Abstract: The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4?-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent. The aluminum chelator is preferably a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.

Abstract: A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

Abstract: An electrochemical cell, and a method of producing an electrochemical cell are provided. The method includes a step in which a counter electrode film and a mold film are crimped. A sol-gel precursor is inserted into a pore in the mold film provided on the counter electrode film. The sol-gel precursor is cooled to form a semi-hardened gel. The mold film is peeled off from the counter electrode film. The semi-hardened gel is cooled to form a gel electrolyte film. The sealing film is provided on the counter film, with the gel electrolyte film being fitted in the pore of the sealing film. A working electrode film is crimped on the sealing film. The stacked films are thermocompression bonded, and a single electrochemical cell is produced by cutting.

Abstract: To provide both an excellent solvent-resistance and a conduction reliability to an insulation coated conductive particle that is suitable for use as a conductive particle in an anisotropic conductive adhesive, the insulation coated conductive particle is configured such that the surface of a conductive particle is coated with an insulating resin layer formed of an insulating resin having a carboxyl group, and the insulating resin layer is surface-treated with a polyfunctional aziridine compound. Examples of the aziridine compound include trimethylolpropane-tri-?-aziridinylpropionate, tetramethylolmethane-tri-?-aziridinylpropionate, and N,N-hexamethylene-1, 6-bis-1-aziridinecarboxamide. The insulating resin layer is preferably composed of an insulating resin having an acrylic acid monomer unit or a methacrylic acid monomer unit. Specifically, the preferable insulating resin is an acrylic acid-styrene copolymer.

Abstract: A transmission cable includes multiple signal lines formed on one side of an insulation layer and a ground line between the signal lines. The ground line is electrically connected to a shield layer formed on a back surface side of the insulation layer and to a noise suppressing layer having a high electric resistance value than the shield layer via a metal bump embedded and formed in the insulation layer. The noise suppressing layer has a function to suppress an unwanted emission and/or a noise and has a function as an etching barrier layer serving as an etching stopper in a step for forming the metal bump. Thus, the transmission cable can suppress an increase of an electric resistance and a connection resistance between the ground line and the shield layer.

Abstract: An adhesive film is provided that can ensure reliable continuity even if a filler and a binder composition are not sufficiently removed from between a wiring board and a semiconductor chip during flip-chip mounting of the semiconductor chip. The adhesive film is formed from a binder composition including an epoxy compound, a curing agent, and the filler. The amount of a filler contained with respect to a total amount of an epoxy compound, a curing agent, and the filler is 10 to 70 mass %. The filler includes first non-conductive inorganic particles having an average particle size of 0.5 to 1.0 ?m, and conductive particles formed by subjecting second non-conductive inorganic particles having an average particle size of 0.5 to 1.0 ?m. An average particle size of the conductive particles does not exceed 1.5 ?m. The conductive particles is contained in an amount of 10 to 60 mass % of the filler.

Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Abstract: A method for reducing a resistance of an antenna circuit capable of obtaining a desired property by reducing wiring resistance to a suitable value while ensuring inductance is provided. An antenna circuit is disposed to a transponder having a carrier frequency band of 13.56 MHz. The antenna circuit is formed of a prescribed base material and two antenna conductors each of which is formed of the same conductor pattern forming an antenna coil, formed on respective front and back surfaces of the base material by electrically parallel connection. Each of the two antenna conductors has a thickness of greater than equal to 5% and less than 50% of an overall thickness formed of the two antenna conductors and the base material.

Abstract: A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.

Abstract: A novel sulfonium borate complex, which can reduce the amount of fluorine ions produced during thermal cationic polymerization, and realize low-temperature, rapid curing properties in a thermal cationic polymerizable adhesive, is represented by the structure of the following formula (1). In the formula (1), R1 is an aralkyl group and R2 is a lower alkyl group. However, when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract: An optical semiconductor package sealing resin material used to seal an optical semiconductor chip in a semiconductor package includes a thermosetting epoxy composition and a hydrophobic smectite clay mineral. The hydrophobic smectite clay mineral is hydrophobized by subjecting a hydrophilic smectite clay mineral to an intercalation reaction with an alkylammonium halide. The smectite clay mineral is bentonite, saponite, hectorite, vermiculite, stevensite, tainiolite, montmorillonite, or nontronite.

Abstract: A magnetic sheet containing a binder, a magnetic powder, and a fire retardant, wherein the fire retardant contains at least one of a silicon atom-containing melamine cyanurate and a carboxylic acid amide-containing melamine cyanurate.

Abstract: A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.

Abstract: Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.

Abstract: A microencapsulated silane coupling agent includes adduct particles of an epoxy compound and an imidazole silane coupling agent, and an ethyl cellulose film coating a periphery of the adduct particles, in which the ethyl cellulose film is crosslinked by a polyfunctional isocyanate compound. Preferred examples of the imidazole silane coupling agent include a compound represented by the formula (1), wherein R1 and R2 are each independently a hydrogen atom or a lower alkyl group, and R3 is a lower alkyl group.

Abstract: A protective element is provided that is capable of stopping heat generation of a heat generation resistor after all of fuse elements are surely blown out in a case where the power is distributed from a specific power distribution path. The protective element can be configured to control blowout times of a plurality of respective fuse elements in such a manner that other fuse elements are blown out prior to the blowout of a specific fuse element in a case where the power is distributed from the specific power distribution path connected with the specific fuse element among the plurality of fuse elements.

Abstract: A thermosetting epoxy resin composition can be cured rapidly at low temperature with an aluminum chelate-based latent curing agent without the use of a cycloaliphatic epoxy compound. The thermosetting epoxy resin composition includes an aluminum chelate-based latent curing agent, a silanol compound of the formula (A), and a glycidyl ether-type epoxy resin: (Ar)mSi(OH)n??(A) wherein Ar is an optionally substituted aryl group, and m is 2 or 3, provided that the sum of m and n is 4. Examples of the silanol compound of the formula (A) include triphenylsilanol, diphenylsilanol, and the like.

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract: The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.