Abstract: A system for identifying a plurality of components of a vehicle that includes a plurality of non-volatile memories for storing identifiers associated with the plurality of vehicle components, a controller of the plurality of the vehicle components, a communication network configured for connecting the controller to the plurality of memories, and an identifiers memory including a portion to store a list of a plurality of type-approved identifiers associated with the plurality of type-approved vehicle components. The controller receives the identifiers, reads from the portion of the identifiers memory the list of type-approved identifiers, and checks if the identifiers of the plurality of components are included in the list of the type-approved identifiers, and when the controller detects that an identifier associated with a component out of the plurality of components is not included in the list, the controller blocks operation of the component.

Abstract: A method of transmission-reception over a serial bus placed, when idle, in a first state at a first voltage, including: a transmit circuit capable of coding a transmission according to a first protocol in which the respective states of the bits are conditioned by time periods of fixed levels, indifferently in the first state or in a second state at a second voltage smaller than the first one; a receive circuit capable of interpreting a communication according to the first protocol; and a protocol converter, interposed between the bus and the transmit and receive circuits, to convert the signals to be transmitted to a second protocol in which the respective states of the bits are conditioned by respective time periods of fixed levels in the first state, and to convert the received signals from the second protocol to the first protocol.

Abstract: An electromagnetic transponder includes an antenna circuit capable of providing signals to a charge pump. The pump includes a first transistor connected to a first capacitor. The transponder also includes means for applying a voltage alternating between first and second values between the gate and the conduction terminal on the side of the first capacitor of the first transistor.

Abstract: A method and system for detecting and controller wafer surface pressure distribution. Detecting and controlling wafer surface pressure distribution comprises measuring in situ wafer uniformity of a wafer at a plurality of locations of the wafer; and in response to the measured wafer uniformity controlling through a feedback loop in situ CMP head pressure applied at the plurality of locations of the wafer in real time to polish the wafer.

Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.

Abstract: A temperature-current transducer includes first and second voltage dividers, with the first voltage divider including a thermistor in an environment. An operational amplifier has a first input coupled to an intermediate node of the first voltage divider, and a second input coupled to an intermediate node of the second voltage divider. A cascode stage is configured to be biased in a conduction state and is controlled by the operational amplifier. The cascode stage includes a first current terminal coupled to the intermediate node of the second voltage divider. A current mirror is coupled to a second current terminal of the cascode stage, and is configured to mirror on an output line current flowing through the cascode stage that is representative of temperature differences between a temperature in an environment of the thermistor and a reference temperature.

Abstract: A semiconductor device with vertical current flow includes a body having a substrate made of semiconductor material. At least one electrical contact on a first face of the body. A metallization structure is formed on a second face of the body, opposite to the first face. The metallization structure is provided with metal vias, which project from the second face within the substrate so as to form a high-conductivity path in parallel with portions of said substrate.

Abstract: A method for providing a priority-based, low-collision distributed coordination function (DCF) in a wireless network is provided. The network includes an access point and a plurality of stations. The method includes receiving at a first station a super-frame from the access point. The super-frame is operable to define a service period for each of the stations. A priority for the first station is determined based on the super-frame. A back-off time is selected for the first station based on the priority.

Abstract: A circuit for measuring the cross-capacitance of a touch-screen sensor includes a charge amplifier having an input for coupling to the touch-screen sensor and an output for providing a voltage pulse, and a measurement delay chain having an input coupled to the output, and an output for providing a digitized output signal of the voltage pulse width, which is proportional to the value of the cross-capacitance.

Abstract: A heater design for post-process trimming of thin-film transistors is described. The heater incorporates low sheet-resistance material deposited in non-active connecting regions of the heater to reduce heat generation and power consumption in areas distant from active heating members of the heater. The heating members are proximal to a thin-film resistor. The resistance of the thin-film resistor can be trimmed permanently to a desired value by applying short current pulses to the heater. Optimization of a heater design is described. Trimming currents can be as low as 20 mA.

Abstract: A semiconductor device with vertical current flow includes a body having a substrate made of semiconductor material. At least one electrical contact on a first face of the body. A metallization structure is formed on a second face of the body, opposite to the first face. The metallization structure is provided with metal vias, which project from the second face within the substrate so as to form a high-conductivity path in parallel with portions of said substrate.

Abstract: An embodiment of a power-supply controller comprises a switching-control circuit, an error amplifier, and a signal generator. The switching-control circuit is operable to control a switch coupled to a primary winding of a transformer, and the error amplifier has a first input node operable to receive a feedback signal, a second input node operable to receive a comparison signal, and an output node operable to provide a control signal to the switching-control circuit. The signal generator is operable to generate either the feedback signal or the comparison signal in response to a compensation signal that is isolated from a secondary winding of the transformer and that is proportional to a load current through a conductor disposed between the secondary winding and a load.

Abstract: An embodiment of a decoder for decoding a Low-Density Parity-Check encoded input data includes a serial processing unit operating in clock cycles to perform serial update of the layers in the code. Operations of the serial processing unit to produce output data for a current layer are pipelined with acquisition of input data for a next layer, whereby the current layer and the next layer may attempt to use soft output information common to both layers. The serial processing unit is configured for delaying acquisition of input data for the next layer over a number of idle clock cycles. Latency due to the idle clock cycles is minimized by selectively modifying the sequence of layers through the decoding process and the sequence of messages processed by a certain layer.

Abstract: A case for fuel cells including an upper plate formed of a stack of a first insulating board, portions of a first conductive layer, a second insulating board, and a second conductive layer, this stack including windows, fuel cells being placed under the first insulating board at the level of the windows to obstruct them, the stack further comprising first openings filled with a heat-transmitting material forming a contact between the periphery of the fuel cells and the second conductive layer.

Abstract: A method for configuring a memory space, the method including reading a piece of configuration information in the memory space, determining a division of at least one part of the memory space into memory banks according to the configuration information read; and allocating to each of the memory banks an access number to be used to access a data location in the memory bank, in combination with a logic address of the location in the memory bank.

Abstract: An image sequence sensor senses images. To associate a motion vector with an image of the sequence currently being processed, k candidate vectors are generated by adding, to a reference motion vector, respectively k search vectors. Then, a motion vector is selected from among the k candidate vectors as a function of a selection rule. Thereafter, the previous two steps are repeated m times, the reference motion vector being on the one hand, for a first iteration of the first step, an initial reference vector selected from among a set of vectors comprising at least one motion vector associated with a previous processed image and being on the other hand, for the m repetitions of the first step, the motion vector selected in the second step preceding the first step. Then, the vector obtained in the third step is associated with the image currently being processed.

Abstract: An electrical connection support for receiving a semiconductor component includes an electrical connection plate having electrical connection pads. A stand-off structure is provided over the electrical connection pads. The stand-off structure may include a supplementary layer provided on a zone of the electrical connection plate which includes the electrical connection pads of the plate and is outside of a place configured to receive a semiconductor component. The stand-off structure further includes electrical connection vias passing through the supplementary layer. These vias are electrically connected to the electrical connection pads of the plate and have outer faces for making external electrical connection (for example, to another electrical connection support in a stacked structure).

Abstract: A method for manufacturing an insulated semiconductor layer, including: forming a porous silicon layer on a single-crystal silicon surface; depositing an insulating material so that it penetrates into the pores of the porous silicon layer; eliminating the insulating material to expose the upper surface of the porous silicon; and growing by epitaxy a semiconductor layer.

Abstract: A fuel cell device includes a housing containing a fuel processor that generates fuel gas and a fuel cell having electrodes forming an anode and cathode, and an ion exchange electrolyte positioned between the electrodes. The housing can be formed as first and second cylindrically configured outer shell sections that form a battery cell that is configured similar to a commercially available battery cell. A thermal-capillary pump can be operative with the electrodes and an ion exchange electrolyte, and operatively connected to the fuel processor. The electrodes are configured such that heat generated between the electrodes forces water to any cooler edges of the electrodes and is pumped by capillary action back to the fuel processor to supply water for producing hydrogen gas. The electrodes can be formed on a silicon substrate that includes a flow divider with at least one fuel gas input channel that can be controlled by a MEMS valve.

Abstract: A method and a circuit for determining the frame header of a signal that can be applied to standard DVBS2.