Abstract: An oscillating analog signal includes a succession of dampened oscillations. That oscillating analog signal is conditioned to generate an output signal including only oscillations of the oscillating analog signal which have an amplitude smaller than a first threshold. The output signal is then processed by a processing unit, where the first threshold is compatible with a maximum level of voltage tolerable by the processing unit.

Abstract: Method for generation of electrical power within a three-dimensional integrated structure comprising several elements electrically intercoupled by a link device, the method comprising the production of a temperature gradient in at least one region of the link device resulting from the operation of at least one of the said elements and the production of electrical power using at least one thermo-electric generator comprising at least one assembly of thermocouples electrically coupled in series and thermally coupled in parallel and contained within the said region subjected to the said temperature gradient.

Abstract: A first electronic device includes a first near-field communication antenna and a second near-field communication antenna. The first and second near-field communication antennas of the first electronic device are alternately activated. The first antenna is dedicated to supporting communication between the first electronic device and a second electronic device. The second antenna is dedicated to support charging of the second electronic device.

Abstract: First and second wells are formed in a semiconductor substrate. First and second trenches in the first second wells, respectively, each extend vertically and include a central conductor insulated by a first insulating layer. A second insulating layer is formed on a top surface of the semiconductor substrate. The second insulating layer is selectively thinned over the second trench. A polysilicon layer is deposited on the second insulating layer and then lithographically patterned to form: a first polysilicon portion over the first well that is electrically connected to the central conductor of the first trench to form a first capacitor plate, a second capacitor plate formed by the first well; and a second polysilicon portion over the second well forming a floating gate electrode of a floating gate transistor of a memory cell having an access transistor whose control gate is formed by the central conductor of the second trench.

Abstract: A method of controlling the execution of a payment application by a mobile terminal, in near field communication with a payment device. The method includes transmitting an application selection request to the payment device, and verifying the application identifier received from the payment device against a list of authorized applications. The verification is performed by the circuit having the application selection request transiting therethrough.

Abstract: An integrated circuit includes a first domain supplied with power at a first supply voltage. A first transistor comprising in the first domain includes a first gate region and a first gate dielectric region. A second domain is supply with power at a second supply voltage and includes a second transistor having a second gate region and a second gate dielectric region, the second gate region being biased at a voltage that is higher than the first supply voltage. The first and second gate dielectric regions have the same composition, wherein that composition configures the first transistor in a permanently turned off condition in response to a gate bias voltage lower than or equal to the first supply voltage. The second transistor is a floating gate memory cell transistor, with the second gate dielectric region located between the floating and control gates.

Abstract: A semiconductor wafer includes first zones containing integrated circuits, each first zone including a substrate and a sealing ring at a periphery of the substrate. The first zones are separated from each other by second zones defining cutting lines or paths. The integrated circuit includes an electrically conductive fuse that extends between a first location inside the integrated circuit and a second location situated outside the integrated circuit beyond one of the cutting lines. This electrically conductive fuse includes a portion that passes through the sealing ring and another portion that straddles the adjacent cutting line. The portion of the fuse that passes through is electrically isolated from the sealing ring and from the substrate. The straddling portion is configured to be sliced, when cutting the wafer along the cutting line, so as to cause the fuse to change from an electrical on state to an electrical off state.

Abstract: A method includes simultaneously controlling several transistors by a first signal and separately controlling the transistors by distinct second pulsed signals.

Abstract: In a non-volatile memory of a microcontroller, first information representative of a value selected among at least four values is stored. Furthermore, for each of a plurality of areas of the memory, second information representative of a type selected among two types is also stored. Access to each of the areas is conditioned according to the selected value and to the type of the area.

Abstract: A non-volatile memory integrated circuit has a memory plane organized into rows and into columns containing bit lines. The read amplifiers for each bit line are configured to generate an output signal on a read data channel. The read data channels respectively run through the memory plane along each bit line. Each read data channel is connected to all of the read amplifiers of the respective bit line.

Abstract: In an embodiment, a circuit includes a supply terminal, a reference terminal, a logic circuit coupled between the supply terminal and the reference terminal, and an auxiliary circuit coupled to the logic circuit. The auxiliary circuit includes a plurality of switches configured to be controlled to produce random criterions. Each random criterion causes, on each transition of an output signal of the logic, an attenuation of a current flowing between a supply terminal of the circuit and a reference terminal of the circuit; or an increase of the current flowing between the supply terminal of the circuit and the reference terminal of the circuit; or an additional current flowing through the logic circuit on a current path not passing through the supply terminal; or no change in the current flowing between the supply terminal of the circuit and the reference terminal of the circuit.

Abstract: A method of managing the power supply of one or more first elements by a second element of a same first device, includes the steps of: sending, to a second device, a time extension request; evaluating during the time extension a power available from an electromagnetic field radiated by the second device; and adjusting the power supply of the second element and of the first element(s) according to the available power.

Abstract: An electronic integrated circuit chip includes a semiconductor substrate with a front side and a back side. A first reflective shield is positioned adjacent the front side of the semiconductor substrate and a second reflective shield is positioned adjacent the back side of the semiconductor substrate. Photons are emitted by a photon source to pass through the semiconductor substrate and bounce off the first and second reflective shields to reach a photon detector at the front side of the semiconductor substrate. The detected photons are processed in order to determine whether to issue an alert indicating the existence of an attack on the electronic integrated circuit chip.

Abstract: A method of manufacturing a MOS transistor includes forming a conductive first gate and forming insulating spacers along opposite sides of the gate, wherein the spacers are formed before the gate.

Abstract: An operational amplifier integrated circuit includes a differential pair of transistors having a first input, a second input. A bias current generator applies a bias current to an output of the differential pair of transistors. A control loop generates a control voltage arising from a difference in potentials between the first input and the second input. An additional current that is added to the bias current is generated in response to the control voltage.

Abstract: An EEPROM includes a floating gate transistor having a source region, a channel region and a drain region. A first capa implant zone on a drain-side of the floating gate transistor has a first dopant concentration level. A second capa implant zone in the first capa implant zone adjacent the drain region has a second dopant concentration level that is greater than the first dopant concentration level. A gate oxide region insulates the floating gate electrode from the channel region, first capa implant zone and second capa implant zone. A thickness of the gate oxide region is thinner at the second capa implant zone than at the channel region and first capa implant zone.

Abstract: A memory cell includes a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element. The memory cell is formed in a wafer comprising a semiconductor substrate covered with a first insulating layer, the insulating layer being covered with an active layer made of a semiconductor. The gate is formed on the active layer and has a lateral flank covered with a second insulating layer. The variable-resistance element includes a first layer covering a lateral flank of the active layer in a trench formed through the active layer along the lateral flank of the gate and reaching the first insulating layer, and a second layer made of a variable-resistance material.

Abstract: A device includes a MOS transistor and a bipolar transistor at a same first portion of a substrate. The first portion includes a first well doped with a first type forming the channel of the MOS transistor and two first regions doped with a second type opposite to the first type that are arranged in the first well which form the source and drain of the MOS transistor. The first portion further includes: a second well doped with the second type that is arranged laterally with respect to the first well to form the base of the bipolar transistor; a second region doped with the first type that is arranged in the second well to form the emitter of the bipolar transistor; and a third region doped with the first type that is arranged under the second well to form the collector of the bipolar transistor.

Abstract: A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Abstract: An electronic device includes: a non-volatile memory configured to store data including encrypted data; and a digital circuit. The digital circuit includes: a microprocessor configured to access the non-volatile memory and an internal memory; and a decryption circuit arranged on an interconnect network identifying an internal data path for exchanging the data between the non-volatile memory and the microprocessor, and connected to a memory controller of the non-volatile memory for receiving blocks of data from the non-volatile memory, the decryption circuit being configured to: perform a decryption on the fly of blocks of the data read from the non-volatile memory to obtain read decrypted data; generate first decryption masks corresponding to first blocks of data being read from the non-volatile memory at a given read address; and generate second decryption masks corresponding to second blocks of data to be read from the non-volatile memory at a next estimated read address.