Patents Assigned to SPEEDLINK TECHNOLOGY INC.
  • Patent number: 10756432
    Abstract: An RF antenna includes a first substrate having a first top surface and a first bottom surface and a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon. The RF antenna further includes a low-band (LB) radiation element disposed on the first top surface of the first substrate. The LB radiation element is to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band. The RF antenna further includes multiple high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate. Each HB radiation element is to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: August 25, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD.
    Inventors: Robert Hill, Zhanyi Qian, Che-Chun Kuo, Bin Yu
  • Patent number: 10727598
    Abstract: A new antenna array of the invention which has simple structure, small volume and can adopt a variety of realization forms, it can be easily integrated in the PCB of the mobile terminal using surface mount technology (SMT) or multi-layer PCB integration and other forms of technology. The antenna array is compact and can be configured with different number of antenna elements to meet the gain requirements. The antenna array is small in size and has a wide antenna bandwidth that can cover multiple 5G millimeter-wave bands while maintaining a directional high antenna gain and a stable radiation pattern. The antenna array can satisfy the millimeter-wave 5G communication requirements such as high gain, beam forming characteristics, beam scanning characteristics, and can be easily integrated into a portable mobile terminal.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: July 28, 2020
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Bin Yu, Zhanyi Qian, Xitong Wu
  • Patent number: 10720695
    Abstract: A Near field communication (NFC) antenna and circuit modules are provided for communication terminal devices with metal frame, which aims at simplifying the implementation of the NFC antenna, and especially facilitating the application of the NFC for the devices with rear metal housing. The rear metal housing of a terminal device may be divided into three sections by the gap, the first section is metal frame, the second section is metal back shell. The metal frame as the main NFC antenna radiator, and also can be used as other microwave frequency antenna radiator. The rear metal shell connected to the motherboard ground. The NFC circuit module can transmit the NFC signal to the metal frame through different feeding methods to realize the radiation function of the NFC antenna.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: July 21, 2020
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Bin Yu, Sile Gong, Nana Li, Yanmei Shi
  • Patent number: 10714835
    Abstract: An antenna element includes an antenna radiator, an antenna dielectric substrate, a grounded metal plate, and a feed structure. The antenna radiator consists of several metal sheet units. The coupled slots between the adjacent metal sheet units form radiation slots and the grounded metal plate has a feed slot which is fed by the feed structure and the radiation slot is fed by the feed slot through coupling. This disclosure also provides an antenna packaging structure. An EBG is deployed as part of the radiator to improve the problems of high profile and narrow bandwidth of the traditional antennas. The EBG radiator also achieves low profile, broadband and high gain characteristics that is very suitable for millimeter wave band AiP and is also suitable for mass production at low cost, and therefore it can be widely used in 60 GHz WiFi system and a 5G millimeter wave communication system.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: July 14, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD
    Inventors: Bin Yu, Qingfang Li, Yanmei Shi
  • Patent number: 10707817
    Abstract: According to one embodiment, a low noise amplifier (LNA) circuit includes a first stage which includes: a first transistor; a second transistor coupled to the first transistor; a first inductor coupled in between an input port and a gate of the first transistor; and a second inductor coupled to a source of the first transistor, where the first inductor and the second inductor resonates with a gate capacitance of the first transistor for a dual-resonance. The LNA circuit includes a second stage including a third transistor; a fourth transistor coupled between the third transistor and an output port; and a passive network coupled to a gate of the third transistor. The LNA circuit includes a capacitor coupled in between the first and the second stages, where the capacitor transforms an impedance of the passive network to an optimal load for the first amplifier stage.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 7, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Min-Yu Huang, Hua Wang, Thomas Chen, Taiyun Chi
  • Patent number: 10673135
    Abstract: An antenna system with a reconfigurable radiation pattern characteristic for the fifth generation (5G) mobile terminal is described, which includes multiple antenna sub-arrays with different radiation patterns and a switch that connects each antenna sub-array and controls switching between different antenna sub-arrays. A switch is disposed between the antenna sub-arrays and an RF front-end module. By switching between the different sub-arrays, the radiation in a desired direction can be selected. Therefore, the problem of the beam coverage and beam scanning blind spot of 5G terminal antenna in millimeter waveband can be solved effectively. Through expanding the scanning angle of the beam scanning, the scheme of 5G terminal antenna with a reconfigurable radiation pattern can be realized. The antenna structure of this disclosure makes full use of the space of the PCB board, and has the advantages of miniaturization, simple processing and compact structure, etc.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 2, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD
    Inventors: Bin Yu, Xiaoyang Ma
  • Patent number: 10666274
    Abstract: According to one embodiment, a dual voltage controlled oscillator (VCO) circuit includes a first VCO and a second VCO. The first VCO includes: a first variable capacitor having an input node, a first output node, and a second output node, a second variable capacitor coupled in parallel with the first variable capacitor, a first transistor, and a second transistor, where the first transistor has a first drain coupled to the first output node, a first gate coupled to the second output node, and a first source coupled to a ground, where the second transistor has a second drain coupled to the second output node and a second gate coupled to the first output node, and a second source coupled to the ground. The dual VCO circuit includes a second VCO mirroring the first VCO, a first and a second inductors coupled to the first and the second VCO respectively.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: May 26, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Doohwan Jung, Thomas Chen, Hua Wang
  • Patent number: 10581171
    Abstract: A novel antenna element includes a PCB, a radiating element disposed on the surface of the PCB, and a feed structure. The radiating element is constituted by a magnetic dipole and an electric dipole. The magnetic dipole comprises a first magnetic dipole conductive part disposed on the first surface, a second magnetic dipole conductive part disposed on the second surface, and a first metal via array which penetrates the PCB and is connected with edges of the first and second magnetic dipole conductive parts. The electric dipole is constituted by a first electric dipole conductive part which is connected with the first magnetic dipole conductive part and a second electric dipole conductive part which is connected with the second magnetic dipole conductive part. The feed structure is connected with the first magnetic dipole conductive part and the magnetic dipole extends to the ground.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: March 3, 2020
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD
    Inventors: Bin Yu, Zhanyi Qian, Xitong Wu
  • Patent number: 10553551
    Abstract: A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: February 4, 2020
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10476533
    Abstract: According to one embodiment, a transmit/receive (T/R) switch includes a transmit switch, between a transmit port and an antenna port, a receive switch, between a receive port and the antenna port, a transmit inductor, coupled in parallel between the transmit switch the transmit port, and a receive inductor, coupled in parallel between the transmit switch the transmit port. The T/R switch can be co-designed with a power amplifier (PA) output matching circuit.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 12, 2019
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Taiyun Chi, Hua Wang, Thomas Chen
  • Patent number: 10447283
    Abstract: According to one embodiment, a phase locked loop (PLL) circuit includes a first voltage controlled oscillator (VCO) to generate a first signal having a first frequency and a second VCO to generate a second signal having a second frequency. The PLL circuit includes a multiplexer coupled to the first VCO, the second VCO, and a feedback loop. The PLL circuit includes a control logic to select either the first VCO or the second VCO using the multiplexer to feed back a signal using the feedback loop, and a phase frequency detector coupled to the first VCO, the second VCO, and the feedback loop, where the phase frequency detector is configured to receive a reference signal and the feedback signal to tracking a frequency and a phase of the first or the second generated signal using the reference signal and the feedback signal.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: October 15, 2019
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Doohwan Jung, Thomas Chen, Hua Wang
  • Patent number: 10439575
    Abstract: According to one embodiment, a differential power amplifier includes a pair of transistors, a transformer coupled to the drain terminals of the transistors, and an output transmission line. The differential power amplifier operates in a range of frequencies from a lower operating frequency to an upper operating frequency to provide a relatively linear gain between the lower operating frequency and the higher operating frequency. The drains of the transistors are coupled to the primary winding of the transformer. The output transmission line is coupled to the secondary winding of the transformer. The output transmission line further includes at least one inductor-capacitor (LC) circuit that is configured to match predetermined output impedance in view of the lower and upper operating frequencies of the differential power amplifier.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 8, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10411745
    Abstract: According to one embodiment, a radio frequency (RF) receiver circuit includes a low noise amplifier, a poly-phase filter, and an in-phase quadrature (IQ) mixer circuit coupled between the low noise amplifier and the poly-phase filter. The IQ mixer circuit includes an IQ generator having a differential in-phase input port, a differential in-phase output port, and a differential quadrature output port; a first frequency mixer having a differential local oscillator (LO) input port, where the differential LO input port of the first frequency mixer are coupled to the differential in-phase output port of the IQ generator to drive the first frequency mixer; and a second frequency mixer having a differential LO port, where the differential LO input port of the second frequency mixer are coupled to the differential quadrature output port of the IQ generator to drive the second frequency mixer.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: September 10, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Min-Yu Huang, Hua Wang, Thomas Chen, Taiyun Chi
  • Patent number: 10382084
    Abstract: According to one embodiment, a radio frequency (RF) frontend circuit includes a RF receiver, a transceiver (or transmit/receive) switch, and a high-order inductive degeneration matching network coupled in between the transceiver switch and an input port of the RF receiver, where the high-order inductive degeneration matching network matches an impedance for the RF receiver and the transceiver switch and the high-order inductive degeneration matching network is to resonate at a plurality of predetermined resonant frequencies.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: August 13, 2019
    Assignees: SPEEDLINK TECHNOLOGY INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Min-Yu Huang, Hua Wang, Thomas Chen, Taiyun Chi
  • Patent number: 10374558
    Abstract: A power amplifier includes a transistor operating in a range of frequencies from a lower operating frequency to a higher operating frequency to provide a relatively linear gain between the lower operating frequency and the higher operating frequency, an input transmission line circuit coupled to a gate terminal of the transistor, and an output transmission line circuit coupled to a drain terminal of the transistor. The input transmission line includes an inductor-capacitor (LC) circuit that resonates at a first resonant frequency equaled to or higher than the higher operating frequency. The output transmission line includes an inductor-capacitor-inductor (LCL) circuit and a capacitor-inductor-capacitor (CLC) circuit. The LCL circuit resonates at a second resonant frequency equaled to or lower than the lower operating frequency. The CLC circuit resonates at a third resonant frequency equaled to or higher than the higher operating frequency.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: August 6, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10333226
    Abstract: According to one embodiment, a waveguide antenna includes a top plane made of electrically conductive material, a bottom plane made of electrically conductive material, a first feed member coupled to the top plane and the bottom plane through a first via, the first feed member to be electrically coupled a transceiver of an electronic device, and an array of vias disposed surrounding the first via. The array of vias coupling the top plane and the bottom plane to form a cavity between the top plane and the bottom plane. When an electrical signal is provided to the first feed member, the first feed member excites a space within the cavity between the top plane and the bottom plane.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: June 25, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Robert Hill, Che Ting Kuo, Bin Yu
  • Patent number: 10333221
    Abstract: An antenna element includes a feed probe, an insulating sleeve, and a reflecting cavity. The reflecting cavity is formed by an inner concave of an outer side of the metal frame of the metal back cover. The reflecting cavity includes a first wall and a second wall. One end of the feed probe is connected with the first wall. The middle of the feed probe is connected with the second wall through an insulating sleeve, and the other end of the feed probe is connected with a signal feeder line. The present invention also provides an RF frontend system which includes the above mentioned antenna system. Through an architecture which includes a feed probe and a reflecting cavity, the present invention realizes that the 5G antenna is arranged at the sides of the mobile terminal. Therefore the 5G antenna can coexist with 3G, 4G, GPS, WIFI and other antennas.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 25, 2019
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD.
    Inventors: Bin Yu, Kang Yang
  • Patent number: 10326636
    Abstract: An RF frontend circuit includes an RF transceiver and a frequency synthesizer to perform frequency synthetization in a wide frequency spectrum. The frequency synthesizer generates an LO signal to the RF transceiver. The frequency synthesizer includes a quadrature signal generator to generate a quadrature LO signal based on the LO signal. The quadrature signal generator includes a first transformer. A first primary winding of the first transformer is disposed on a first substrate layer of the IC and a secondary winding of the first transformer is disposed on a second substrate layer of an IC. A second transformer is coupled to the first transformer in series. A second primary winding of the second transformer is disposed on the first substrate layer of the IC and a secondary winding of the second transformer is disposed on the second substrate layer of the IC.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 18, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Che-Chun Kuo, Taiyun Chi, Thomas Chen
  • Patent number: 10297903
    Abstract: The disclosure relates generally to a broadband antenna element with a reflecting cavity, which includes a metal frame, a feeder line, a feed screw, a pillar and an insulating sleeve. The reflecting cavity is formed by the inner concave of the outer side of the metal frame. The reflecting cavity includes the first wall and the second wall distributed from bottom to top. The first wall, the pillar, the second wall and the feeder line are arranged orderly and are connected with the feed screw. The pillar and the feed screw are connected by screw thread. The feed screw is connected with the second wall through an insulating sleeve. The pillar is a good conductor and under surface of the pillar contacts with the first wall, and the under surface area of the pillar is larger than the upper surface area of the pillar.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: May 21, 2019
    Assignees: SPEEDLINK TECHNOLOGY INC., HUIZHOU SPEED WIRELESS TECHNOLOGY CO., LTD
    Inventors: Bin Yu, Xitong Wu, Kang Yang
  • Patent number: 10297921
    Abstract: A dipole antenna with resonant cavities operates with a resonant frequency near the antenna operating frequency to widen the operating bandwidth of the dipole antenna. Specifically, a ground consisting of multiple layers of electrically conductive planes and electrically conductive vias connecting the electrically conductive planes to form a ground wall cavity for a dipole member. The ground wall induces multiple resonant frequencies due to its coupling effect to the dipole member. A radio frequency (RF) frontend for mobile communication devices contains the dipole antenna with cavity coupled to a transceiver to receive and transmit communication signals.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: May 21, 2019
    Assignee: SPEEDLINK TECHNOLOGY INC.
    Inventors: Robert Hill, Che Ting Kuo, Bin Yu