Abstract: A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of pins are provided. A device includes at least one projection having a structure in which a surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film.

Abstract: A protective device is provided that allows a fusible conductor to be fused off quickly in stability at the time of protective operation against over-current or the like. The protective device includes a fusible conductor 13 and an insulation cover 14 mounted on a base substrate 11 to overlie the fusible conductor 13. The fusible conductor, arranged on an insulating base substrate 11 and connected to a power delivery path of equipment to be protected, is fused off by a preset unusual power. The protective device also includes a flux 19 coated on the fusible conductor 13 and provided within the insulation cover 14. The fusible conductor 13 is immobilized on pair electrodes 12 and a conductor layer 17 on the base substrate 11 via a solder paste 20 containing a metal component exhibiting sufficient wettability against the fusible conductor 13 in a fused state. The solder paste 20, arranged on the pair electrodes 12 and the conductor layer 17, is spread more outwardly than the rim of the fusible conductor 13.

Abstract: Manufacture a highly reliable image display device capable of proceeding with resin cure even in the case where a protective panel is provided with a light shielding portion. A liquid crystal display unit 2 having a liquid crystal display panel 8 and a light transmissive protective panel 3 having a light shielding portion 5 are disposed face to face, a resin composition 10 is interposed between the liquid crystal display unit and the protective panel, and the resin composition is cured into a cured resin layer 11. As the resin composition 10, a light-heat-curing resin composition and containing a photopolymerization initiator and organic peroxide of thermal polymerization initiator is used. In curing the resin composition 10, cure by light (ultraviolet rays) irradiation is performed until a cure ratio of the resin composition becomes 30% or more and thereafter thermal cure is performed.

Abstract: A light-emitting device is provided which uses an encapsulant material made from a polymer having a high relative light output. The light-emitting device includes a light-emitting element and a member sealing the light-emitting element. The encapsulant material has one or more than two kinds of units given by the following formula (1) and a refractive index of 1.55 or more. where R is a hydrogen atom, alkyl group or phenyl group, Y is an alkyl group of which the carbon number is 1 to 6 or an alkyloxy group of which the carbon number is 1 to 6 and Z is an aromatic compound that meets predetermined requirements.

Abstract: An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes.

Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position and is capable of checking a retention state of the flux, enabling a speedy blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to an electric power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. The insulation cover 14 is provided with an opening porting 20 made of a through hole which is opposite to the soluble conductor 13. The flux 19 comes into contact with a peripheral edge part of the opening portion 20, retaining the flux 19 at a predetermined position on the soluble conductor 13.

Abstract: A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.

Abstract: An antenna circuit and a transponder with the antenna circuit are provided for forming a resonant circuit. The antenna circuit includes a substrate, an antenna conductor, and a sheet metal. The antenna conductor includes an antenna coil formed in a predetermined conductor pattern on a front surface of the substrate. The sheet metal is provided on a rear surface of the substrate opposed to the front surface of the substrate and includes a slit.

Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

Abstract: A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.

Abstract: [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible. [Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G).

Abstract: An aluminum chelating agent-based latent curing agent is provided that can rapidly cure thermosetting epoxy resins at relatively low temperatures. A method for producing the aluminum chelating agent-based latent curing agent is also provided that enables relatively facile control of the curing conditions therefor.

Abstract: A pressure-sensitive adhesive composition capable of giving a pressure-sensitive adhesive sheet which simultaneously realizes satisfactory holding power, adhesion, and peel resistance in peeling from curved surfaces, while balancing these properties, and has satisfactory heat resistance. The composition comprises the following ingredients: (A) a maleimide crosslinking agent having two or more maleimide groups per molecule; (B) a monomer which, when caused to homopolymerize, gives a homopolymer having a glass transition temperature of ?40° C. or lower; (C) a carboxylated monomer copolymerizable with the monomer of the ingredient (B); and (D) a photopolymerization initiator, the maleimide crosslinking agent of the ingredient (A) being contained in an amount of 0.01-2 parts by weight per 100 parts by weight of the sum of the monomers of the ingredients (B) and (C).

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

Abstract: An encapsulating resin composition is provided, which gives a cured product having heat resistance, light resistance, and flexibility equivalent to those of silicone resins and having a refractive index of 1.57 or greater which is larger than that of epoxy resins. The encapsulating resin composition contains: a high refractive index acrylic-based or methacrylic-based monomer having a refractive index of 1.55 or greater; and a nonfunctional fluorene compound. In a preferred form, each of the high refractive index acrylic-based or methacrylic-based monomer and the nonfunctional fluorene compound has a 9,9-bisphenylfluorene skeleton.

Abstract: To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle.

Abstract: A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.

Abstract: A protective element is provided that is applicable to reflow soldering and ensuring good responsiveness of electric current interruption operation even in a case where a solder to be used has a liquid-phase point or a solid-phase point higher than a mounting temperature. The protective element includes an elastic member firmly adhered through a solder to second conductor layers and current-carrying electrode terminals formed on a prescribed substrate in such a manner to divide a current-carrying path in plural to form an electric current interruption portion. The solder has a liquid-phase point higher than a mounting temperature at which the protective element is mounted to a protection target device.

Abstract: An aluminum chelate latent curing agent is configured such that an aluminum chelating agent and a specific arylsilane compound or a hydrolysate thereof are held in a polymer obtained by subjecting the aluminum chelating agent, the arylsilane compound, and a polyfunctional isocyanate compound to an emulsifying treatment, and then subjecting the polyfunctional isocyanate to interfacial polymerization. The aluminum chelating agent does not have an alkoxy group bonded to the aluminum. The arylsilane compound is a compound represented by the formula W. (Ar)mSi(OR)n ??(A) In the formula (A), m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group. R represents a hydrogen atom, a methyl group, or an ethyl group. When n is two, the two Rs may be the same or different.

Abstract: A novel sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), R1 is an aralkyl group, R2 is a lower alkyl group, and R3 is a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.