Patents Assigned to STMicroelectronics (Grenoble 2) SAS
  • Patent number: 10892201
    Abstract: A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: January 12, 2021
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Malta) Ltd
    Inventors: Jerome Lopez, Roseanne Duca
  • Patent number: 10886210
    Abstract: A cover for an electronic device includes a support body having a through-passage. An optical element which allows light to pass is mounted on said support body in a position extending across the through-passage. A surface of the optical element includes an electrically-conducting track configured as a security detection element. At least two electrical connection leads are rigidly attached to the support body and include first uncovered portions internal to the support body and electrically connected to spaced apart locations on the electrically-conducting track. The at least two electrical connection leads further including second uncovered portions external to said support body. The cover is mounted on a support plate carrying an electronic chip situated in the through-passage at a distance from the optical element.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: January 5, 2021
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventor: Romain Coffy
  • Publication number: 20200402902
    Abstract: An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 24, 2020
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Samuel BOSCHER, Yann REBOURS, Michel CUENCA
  • Publication number: 20200393503
    Abstract: A digital integrated circuit includes first areas of a substrate which incorporate digital functions and second areas of the substrate which are filler between first areas. A capacitance is provided by interdigitated metal-insulator-metal structures formed from a metallization level above the substrate. The structures of the capacitance are vertically aligned with one or more of the second areas.
    Type: Application
    Filed: June 10, 2020
    Publication date: December 17, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventor: Sebastien CLIQUENNOIS
  • Patent number: 10868547
    Abstract: The invention concerns a device including: first and second detectors of the phase and/or of the frequency of an input signal with respect to first and second reference signals; and a Sigma/Delta converter interpreting outputs of the first or of the second phase and/or frequency detector to determine a propagation time of the input signal.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: December 15, 2020
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Nicolas Moeneclaey, Cedric Tubert, Arnaud Authie
  • Patent number: 10865962
    Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having one or more conductive paths arranged to electrically connect the first and second conducting columns when the diffuser is mounted on the barrel.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: December 15, 2020
    Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: Romain Coffy, Jean-Michel Riviere
  • Patent number: 10862874
    Abstract: A CAN device is provided with an encryption function and a decryption function. The encryption function allows messages to be encrypted and put onto a CAN bus. The decryption function allows the messages on the CAN bus to be decrypted. The encryption and decryption functions share keys which change over the course of time.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: December 8, 2020
    Assignees: STMicroelectronics (Grenoble 2) SAS, TECHNOLOGICAL EDUCATIONAL INSTITUTE OF CRETE, Energica Motor Company S.p.A.
    Inventors: Antonio-Marcello Coppola, Georgios Kornaros, Giovanni Gherardi
  • Publication number: 20200381328
    Abstract: A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.
    Type: Application
    Filed: June 1, 2020
    Publication date: December 3, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventor: Didier CAMPOS
  • Publication number: 20200381833
    Abstract: A first independent unit includes a support substrate with an integrated network of electrical connections. An electronic integrated circuit chip is mounted above a front face of the support substrate. A second independent unit includes a dielectric support. The second independent unit is stacked above the first independent unit on a side of the front face of the first independent unit. An electromagnetic antenna includes an exciter element and a resonator element. The exciter element provided at the support substrate. The resonator element is provided at the dielectric support.
    Type: Application
    Filed: June 1, 2020
    Publication date: December 3, 2020
    Applicants: STMicroelectronics SA, STMicroelectronics (Grenoble 2) SAS
    Inventors: Frederic GIANESELLO, Didier CAMPOS
  • Patent number: 10833208
    Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 10, 2020
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon
  • Patent number: 10826880
    Abstract: A CAN device is provided with an encryption function and a decryption function. The encryption function allows messages to be encrypted and put onto a CAN bus. The decryption function allows the messages on the CAN bus to be decrypted. The encryption and decryption functions share keys which change over the course of time.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 3, 2020
    Assignees: STMicroelectronics (Grenoble 2) SAS, TECHNOLOGICAL EDUCATIONAL INSTITUTE OF CRETE, Energica Motor Company S.p.A.
    Inventors: Antonio-Marcello Coppola, Georgios Kornaros, Giovanni Gherardi
  • Patent number: 10817461
    Abstract: A microcontroller includes distinct electronic functions and an interconnection circuit capable of transmitting in wireless fashion data between the functions. The microcontroller can be operated by writing configuration characteristics into a memory of the interconnection circuit for electronic functional circuits that do not have configuration characteristics contained in the memory and erasing configuration characteristics from the memory for electronic functional circuits that have configuration characteristics contained in the memory but are determined to not be able to wirelessly communicate with the interconnection circuit. Data can be wirelessly transmitted between the interconnection circuit and electronic functional circuits having configuration characteristics contained in the memory.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: October 27, 2020
    Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventor: Giovanni Scozzola
  • Publication number: 20200336091
    Abstract: Control over the operation of an electrically-controlled motor is supported by an interface circuit between the electrically-controlled motor and a near-field radio frequency communication controller. The interface circuit includes a first circuit that receives at least one control set point through a near-field radio frequency communication issued by the near-field radio frequency communication controller. A second circuit of the interface generates one or more electric signals in pulse width modulation based on the control set point.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Gwenael MAILLET, Jean-Louis LABYRE, Gilles BAS
  • Patent number: 10811349
    Abstract: An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: October 20, 2020
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SAS
    Inventors: David Auchere, Laurent Schwarz, Deborah Cogoni, Eric Saugier
  • Publication number: 20200311001
    Abstract: A register bank of a channel of a direct memory access circuit is initialized. Transfer cycles are executed as configured by the register bank, and updates are made to the registers from a memory. At each transfer cycle, an operation is performed in accordance with a first field of the register bank to either: carry on the execution or generate a first signal and suspend the execution. In response to each reception of the first signal by a central processing unit, an operation is performed to either: generate a second signal or modify the content of the register band and/or record into the memory a first item representative of a next update of the register bank. A second signal is then generated.
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Francois CLOUTE, Christophe TABA
  • Publication number: 20200312896
    Abstract: A global shutter pixel includes a first transistor and a first switch series-connected between a first node of application of a potential and an internal node of the pixel. A control terminal of the first transistor is coupled to a floating diffusion node of the pixel. At least two assemblies are coupled to the internal node, where each assembly is formed of a capacitor series-connected with a second switch coupling the capacitor to the internal node. A second transistor has a control terminal connected to the internal node and a first conduction terminal coupled to an output node of the pixel. The pixel operation is controlled to store an initialization voltage from the floating diffusion on one of the capacitors and a pixel integration voltage from the floating diffusion on another of the capacitors.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventor: Laurent SIMONY
  • Publication number: 20200312735
    Abstract: A substrate includes a through cavity. A heat sink is mounted so as to close one end of the through cavity. An integrated circuit (IC) chip is also mounted in the cavity. Conductive wires provide an electrical connection between pads on an upper surface of the IC chip and metallizations on the substrate. The mounted heat sink is positioned within the substrate in one implementation and positioned mounted to a back surface of the substrate in another implementation.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Romain COFFY, Alexandre COULLOMB, Olivier FRANIATTE
  • Publication number: 20200303565
    Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 24, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine SAXOD, Veronique FERRE, Agnes BAFFERT, Jean-Michel RIVIERE
  • Publication number: 20200305283
    Abstract: A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.
    Type: Application
    Filed: March 11, 2020
    Publication date: September 24, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Fabien QUERCIA, David AUCHERE, Norbert CHEVRIER, Fabien CORSAT
  • Patent number: 10784858
    Abstract: A driver circuit includes a supply node, a control node configured to receive a control signal, and an output node. An output transistor is coupled to the output node to provide the CAN bus drive signal via the current path through the output transistor. A current mirror is in a current line from the supply node to the output node through the output transistor. The current line includes an intermediate portion between the current mirror and the output transistor. The current mirror is configured to be switched, as a function of the control signal between a first, dominant mode, with the CAN bus drive signal applied to the output node via the output transistor, and a second, recessive mode, with the output transistor providing a high output impedance at the output node.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: September 22, 2020
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: Sergio Lecce, Gilles Troussel