Patents Assigned to Speedline Technologies, Inc.
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Patent number: 7549371Abstract: A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support to support a substrate in a print position and a substrate clamping assembly to clamp the substrate in the print position. In a certain embodiment, the substrate clamping assembly includes a pair of rail members coupled to the frame. The rail members are adapted to engage opposite edges of the substrate. The substrate clamping assembly further includes a pair of foils, one for each rail member, with each foil being releasably secured to the rail member in a position so that the foil overlies the substrate. The substrate clamping assembly also includes a pair of clamping members, one for each rail member and foil, to releasably secure the foil in place on the rail member.Type: GrantFiled: July 10, 2006Date of Patent: June 23, 2009Assignee: Speedline Technologies, Inc.Inventors: Richard Willshere, Joseph A. Perault, James Lynch, Mark E. Rossmeisl
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Patent number: 7469635Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.Type: GrantFiled: November 19, 2007Date of Patent: December 30, 2008Assignee: Speedline Technologies, Inc.Inventor: Frank John Marszalkowski, Jr.
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Patent number: 7458318Abstract: A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off-axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.Type: GrantFiled: February 1, 2006Date of Patent: December 2, 2008Assignee: Speedline Technologies, Inc.Inventor: David P. Prince
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Patent number: 7404861Abstract: Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.Type: GrantFiled: April 23, 2004Date of Patent: July 29, 2008Assignee: Speedline Technologies, Inc.Inventors: Thomas C. Prentice, David P. Prince
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Publication number: 20080066635Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.Type: ApplicationFiled: November 19, 2007Publication date: March 20, 2008Applicant: SPEEDLINE TECHNOLOGIES, INC.Inventor: Frank Marszalkowski
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Patent number: 7322288Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.Type: GrantFiled: November 8, 2006Date of Patent: January 29, 2008Assignee: Speedline Technologies, Inc.Inventor: Frank John Marszalkowski, Jr.
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Publication number: 20080006162Abstract: A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support to support a substrate in a print position and a substrate clamping assembly to clamp the substrate in the print position. In a certain embodiment, the substrate clamping assembly includes a pair of rail members coupled to the frame. The rail members are adapted to engage opposite edges of the substrate. The substrate clamping assembly further includes a pair of foils, one for each rail member, with each foil being releasably secured to the rail member in a position so that the foil overlies the substrate. The substrate clamping assembly also includes a pair of clamping members, one for each rail member and foil, to releasably secure the foil in place on the rail member.Type: ApplicationFiled: July 10, 2006Publication date: January 10, 2008Applicant: Speedline Technologies, Inc.Inventors: Richard Willshere, Joseph A. Perault, James Lynch
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Patent number: 7310438Abstract: A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has beeType: GrantFiled: June 30, 2006Date of Patent: December 18, 2007Assignee: Speedline Technologies, Inc.Inventor: David P. Prince
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Patent number: 7293691Abstract: A system for depositing solder paste on a print window of a printed circuit board through a stencil includes a housing providing a printing chamber, a depositor configured to move relative to the housing and to deposit the solder paste, a support device disposed in the printing chamber and configured to receive the circuit board and to selectively hold the circuit board stationary relative to the housing, a loading mechanism configured to receive the circuit board and to transport the circuit board along a second direction to the support device, a controller coupled and configured to control dispensing of the solder paste by the depositor and the transporting of the circuit board by the loading mechanism, and a rotational apparatus coupled to the support device and configured to rotate the support device, where the controller is configured to cause the rotational apparatus to rotate the support device more than about 10° and to cause the depositor to deposit solder paste onto the circuit board after the rotatType: GrantFiled: January 17, 2003Date of Patent: November 13, 2007Assignee: Speedline Technologies, Inc.Inventors: Mark Rossmeisl, Frank John Marszalkowski, Jr., Joseph A. Perault
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Publication number: 20070175343Abstract: A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off-axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.Type: ApplicationFiled: February 1, 2006Publication date: August 2, 2007Applicant: Speedline Technologies, Inc.Inventor: David Prince
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Patent number: 7249558Abstract: A stencil printer for printing solder paste onto a substrate includes a frame, a stencil, coupled to the frame, having apertures formed therein, a support assembly, coupled to the frame, to support the substrate in a printing position beneath the stencil, and a dispensing head coupled to the frame in such a manner that the dispensing head is configured to traverse the stencil during first and second print strokes. The dispensing head includes a frame assembly and a wiper blade assembly, coupled to the frame assembly, having first and second wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The first and second wiper blades are constructed and arranged to force solder paste through the apertures of the stencil. The dispensing head further includes a dispensing unit, coupled to the frame assembly, having a chamber adapted to dispense solder paste, the dispensing unit being disposed between the first and second wiper blades to deposit solder paste therebetween.Type: GrantFiled: July 15, 2004Date of Patent: July 31, 2007Assignee: Speedline Technologies, Inc.Inventor: William Russell Claiborne
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Publication number: 20070102477Abstract: A stencil printer for depositing solder paste onto a plurality of pads of an electronic substrate includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a support assembly coupled to the frame, the support assembly supporting the electronic substrate in a printing position. An imaging system is adapted to capture images of multiple areas of one of the electronic substrate and the stencil. A controller, coupled to the imaging system, is adapted to control movement of the imaging system to capture an image of an area while maintaining a minimum velocity above zero when capturing the image of the area. Methods for dispensing solder paste on a substrate and for inspecting the substrate are further disclosed.Type: ApplicationFiled: November 10, 2005Publication date: May 10, 2007Applicant: Speedline Technologies, Inc.Inventor: David Prince
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Publication number: 20070102478Abstract: A stencil printer for depositing solder paste onto an electronic substrate includes a frame and a stencil coupled to the frame. A dispenser is coupled to the frame, with the dispenser and the stencil being configured to deposit solder paste onto the plurality of pads of the electronic substrate. An imaging system is configured to capture images of regions of interest of at least one of the electronic substrate and the stencil. The stencil printer further includes a controller coupled to the imaging system, with the controller being configured to control movement of the imaging system to capture images of regions of interest of at least one of the electronic substrate and the stencil extending generally along a first axis before moving the imaging system in another direction. A method for dispensing material on a substrate is further disclosed.Type: ApplicationFiled: February 2, 2006Publication date: May 10, 2007Applicant: Speedline Technologies, Inc.Inventor: David Prince
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Patent number: 7213738Abstract: The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.Type: GrantFiled: September 30, 2002Date of Patent: May 8, 2007Assignee: Speedline Technologies, Inc.Inventors: Eric Ludwig, Keith Howell, Troy Beard
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Publication number: 20070051253Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.Type: ApplicationFiled: November 8, 2006Publication date: March 8, 2007Applicant: Speedline Technologies, Inc.Inventor: Frank Marszalkowski
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Patent number: 7171898Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.Type: GrantFiled: November 2, 2005Date of Patent: February 6, 2007Assignee: Speedline Technologies, Inc.Inventor: Frank John Marszalkowski, Jr.
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Patent number: 7149344Abstract: A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.Type: GrantFiled: March 29, 2005Date of Patent: December 12, 2006Assignee: Speedline Technologies, Inc.Inventor: David P. Prince
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Publication number: 20060245637Abstract: A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has beeType: ApplicationFiled: June 30, 2006Publication date: November 2, 2006Applicant: Speedline Technologies, Inc.Inventor: David Prince
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Patent number: 7121199Abstract: A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate supporting and clamping assembly to support and clamp a substrate in a print position. The substrate supporting and clamping assembly includes at least one support member to support the substrate in a print position, a pair of rail members, coupled to the frame, adapted to engage opposite edges of the substrate, and a clamping mechanism, coupled to the frame, to move at least one of the rail members against the substrate to clamp the substrate.Type: GrantFiled: October 18, 2004Date of Patent: October 17, 2006Assignee: Speedline Technologies, Inc.Inventors: Joseph A. Perault, James Lynch
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Publication number: 20060193969Abstract: A method for streaming a viscous material onto an electronic substrate using a dispensing system having a dispenser includes positioning a nozzle of the dispenser at a nominal clearance height above the substrate, dispensing a continuous stream of viscous material from the nozzle to dispense an amount of material on the substrate, controlling the volumetric flow rate of the viscous material being dispensed by the dispenser, moving the nozzle over areas of the substrate requiring viscous material, and terminating the continuous stream of viscous material. A dispensing system for performing methods of streaming viscous material is further disclosed.Type: ApplicationFiled: February 25, 2005Publication date: August 31, 2006Applicant: Speedline Technologies, Inc.Inventors: Thomas Prentice, Brian Prescott, Kenneth Crouch, Gerald Pham-Van-Diep