Abstract: A memory device for storing data comprises a memory bank comprising a plurality of addressable memory cells, wherein the memory bank is divided into a plurality of segments. The memory device also comprises a cache memory operable for storing a second plurality of data words, wherein further each data word of the second plurality of data words is either awaiting write verification or is to be re-written into the memory bank. The cache memory is divided into a plurality of primary segments, wherein each primary segment of the cache memory is direct mapped to a corresponding segment of the plurality of segments of the memory bank, wherein each primary segment of the plurality of primary segments of the cache memory is sub-divided into a plurality of secondary segments, and each of the plurality of secondary segments comprises at least one counter for tracking a number of valid entries stored therein.

Abstract: A memory device comprises a memory bank comprising a plurality of addressable memory cells, wherein the memory bank is divided into a plurality of segments. Further, the device comprises a cache memory operable for storing a second plurality of data words, wherein each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank. The cache memory is divided into a plurality of primary segments, wherein each primary segment of the cache memory is direct mapped to a corresponding segment of the plurality of segments, wherein each primary segment is sub-divided into a plurality of secondary segments, and wherein each of the plurality of secondary segments comprises at least one counter for tracking a number of entries stored therein.

Abstract: A Magnetic Tunnel Junction (MTJ) device can include a reference magnetic layer having one or more trenches disposed therein. One or more sections of a tunnel barrier layer can be disposed on the walls of the one or more trenches. One or more sections of a free magnetic layer can be disposed on the one or more sections of the tunnel barrier layer in the one or more trenches. One or more sections of a conductive layer can be disposed on the one or more sections of the free magnetic layer in the one or more trenches. One or more insulator blocks can be disposed between corresponding sections of the tunnel barrier layer, corresponding sections of the free magnetic layer and corresponding sections of the conductive layer in the one or more trenches.

Abstract: Aspects of the present technology are directed toward Integrated Circuits (IC) including a plurality of trenches disposed in a substrate about a set of silicide regions. The trenches can extend down into the substrate below the set of silicide regions. The silicide regions can be formed by implanting metal ions into portions of a substrate exposed by a mask layer with narrow pitch openings. The trenches can be formed by selectively etching the substrate utilizing the set of silicide regions as a trench mask. An semiconductor material with various degree of crystallinity can be grown from the silicide regions, in openings that extend through subsequently formed layers down to the silicide regions.

Abstract: A Magnetic Tunnel Junction (MTJ) device can include a reference magnetic layer having one or more trenches disposed therein. One or more sections of a tunnel barrier layer can be disposed on the walls of the one or more trenches. One or more sections of a free magnetic layer can be disposed on the one or more sections of the tunnel barrier layer in the one or more trenches. One or more sections of a conductive layer can be disposed on the one or more sections of the free magnetic layer in the one or more trenches. One or more insulator blocks can be disposed between corresponding sections of the tunnel barrier layer, corresponding sections of the free magnetic layer and corresponding sections of the conductive layer in the one or more trenches.

Abstract: A magnetic memory pillar structure having a plurality of magnetic memory elements connected in series, wherein switching of individual memory elements in the pillar structure can be accomplished based on differing switching current values of the magnetic memory elements. Each of the plurality of memory elements advantageously have similar retention values in spite of the different switching current values (latency values) as a result of a precessional spin current injection structure provided in the memory element or memory elements having the lower switching current value.

Abstract: A method of writing data into a memory device comprising utilizing a pipeline to process write operations of a first plurality of data words addressed to a plurality of memory banks, wherein each of the plurality of memory banks is associated with a counter. The method also comprises writing a second plurality of data words and associated memory addresses into an error buffer, wherein the error buffer is associated with the plurality of memory banks and wherein further each data word of the second plurality of data words is either awaiting write verification associated with a bank from the plurality of memory banks or is to be re-written into a bank from the plurality of memory banks. Further, the method comprises maintaining a count in each of the plurality of counters for a respective number of entries in the error buffer corresponding to a respective memory bank.

Abstract: A method of writing data utilizes a pipeline to process write operations of a first plurality of data words addressed to a memory bank. The method also comprises writing a second plurality of data words into an error buffer, wherein the second plurality of data words comprises data words that are awaiting write verification. Additionally, the method comprises searching for at least one data word that is awaiting write verification in the error buffer, wherein verify operations associated with the at least one data word occur in a same row as the write operation. Finally, the method comprises determining if an address associated with any of the at least one data word is proximal to an address for the write operation and preventing a verify operation associated with the at least one data word from occurring in a same cycle as the write operation.

Abstract: A method of writing data into a memory device discloses utilizing a pipeline to process write operations of a first plurality of data words addressed to a memory bank. The method further comprises writing a second plurality of data words into an error buffer, wherein the second plurality of data words comprises data words that are awaiting write verification associated with the memory bank. The method further comprises searching for a data word that is awaiting write verification in the error buffer, wherein the verify operation occurs in a same row as the write operation. The method also comprises determining if an address of the data word is proximal to an address for the write operation and responsive to a positive determination, delaying a start of the verify operation so that a rising edge of the verify operation occurs a predetermined delay after a rising edge of the write operation.

Abstract: A method of writing data into a memory device is disclosed. The method comprises utilizing a pipeline to process write operations of a first plurality of data words addressed to a memory bank and writing a second plurality of data words and associated memory addresses into an error buffer. The method also comprises monitoring a first counter value which tracks a number of write 1 errors and a second counter value which tracks a number of write 0 errors in the memory bank. Further, the method comprises determining if the first counter value and the second counter value have exceeded a predetermined threshold. Responsive to a determination that the first counter value has exceeded the predetermined threshold increasing a write 1 voltage of the memory bank, and, further, responsive to a determination that the second counter value has exceeded the predetermined threshold increasing a write 0 voltage of the memory bank.

Abstract: A method is performed at an electronic device that includes magnetic random access memory (MRAM). The method includes loading the MRAM with data including main data, first error correcting data, and second error correcting data. The MRAM comprises a plurality of MRAM cells characterized by a first magnetic anisotropy corresponding to a first error rate at a predefined temperature that exceeds a threshold for correcting errors using only the first error correcting data. The method further includes, after loading the MRAM with the data, heating the MRAM to the predefined temperature and correcting errors in the main data using both the first error correcting data and the second error correcting data. The method further includes after correcting the errors in the main data, erasing, from the MRAM, the second error correcting data and maintaining, on the MRAM, the first error correcting data.

Abstract: A system and method for testing a magnetic memory cell in a bit cell array to determine whether the electrical resistance values of the memory cell are within acceptable parameters. The system and method allows for the determination of the electrical resistance of the memory cell without parasitic resistance associated with that memory cell in order to accurately determine the electrical resistance of the memory cell.

Abstract: Embodiments of the present invention include multiple independent terminals for a plurality of devices in a stack configuration within a semiconductor. In one embodiment, a multi terminal fabrication process comprises: performing an initial pillar layer formation process to create layers of a multi terminal stack; forming a first device in the layers of the multi terminal stack; forming a second device in the layers of the multi terminal stack; and constructing a set of terminals comprising: a first terminal coupled to the first device, a second terminal coupled to the second device; and a third terminal coupled to the first device; wherein at least two terminals in the set of terminals are independent. The third terminal can be coupled to the second device.

Abstract: A method for manufacturing an array of magnetic memory elements, wherein first memory element types are formed in a first region and second type of magnetic memory element types are formed in a second region. A shadow-mask is used during deposition to limit the deposition of at least one layer of memory element material to only the second region wherein the second memory element types are to be formed. The method can include depositing full film magnetic memory element layers over an entire substrate and then using the shadow-mask to deposit at least one performance altering material in the second memory element region. Alternatively, a first shadow-mask can be used to deposit a series of first memory element layers in a first region, and a second shadow-mask can be used to deposit a plurality of second memory element layers in a second region.

Abstract: A magnet mounting apparatus including a cage, a magnet carriage and first actuator for use in testing Magnetic Tunnel Junction (MTJ) devices. The cage can be configured for mounting to an Automated Test Equipment (ATE). The magnet carriage can be configured for coupling to a wafer test magnet. The first actuator can be coupled between the cage and the magnet carriage. The first actuator can be configured to move the magnet carriage between a first position and a second position along a z-axis. The first position can be configured for locating the wafer test magnet within a predetermined proximity to a Device Under Test (DUT) wafer, and the second position can be configured for replacing a probe card.

Abstract: A magnetic memory array having an epitaxially grown vertical semiconductor selector connected with a two terminal resistive switching memory element via a bottom electrode such as TaN. An electrically conductive contact such as tungsten (W) or TaN can be included between the vertical semiconductor channel and the TaN bottom electrode. The electrically conductive contact and the TaN bottom electrode can both be formed by a damascene process wherein an opening is formed in an oxide layer and a metal is deposited into the opening. A chemical mechanical polishing process can then be performed to remove portions of the metal that extend out of the opening in the oxide layer over the oxide surface.

Abstract: A magnetic memory array having an epitaxially grown vertical semiconductor selector connected with a memory element via a bottom electrode such as TaN. An electrically conductive contact such as tungsten (W) or TaN can be included between the vertical semiconductor channel and the TaN bottom electrode. The electrically conductive contact and the TaN bottom electrode can both be formed by a damascene process wherein an opening is formed in an oxide layer and a metal is deposited into the opening. A chemical mechanical polishing process can then be performed to remove portions of the metal that extend out of the opening in the oxide layer over the oxide surface.

Abstract: An apparatus includes two or more magnetic tunnel junctions (MTJs), including a first MTJ having a first magnetic characteristic and a second MTJ having a second magnetic characteristic. The first magnetic characteristic is distinct from the second magnetic characteristic. The first magnetic characteristic is based on a first magnetic anisotropy and a first offset field on a first storage layer of the first MTJ. The second magnetic characteristic is based on a second magnetic anisotropy and a second offset field on a second storage layer of the second MTJ, The apparatus further includes a metallic separator coupling the first MTJ with the second MTJ, wherein the first MTJ and the second MTJ are arranged in series.

Abstract: A device includes an array of memory cells, input/output lines coupled to the memory cells, and sense amplifiers coupled to the input/output lines. Each sense amplifier is associated with a respective input/output line. The device also includes trim circuits. Each trim circuit is associated with and coupled to a respective sense amplifier. Each sense amplifier receives a respective reference voltage that allows the sense amplifier to sense a bit value of an addressed memory cell. Each trim circuit is operable for compensating for variations in the reference voltage used by the respective sense amplifier.

Abstract: A method for crystalized silicon structures from amorphous structures in a magnetic memory array, wherein the temperature needed to crystalize the amorphous silicon is lower than the temperature budget of the memory element so as to avoid damage to the memory element. An amorphous silicon is deposited, followed by a layer of Ti or Co. An annealing process is then performed which causes the Ti or Co to form TiSi2 or CoSi2 and also causes the underlying amorphous silicon to crystallize.