Abstract: Disk drive spindle jitter is comprised of electrical noise, error due to pair pole asymmetry, and random disk speed variances. Error caused by pair pole asymmetry can be identified and compensated for by detecting over a single rotation of a rotor a plurality of zero cross signals. These signals can be statistically analyzed over a period of a plurality of revolutions of the rotor so as to identify the systematic error caused by pair poles. Once identified, this pair pole error can be used to modify zero cross signals and/or modify commutation signal driving the disk so as to arrive at a more accurate determination of disk speed and to precisely control the speed of the disk.

Abstract: To optimize the performance of DSL modems in the same cable bundle, the size and position of the group of subcarriers used for transmission is intelligently selected when the bit rate necessary for making the transmission is less than the total available bandwidth provided by all subcarriers. By intelligently selecting a minimum number of subcarriers for Digital Multi-tone (DMT) signal transmission, a reduction in line driver power consumption is effectuated. Additionally, by intelligently selecting the position of the groups of subcarriers within the total available subcarriers, near-end crosstalk (NEXT) noise within the cable bundle may be minimized.

Abstract: In an embodiment, a channel estimator includes first and second stages. The first stage is operable to generate a respective one-dimensional array of first channel-estimation coefficients for each communication path of a communication channel, and the second stage is operable to generate a multi-dimensional array of second channel-estimation coefficients in response to the first channel-estimation coefficients. For example, such a channel estimator may estimate the response of a channel over which propagates an orthogonal-frequency-division-multiplexed (OFDM) signal that suffers from inter-carrier interference (ICI) due to Doppler spread. Such a channel estimator may estimate the channel response more efficiently, and with a simpler algorithm, than conventional channel estimators.

Abstract: An electronic system, an integrated circuit and a method for display are disclosed. The electronic system contains a first device, a memory and a video/audio compression/decompression device such as a decoder/encoder. The electronic system is configured to allow the first device and the video/audio compression/decompression device to share the memory. The electronic system may be included in a computer in which case the memory is a main memory. Memory access is accomplished by one or more memory interfaces, direct coupling of the memory to a bus, or direct coupling of the first device and decoder/encoder to a bus. An arbiter selectively provides access for the first device and/or the decoder/encoder to the memory based on priority. The arbiter may be monolithically integrated into a memory interface. The decoder may be a video decoder configured to comply with the MPEG-2 standard. The memory may store predicted images obtained from a preceding image.

Abstract: An embedded MEMS semiconductor substrate is set forth and can be a starting material for subsequent semiconductor device processing. A MEMS device is formed in a semiconductor substrate, including at least one MEMS electrode and a buried silicon dioxide sacrificial layer has been applied for releasing the MEMS. A planarizing layer is applied over the substrate, MEMS device and MEMS electrode. A polysilicon protection layer is applied over the planarizing layer. A silicon nitride capping layer is applied over the polysilicon protection layer. A polsilicon seed layer is applied over the polysilicon nitride capping layer. The MEMS device is released by removing at least a portion of the buried silicon dioxide sacrificial layer and an epitaxial layer is grown over the polysilicon seed layer to be used for subsequent semiconductor wafer processing.

Abstract: A system and method for determining the start position of a motor. According to an embodiment, a voltage pulse signal may be generated across a pair of windings in a motor. A current response signal will be generated and based upon the position of the motor, the response signal will be greater in one pulse signal polarity as opposed to an opposite pulse signal polarity. The response signal may be compared for s specific duration of time or until a specific integration threshold has been reached. Further, the response signal may be converted into a digital signal such that a sigma-delta circuit may smooth out glitches more easily. In this manner, the position of the motor may be determined to within 60 electrical degrees during a startup.

Abstract: A smart card device includes a card body; and a plurality of card contacts carried by the card body. A smart card chip circuit includes a processor carried by the card body and operably connected to the contacts. At least one memory stores a set of instructions relating to initiating and completing smart card transactions between the smart card device and a smart card host. A biometric circuit is carried by the card body and operable with the processor and used for verifying identity of a user for subsequent smart card device usage. Power is received through a first contact for powering a power circuit for the smart card and a biometric subsystem power circuit receives power through a second contact.

Abstract: In a method for driving electronic devices connected to a vehicle trailer tow connector a trailer electronic device control signal is receiving from a vehicle data communication network. In response to the received control signal, a solid state power control device is switched to connect electrical power to a selected pin of the trailer tow connector. The trailer electronic device control signal may be received from a wiring harness connector connected to a vehicle data communication network. A vehicle trailer tow connector module includes a module housing. A vehicle wiring connector and a trailer wiring connector are coupled to the module housing. A power control circuit is connected to a selected pin in the trailer wiring connector. A controller circuit is coupled to the vehicle wiring connector for receiving communication data from a vehicle data bus, and coupled by control lines to the power control circuit.

Abstract: A dryer having an improved automatic dryness detection circuit is provided. Wet clothing in the dryer bin contacts a sensor and causes a pulse to be sent to a microcontroller if the resistance of the clothes is low enough. The microcontroller disregards pulses which are shorter than a threshold time and counts pulses which are longer than a threshold time. The microcontroller issues a termination signal if the rate of pulses is lower than a threshold rate.

Abstract: A method for interoperations between single-radio (channel switching) devices and single-radio (always-on) devices includes single-radio (always-on) devices keep announcing safety messages on the safety channel at any time and keep monitoring packet transmissions on the safety channel at all times when it not transmitting in a normal mode; single-radio (channel switching) devices announce safety messages on the safety channel and keep monitoring packet transmissions on the safety channel during a safety channel interval; and once a single-radio (always-on) device detects the existence of a single-radio (channel-switching) device after successfully receiving at least one safety message transmitted by the single-radio (channel-switching) device during the safety channel interval, it enters to an interoperation mode, in which the single-radio (always-on) device shall transmit safety messages at least during the safety channel interval of the single-radio (channel-switching) device.

Abstract: A device and method are provided for detecting a root moisture content of clothing in a clothes dryer. The dryer has two conducting bars situated in the dryer bin. A pulse generator circuit is coupled to the conducting bars. A microcontroller is coupled to an output of the pulse generator circuit. The pulse generator circuit generates a pulse when wet clothing contacts the conducting bars in the dryer bin. The microcontroller receives the pulses and counts the pulses that are longer than a threshold length. The microcontroller issues a termination signal based on the number of counted pulses.

Abstract: A microfabricated structure that includes a first layer of material on a substrate, and a second layer of material over the first layer that forms an encapsulated cavity, and a structural support layer added to the second layer. Openings can be formed in the cavity, and the cavities can be layered side by side, vertically stacked with interconnections via the openings, and a combination of both can be used to construct stacked arrays with interconnections throughout.

Abstract: A substrate clamp ring has an edge exclusion lip with a variable bottom surface. At least a portion of that bottom surface has a height above the substrate contact level selected to minimize accumulation over time of deposited aluminum-copper alloy across lower portions of the bottom surface, and to allow the aluminum-copper alloy to be deposited to a thickness of at least 2 microns on each of a predetermined number of substrates without bridging. The height of the bottom surface at an innermost edge of the lip is preferably about 17 mils, while a height of the bottom surface over the substrate edge is preferably about 8.5 mils.

Abstract: A communication signal carrier on a communication channel in a digital cable receiver can be characterized as analog without exhaustively attempting to determine a symbol rate or modulation scheme of a digital carrier. The signal level in the channel is observed at different channel bandwidths, and these observations are used to differentiate between analog and digital carriers.

Abstract: A method is provided. The method comprises calibrating noise prediction parameters by adapting one or more biases, adapting one or more filter coefficients using the adapted one or more biases, and adapting one or more prediction error variances using the adapted one or more biases and the adapted one or more filter coefficients.

Abstract: A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing asse

Abstract: A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.

Abstract: A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.

Abstract: A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.

Abstract: A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembl