Abstract: A printer includes a dispensing head for dispensing viscous material, such as solder paste. The dispensing head defines a chamber and includes at least one source port and a dispensing slot, wherein the viscous material flows from a supply mounted to the source port, into the chamber and out the dispensing slot. Within the chamber, a stirring mechanism is mounted. The stirring mechanism is coupled to a drive mechanism that displaces the stirring mechanism through the chamber, thereby stirring the viscous material. The stirring mechanism is particularly effective in preventing or reducing compaction of solder paste within the chamber.

Abstract: Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.

Abstract: A dispensing system and method for dispensing material onto a substrate. The dispensing system includes a frame, a support, coupled to the frame, that supports the substrate at a dispensing position in the dispensing system, and a dispensing head, coupled to the frame, that dispenses the material onto the substrate. The dispensing head includes a motor unit having a first motor coupled to an output drive mechanism, and a dispensing unit, removably coupled to the motor unit, having a material outlet from which the dispensing material is dispensed, the dispensing unit having a dispensing mechanism coupled to the material outlet and coupled to the output drive mechanism of the motor unit such that operation of the first motor causes the dispensing mechanism to dispense material through the outlet.

Abstract: The present invention is directed to methods and apparatus for controlling the quanatity of material dispensed from dispensing systems. In one aspect of the present invention, a dispensing system includes a weight scale upon which material is dispensed from a dispensing system during a calibration routine. The weight of the dispensed material is determined and compared with a target weight. If the weight of the dispensed material varies from the target weight by more than a predetermined amount, then characteristics of the dispensing system are adjusted, and the calibration routine is repeated.

Abstract: A liquid dispensing system has a number of cartridges, preferably two or four, selectively coupled to a single motor with a respective clutch for dispensing dots of liquid at high speed. The motor drives a spur gear that meshes with individual spur gears associated with each of the clutches. Multiple cartridges are thus activated with a single motor and are housed together in one housing. Each cartridge is movable relative to the housing and is biased downward to a dispensing position with a spring. Air is selectively provided between the dispensers and the housing to drive the cartridges upward to a non-dispensing position. When the air is not provided, the spring returns the cartridge to its downward position. By moving the cartridge relative to the housing, the assembly can dispense at different locations without it being necessary to move the entire pump assembly every time a dot is dispensed.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: The present invention provides a method and apparatus for dispensing materials onto a substrate. In one embodiment, a dispensing system includes a controller, a vacuum source in electrical communication with the controller, the vacuum source applying a vacuum to at least a portion of the substrate in response to an instruction from the controller, an injector in electrical communication with the controller, the injector comprising a valve in communication with a pressure source and a material port in communication with a material source, the valve permitting material from the material source to be dispensed onto a substrate in accordance with an instruction from the controller. In one embodiment, the dispensing system also includes a trap in communication with the vacuum source, where the trap substantially prevents excessive material dispensed by the injector from contacting the vacuum source.

Abstract: Apparatus for use in wave soldering applications can include an adjustable wing device, a front gate and/or a mounted member. Each of these components are easily adjustable, thereby improving the quality of the soldered product and allowing for improved process efficiency and decreased downtime of the wave soldering equipment.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.

Abstract: A method and apparatus for measuring and controlling the size of drops of viscous material dispensed from a dispensing system. A dispensing apparatus in accordance with embodiments of the present invention includes a housing, a dispenser that dispenses a quantity of the viscous material, a measuring apparatus having a bottom plate to receive the viscous material, a top plate that is positioned over the bottom plate after the viscous material has been dispensed, and a compressing apparatus that compresses the material between the top and bottom plates. The dispensing apparatus further includes a viewing system that views the compressed material to determine the quantity of material dispensed by the dispenser. In one embodiment, the dispensing apparatus includes a controller that controls the quantity of viscous material dispensed based on the quantity of material determined by the viewing system.

Abstract: A dispensing system and method for dispensing material onto a substrate. The dispensing system includes a frame, a support, coupled to the frame, that supports the substrate at a dispensing position in the dispensing system, and a dispensing head, coupled to the frame, that dispenses the material onto the substrate. The dispensing head includes a motor unit having a first motor coupled to an output drive mechanism, and a dispensing unit, removably coupled to the motor unit, having a material outlet from which the dispensing material is dispensed, the dispensing unit having a dispensing mechanism coupled to the material outlet and coupled to the output drive mechanism of the motor unit such that operation of the first motor causes the dispensing mechanism to dispense material through the outlet.

Abstract: A dispensing system and method for dispensing material onto a substrate. In one embodiment, a dispensing system includes a housing, a dispensing apparatus, coupled to the housing, that dispenses a quantity of material onto the substrate, and a measuring probe, coupled to the housing, and positionable over the substrate to measure a distance from a reference point to a location on the top surface of the substrate. Another embodiment of the invention is directed to a method for dispensing material onto a top surface of a substrate using a dispensing system having a dispensing apparatus that dispenses the material at a dispensing distance from the top surface of the substrate.

Abstract: A dispensing system for dispensing a quantity of material includes an inlet port to receive the material, an outlet port from which the material is dispensed from the dispensing system, a housing having an inner chamber with an adjustable volume, a first valve operable in one of an open mode of operation and a closed mode of operation. The first valve is disposed between the inlet port and the inner chamber in such a manner that when the first valve is operating in the open mode, material may flow from the inlet port into the inner chamber, and when the first valve is operating in the closed mode, material is prevented from flowing from the inlet port into the inner chamber. The dispensing system also includes a second valve operable in one of an open mode of operation and a closed mode of operation.

Abstract: A liquid dispenser has an augering screw that serves both a metering function and a valving function. The augering screw is axially movable between a position in which fluid can flow and a sealing position in which liquid flow through the nozzle is substantially prevented. The screw is preferably designed with a curved contour between the threads and with a plurality of thread-defining channels to allow liquid to fill more completely around the screw and to dispense more liquid with fewer screw turns than prior screw designs.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

Abstract: A multiple head dispensing system and method is provided. In one embodiment, a dispensing system for dispensing material onto a substrate includes a plurality of independently operable dispensing heads, and a conveyor system, disposed beneath the plurality of dispensing heads, having a first track and a second track, each of which is constructed and arranged to convey substrates to working positions beneath the dispensing heads. The dispensing system may include a plurality of gantry systems, each of which is coupled to one of the plurality of independently operable dispensing heads.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.