Patents Assigned to STMICROELECTRONICS (GRENOVLE 2) SAS
  • Publication number: 20230282564
    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.
    Type: Application
    Filed: April 24, 2023
    Publication date: September 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Cristiano Gianluca STELLA, Agatino MINOTTI
  • Publication number: 20230280189
    Abstract: A gyroscopic sensor unit detects a phase drift between a demodulated output signal and demodulation signal during output of a quadrature test signal. A delay calculator detects the phase drift based on changes in the demodulated output signal during application of the quadrature test signal. A delay compensation circuit compensates for the phase drift by delaying the demodulation signal by the phase drift value.
    Type: Application
    Filed: May 9, 2023
    Publication date: September 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Luca GUERINONI, Gabriele GATTERE
  • Publication number: 20230280227
    Abstract: A pressure sensor device is provided with: a pressure detection structure made in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. The pressure sensor device is also provided with a heating structure, accommodated in the housing cavity and for allowing heating of the pressure detection structure from the inside of the package.
    Type: Application
    Filed: February 17, 2023
    Publication date: September 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Enri DUQI, Filippo DANIELE, Lorenzo BALDO, Giulio CAPELLI, Salvatore ALONGI
  • Publication number: 20230282757
    Abstract: A device for detecting UV radiation, comprising: a SiC substrate having an N doping; a SiC drift layer having an N doping, which extends over the substrate; a cathode terminal; and an anode terminal. The anode terminal comprises: a doped anode region having a P doping, which extends in the drift layer; and an ohmic-contact region including one or more carbon-rich layers, in particular graphene and/or graphite layers, which extends in the doped anode region. The ohmic-contact region is transparent to the UV radiation to be detected.
    Type: Application
    Filed: March 9, 2023
    Publication date: September 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Simone RASCUNÁ, Gabriele BELLOCCHI, Paolo BADALÁ, Isodiana CRUPI
  • Publication number: 20230283939
    Abstract: The present disclosure is directed to input detection for electronic devices using electrostatic charge sensors. The devices and methods disclosed herein utilize electrostatic charge sensors to detect various touch gestures, such as long and short touches, single/double/triple taps, and swipes; and perform in-ear detection.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Federico RIZZARDINI, Lorenzo BRACCO, Andrea LABOMBARDA, Mauro BARDONE, Stefano Paolo RIVOLTA, Federico IACCARINO
  • Publication number: 20230282727
    Abstract: An HEMT device includes a heterostructure, an insulation layer that extends on the heterostructure and has a thickness along a first direction, and a gate region. The gate region has a first portion that extends through the insulation layer, throughout the thickness of the insulation layer, and has a second portion that extends in the heterostructure. The first portion of the gate region has a first width along a second direction transverse to the first direction. The second portion of the gate region has a second width, along the second direction, that is different from the first width.
    Type: Application
    Filed: February 24, 2023
    Publication date: September 7, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Ferdinando IUCOLANO, Alessandro CHINI
  • Patent number: 11749627
    Abstract: A fan-out wafer level package includes a semiconductor die with a redistribution layer on a sidewall of the semiconductor die. A redistribution layer positioned over the die includes an extended portion that extends along the sidewall. The semiconductor die is encapsulated in a molding compound layer. The molding compound layer is positioned between the extended portion of the redistribution layer and the sidewall of the semiconductor die. Solder contacts, for electrically connecting the semiconductor device to an electronic circuit board, are positioned on the redistribution layer. The solder contacts and the sidewall of the redistribution layer can provide electrical contact on two different locations. Accordingly, the package can be used to improve interconnectivity by providing vertical and horizontal connections.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: September 5, 2023
    Assignee: STMICROELECTRONICS LTD
    Inventors: Endruw Jahja, Cheng-Yang Su
  • Patent number: 11750234
    Abstract: A method for calibrating the DC operating point of a PWM receiver circuit is disclosed. The PWM receiving circuit includes an envelop detector having a first resistor string, and includes a bias circuit having a second resistor string and a plurality of switches. The second resistor string is coupled between a supply voltage and a reference voltage and functions as a voltage divider. Each switch, when closed, accesses a second voltage at a node of the second resistor string connected to the closed switch. To perform the calibration process, the plurality of switches is closed one at a time, and the second voltage is compared with a first voltage at a first node of the first resistor string. The switch that, when closed, produces the smallest difference between the first voltage and the second voltage remains closed after the calibration process, and is used for demodulating the PWM signal.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: September 5, 2023
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Nunzio Spina, Giuseppe Palmisano, Alessandro Castorina
  • Patent number: 11747142
    Abstract: A device including microelectromechanical systems (MEMS) sensors are used in dead reckoning in conditions where Global Positioning System (GPS) signals or Global Navigation Satellite System (GNSS) signals are lost. The device is capable of tracking the location of the device after the GPS/GNSS signals are lost by using MEMS sensors such as accelerometers and gyroscopes. By calculating a misalignment angle between a forward axis of a sensor frame of the device and a forward axis of a vehicle frame using the data received from the MEMS sensors, the device can accurately calculate the location of a user or the vehicle of the device even without the GPS/GNSS signals. Accordingly, a device capable of tracking the location of the user riding in the vehicle in GPS/GNSS signals absent environment can be provided.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 5, 2023
    Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS S.r.l.
    Inventors: Mahaveer Jain, Mahesh Chowdhary, Roberto Mura, Nicola Matteo Palella, Leonardo Colombo
  • Patent number: 11747398
    Abstract: The disclosure relates to a scan chain circuit comprising cascaded flip-flops having a functional input node and a test input node configured to be selectively coupled to logic circuitry at a clock edge time. A clock line is provided configured to distribute one or more clock signals to the flip-flops in the chain, wherein the flip-flops in the chain have active clock edges applied thereto at respective clock edge times. The chain of flip-flops comprise a set of flip-flops configured to receive an edge inversion signal and to selectively invert their active clock edges in response to the edge inversion signal being asserted.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: September 5, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventor: Marco Casarsa
  • Patent number: 11749367
    Abstract: In an embodiment, a method includes: receiving, with a first buffer of a first error compactor unit (ECU), a first error packet associated with a first circuit; receiving, with the first buffer, a second error packet associated with a second circuit; transmitting a first reading request for reading the first error packet; receiving the first reading request with an arbiter of an error aggregator unit (EAU) of a central error management circuit; in response to receiving the first reading request, reading the first error packet from the first buffer, transmitting the first error packet to a controller of the central error management circuit, and transmitting a first acknowledgement to the first ECU; receiving the first acknowledgement with the first ECU; and in response to receiving the first acknowledgement, transmitting a second reading request for reading the second error packet.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: September 5, 2023
    Assignee: STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Vivek Mohan Sharma, Deepak Baranwal, Nicolas Bernard Grossier, Samiksha Agarwal
  • Patent number: 11747908
    Abstract: An embodiment method for controlling at least one functionality of an electronic device on the basis of a gesture of a user comprises detecting, by a sensor, a variation of electrostatic charge of the user during the execution of the gesture and generating a charge variation signal. The gesture includes moving at least one foot upward and, subsequently, downward. The method further includes, by a processing unit, acquiring the charge variation signal, detecting, in the charge variation signal, a characteristic identifying the gesture of moving the foot upward, detecting, in the charge variation signal, a characteristic identifying the gesture of moving the foot downward, and controlling the functionality of the electronic device only in the event that both the first and the second characteristics have been detected.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: September 5, 2023
    Assignee: STMICROELECTRONICS S.R.L
    Inventors: Fabio Passaniti, Enrico Rosario Alessi
  • Patent number: 11750010
    Abstract: A method and apparatus for an active discharge of an X-capacitor are provided. A sensor signal, indicative of a voltage at the capacitor, is compared with a lower and upper threshold values. A first value of a smaller one of the lower and upper threshold values is increased to a first new value that is greater than a second value of a larger one of the lower and upper threshold values in response to a first control signal indicating the sensor signal is greater than the upper and lower threshold values. A third value of the greater one of the lower and upper threshold values is decreased to a second new value that is less than the value of the larger one of the lower and upper threshold values in response to a second control signal indicating the sensor signal is less than the upper and lower threshold values.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: September 5, 2023
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Massimiliano Gobbi, Ignazio Salvatore Bellomo, Domenico Tripodi, Antonio Borrello, Alberto Bianco
  • Publication number: 20230273084
    Abstract: A pressure sensor device has: a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. A piezoelectric transduction structure, of a ultrasonic type, is accommodated in the housing cavity, in order to allow detection of foreign material above the coating material and within the package. In particular, the piezoelectric transduction structure is integrated in the first die, which comprises a first portion, wherein the pressure detection structure is integrated, and a second portion, separate and distinct from the first portion, wherein the piezoelectric transduction structure is integrated.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 31, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Domenico GIUSTI, Enri DUQI
  • Patent number: 11740088
    Abstract: A microelectromechanical gyroscope includes: the support structure; a sensing mass, coupled to the support structure with degrees of freedom along a driving direction and a sensing direction perpendicular to each other; and a calibration structure facing the sensing mass and separated from the sensing mass by a gap having an average width, the calibration structure being movable with respect to the sensing mass so that displacements of the calibration structure cause variations in the average width of the gap. A calibration actuator controls a relative position of the calibration structure with respect to the sensing mass and the average width of the gap.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: August 29, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Luca Guerinoni, Luca Giuseppe Falorni
  • Patent number: 11742437
    Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: August 29, 2023
    Assignees: STMICROELECTRONICS LTD, STMICROELECTRONICS PTE LTD
    Inventors: David Gani, Yiying Kuo
  • Patent number: 11742421
    Abstract: A field effect transistor has a semiconductor layer with a top surface extending in a horizontal plane, and an active area defined in which are trench gate regions, which extend in depth with respect to the top surface and have an insulating coating layer and a conductive inner layer, and source regions, adjacent to the trench gate regions so as to form a conductive channel extending vertically. The trench gate regions have a plurality of first gate regions, which extend in length in the form of stripes through the active area along a first direction of the horizontal plane, and moreover a plurality of second gate regions, which extend in length in the form of stripes through the same active area along a second direction of the horizontal plane, orthogonal to, and crossing, the first gate regions. In particular, the first gate regions and second gate regions cross in the active area, joining with a non-zero curvature radius.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: August 29, 2023
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Salvatore Privitera, Davide Giuseppe Patti
  • Patent number: 11740870
    Abstract: A Multiple Accumulate (MAC) hardware accelerator includes a plurality of multipliers. The plurality of multipliers multiply a digit-serial input having a plurality of digits by a parallel input having a plurality of bits by sequentially multiplying individual digits of the digit-serial input by the plurality of bits of the parallel input. A result is generated based on the multiplication of the digit-serial input by the parallel input. An accelerator framework may include multiple MAC hardware accelerators, and may be used to implement a convolutional neural network. The MAC hardware accelerators may multiple an input weight by an input feature by sequentially multiplying individual digits of the input weight by the input feature.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: August 29, 2023
    Assignees: STMICROELECTRONICS S.r.l., STMicroelectronics International N.V.
    Inventors: Giuseppe Desoli, Thomas Boesch, Carmine Cappetta, Ugo Maria Iannuzzi
  • Publication number: 20230266382
    Abstract: An integrated circuit includes a plurality of power transistor driver channels for driving external loads. The driver channels can be selectively configured as high-side (HS) or low-side (LS) driver channels. The integrated circuit includes, for each driver channel, a respective on-state test circuit and a respective controller. The on-state test circuits can be selectively configured to test for HS overcurrent conditions, LS overcurrent conditions, HS open load conditions, and LS open load conditions.
    Type: Application
    Filed: February 23, 2022
    Publication date: August 24, 2023
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Gaudenzia BAGNATI, Stefano CASTORINA, Valerio BENDOTTI
  • Publication number: 20230266356
    Abstract: The present disclosure is directed to micro-electromechanical system (MEMS) accelerometers that are configured for a user interface mode and a true wireless stereo (TWS) mode of an audio device. The accelerometers are fabricated with specific electromechanical parameters, such as mass, stiffness, active capacitance, and bonding pressure. As a result of the specific electromechanical parameters, the accelerometers have a resonance frequency, quality factor, sensitivity, and Brownian noise density that are suitable for both the user interface mode and the TWS mode.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Francesco RIZZINI, Nicolo' MANCA, Cristian DALL'OGLIO