaped members (2, 3), held for facing each other, to emit a charging liquid material (7) into the gap.
    Type: Application
    Filed: September 3, 2010
    Publication date: October 4, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Tadakazu Matsumoto, Yukio Suyama, Hiroyuki Usui, Yoshihisa Shinya, Yasumi Endo
  • Patent number: 8273207
    Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: September 25, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Tomoyuki Ishimatsu, Daisuke Sato, Hiroki Ozeki
  • Publication number: 20120227248
    Abstract: A method for manufacturing an antenna device may include a first step of forming an antenna circuit so that the resonance frequency of the antenna circuit will be lower than an oscillation frequency of the reader/writer. The antenna circuit includes an antenna coil that receives the magnetic field transmitted from the reader/writer and a capacitor electrically connected to the antenna coil. The manufacturing method also includes a second step of affixing a magnetic sheet to the antenna coil via an adhesive. The magnetic sheet is at a face-to-face position with respect to the antenna coil and is configured to change the inductance of the antenna coil. The adhesive is of a film thickness to change the inductance so that the resonance frequency of the resonance circuit will be coincident with the oscillation frequency depending on the spacing between the antenna coil and the magnetic sheet.
    Type: Application
    Filed: February 3, 2012
    Publication date: September 13, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Katsuhisa Orihara, Satoru Sugita, Norio Saito, Masayoshi Kanno
  • Publication number: 20120228026
    Abstract: An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): R1 is a hydrogen atom or a methyl group; R2 is an alkylene group or an alkyloxy group; R3 is an alkyl group, an alkylene group, an aryl group, or a halogen atom; n is an integer of 0 to 3; R4 is absent or an alkylene, dotted lines on both sides of R4 jointly represent a single bond; X1 is absent, or an oxygen atom or a carbon atom; and X2 is an oxygen atom, a nitrogen atom, or a sulfur atom.
    Type: Application
    Filed: July 19, 2011
    Publication date: September 13, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Yasushi Akutsu, Kouichi Sato, Shigeyuki Yoshizawa
  • Publication number: 20120229947
    Abstract: A charging apparatus that may be applied to a process of bonding a large-sized plate-shaped member as air bubbles is prevented from mixing. A charging apparatus includes a plurality of holding members (4, 5) for holding a pair of plate-shaped members (2, 3) in a state the major surface of the paired plate-shaped members (2, 3) will face each other, and a movement member (6) that causes the holding members (4, 5) to be moved towards and away from each other. The charging apparatus also includes an emission nozzle (10) adapted to be introduced between the plate-shaped members (2, 3), arranged facing each other, to emit a charging liquid (7) into the gap between the plate-shaped members (2, 3). The charging apparatus also includes a nozzle movement unit (11) for causing movement of the emission nozzle (10) in an in-plane direction of the plate-shaped members (2, 3).
    Type: Application
    Filed: September 3, 2010
    Publication date: September 13, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Yoshihisa Shinya, Yasumi Endo, Yukio Suyama