Abstract: A dual track stencil system includes a plurality of pairs of adjustable conveyor rails, including a first pair of conveyor rails and a second pair of conveyor rails. The first and second pairs of conveyor rails of the dual track system are advantageously adjustable to accommodate variable width circuit boards or operation of the system in single track mode. The first and second pairs of conveyor rails can be independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: System for drying printed circuit boards in a liquid cleaning apparatus. The liquid cleaning apparatus includes a series of air knife dryers enclosed within two drying modules. The first drying module houses a first set of top and bottom air knife dryers which includes at least one top air knife dryer, positioned above a conveyor belt carrying printed circuit boards through the liquid cleaning apparatus, and at least one bottom air knife dryer, positioned below the conveyor belt. The air knife dryers may be symmetrically opposed and aligned above and below the conveyor belt. The liquid cleaning apparatus further includes side air knife dryers disposed along the conveyor belt between the first drying module and the second drying module.

Abstract: In a conveyor system with a radiant heating system, convection is provided with hollow elongated tubes having small holes for providing a gentle air flow toward a workpiece to heat the workpiece with convection and radiation.

Abstract: Embodiments of the present invention provide a multiple head dispensing system having independently controlled dispensing heads. Each of the dispensing heads may be independently controlled to provide simultaneous, asynchronous operation and to allow dispensing of different materials onto substrates. Independent control of the dispensing heads is accomplished under the control of a controller in conjunction with a plurality of gantry systems, each of which positions one of the multiple dispensing heads over a substrate that is to receive dispensing material. In some embodiments, each gantry system utilizes two drive mechanisms, arranged in parallel, that provide movement of the dispensing head over an x-y plane. Multiple conveyor systems are utilized that allow parallel processing of work products in the dispensing system.

Abstract: A liquid dispensing system has a number of cartridges, preferably two or four, selectively coupled to a single motor with a respective clutch for dispensing dots of liquid at high speed. The motor drives a spur gear that meshes with individual spur gears associated with each of the clutches. Multiple cartridges are thus activated with a single motor and are housed together in one housing. Each cartridge is movable relative to the housing and is biased downward to a dispensing position with a spring. Air is selectively provided between the dispensers and the housing to drive the cartridges upward to a non-dispensing position. When the air is not provided, the spring returns the cartridge to its downward position. By moving the cartridge relative to the housing, the assembly can dispense at different locations without it being necessary to move the entire pump assembly every time a dot is dispensed.

Abstract: Aspects of the present invention are directed to methods and apparatus for dispensing material onto substrates. A dispensing pump is provided for dispensing a metered quantity of material onto a substrate, the dispensing pump includes an inlet for receiving dispensing material, an outlet from which the dispensing material is dispensed, a dispensing apparatus having a plurality of inputs and a plurality of outputs, a motor, coupled to the dispensing apparatus that controls flow of material from the plurality of inputs in the dispensing apparatus to the plurality of outputs in the dispensing apparatus, and a distribution apparatus coupled to the dispensing apparatus to transfer material from the inlet to the plurality of inputs and to transfer material from the plurality of outputs to the outlet, the distribution apparatus including a plurality of plates coupled together to form the distribution apparatus.

Abstract: A dispensing system and method for dispensing material onto a substrate. The dispensing system includes a frame, a support, coupled to the frame, that supports the substrate at a dispensing position in the dispensing system, and a dispensing head, coupled to the frame, that dispenses the material onto the substrate. The dispensing head includes a motor unit having a first motor coupled to an output drive mechanism, and a dispensing unit, removably coupled to the motor unit, having a material outlet from which the dispensing material is dispensed, the dispensing unit having a dispensing mechanism coupled to the material outlet and coupled to the output drive mechanism of the motor unit such that operation of the first motor causes the dispensing mechanism to dispense material through the outlet.

Abstract: A multiple head dispensing system and method is provided. In one embodiment, a dispensing system for dispensing material onto a substrate includes a plurality of independently operable dispensing heads, and a conveyor system, disposed beneath the plurality of dispensing heads, having a first track and a second track, each of which is constructed and arranged to convey substrates to working positions beneath the dispensing heads. The dispensing system may include a plurality of gantry systems, each of which is coupled to one of the plurality of independently operable dispensing heads.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: A positioning system for moving a device over an xy-plane has a drive mechanism with pivotable arms for moving a carriage over the xy-plane by driving it from one side. This drive mechanism allows the system to be made narrow along the other side.

Abstract: The present invention provides a method and apparatus for dispensing materials onto a substrate in a vacuum. In one embodiment, a dispensing system includes a dispensing vacuum chamber having an inlet to receive substrates for dispensing and an outlet to provide substrates having material dispensed thereon, a dispensing pump, disposed within the dispensing vacuum chamber, that dispenses the material onto substrates, a substrate support system, disposed within the dispensing vacuum chamber, that supports substrates at a dispensing position beneath the dispensing pump, an inlet vacuum chamber coupled to the inlet of the dispensing vacuum chamber, and an outlet vacuum chamber coupled to the outlet of the dispensing vacuum chamber.

Abstract: A method and apparatus for measuring and controlling the size of drops of viscous material dispensed from a dispensing system. A dispensing apparatus in accordance with embodiments of the present invention includes a housing, a dispenser that dispenses a quantity of the viscous material, a measuring apparatus having a bottom plate to receive the viscous material, a top plate that is positioned over the bottom plate after the viscous material has been dispensed, and a compressing apparatus that compresses the material between the top and bottom plates. The dispensing apparatus further includes a viewing system that views the compressed material to determine the quantity of material dispensed by the dispenser. In one embodiment, the dispensing apparatus includes a controller that controls the quantity of viscous material dispensed based on the quantity of material determined by the viewing system.

Abstract: A dispensing system and method for dispensing material onto a substrate. In one embodiment, a dispensing system includes a housing, a dispensing apparatus, coupled to the housing, that dispenses a quantity of material onto the substrate, and a measuring probe, coupled to the housing, and positionable over the substrate to measure a distance from a reference point to a location on the top surface of the substrate. Another embodiment of the invention is directed to a method for dispensing material onto a top surface of a substrate using a dispensing system having a dispensing apparatus that dispenses the material at a dispensing distance from the top surface of the substrate.

Abstract: A dispensing system for dispensing a quantity of material includes an inlet port to receive the material, an outlet port from which the material is dispensed from the dispensing system, a housing having an inner chamber with an adjustable volume, a first valve operable in one of an open mode of operation and a closed mode of operation. The first valve is disposed between the inlet port and the inner chamber in such a manner that when the first valve is operating in the open mode, material may flow from the inlet port into the inner chamber, and when the first valve is operating in the closed mode, material is prevented from flowing from the inlet port into the inner chamber. The dispensing system also includes a second valve operable in one of an open mode of operation and a closed mode of operation.

Abstract: A liquid dispenser has a pump assembly with a housing and a cartridge that is movable relative to the housing between an upper non-dispensing position and a lower dispensing position. The movement is controlled by the selective introduction of air to create a column of air. The dispenser is otherwise biased downward. The movement of the dispenser can be used to avoid repeated upward and downward movement of a pump assembly. In a pump assembly with multiple dispensers, all but one can be raised while only the dispensing cartridge is lowered.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area at which the circuit boards are stenciled and includes a stencil having two patterns formed thereon. In one embodiment, the stencil system includes a solder dispensing system for dispensing solder paste onto the stencil.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.

Abstract: A positioning system for moving a device over an xy-plane has a drive mechanism with pivotable arms for moving a carriage over the xy-plane by driving it from one side. This drive mechanism allows the system to be made narrow along the other side.