Abstract: A method includes receiving a selection signal from a third-party device and a status signal from the third-party device. A data signal from the third-party device is latched when both the selection signal and the status signal are active. In addition, a second selection signal and a second status signal can be received from a second third-party device and a second data signal latched when both the second selection signal and the second status signal are active.

Abstract: An electronic device includes a stack of a first level having a SPAD, a second level having a quench circuit for said SPAD, and a third level having a circuit for processing data generated by said SPAD. A method for making the device includes: a) forming of the first level; b) bonding, on the first level, by molecular bonding, of a stack of layers including a semiconductor layer; and c) forming the quench circuit of the second level in the semiconductor layer.

Abstract: The disclosure relates to integrated circuits including one or more rows of transistors and methods of forming rows of transistors. In an embodiment, an integrated circuit includes a row of bipolar transistors including a first semiconductor layer having a plurality of first conduction regions, a second semiconductor layer having a second conduction region, a common base between the first semiconductor layer and the second semiconductor layer, and a plurality of insulator walls extending in a first direction. The first conduction regions are separated from one another by the insulator walls. The integrated circuit further includes an insulating trench extending in a second direction and in contact with each of the bipolar transistors of the row of bipolar transistors. A conductive layer is coupled to the base, and the conductive layer extends through the insulator walls and extends at least partially into the insulating trench.

Abstract: The disclosure concerns an electronic device and methods of making an electronic device. The electronic device includes a circuit that is at least partially formed in an active region of a substrate. An electronic package is stacked on the substrate. A via extends through the circuit from the active region of the substrate to a surface of the substrate that is opposite the active region. At least one contacting element connects the via to the electronic package.

Abstract: A filtering circuit for filtering a pulse width modulated (PWM) signal includes a D flip-flop having an input terminal configured to be coupled to a logic high signal and having an output terminal coupled to an output terminal of the filtering circuit; and a circuit coupled between an input terminal of the filtering circuit and the D flip-flop, the circuit configured to, for a first pulse of the PWM signal having a duty cycle within a pre-determined range: generate a positive pulse at a clock terminal of the D flip-flop as a clock signal of the D flip-flop; and generate a negative pulse at a reset terminal of the D flip-flop as a reset signal of the D flip-flop, wherein a duration between a rising edge of the positive pulse and a falling edge of the negative pulse is equal to a duration of the first pulse of the PWM signal.

Abstract: A touch-screen-controller (TSC) performs mutual sensing to acquire touch strength values from a touch matrix formed by capacitively intersecting conductive lines. For each line, the TSC generates an emulated self capacitance value from an associated touch strength value based upon a position of that line compared to a location on the touch matrix adjacent to which a first touch type is expected to occur, and determines presence of the first touch type adjacent to the touch matrix based upon the emulated values. The emulated values for each conductive line may be weighted based upon its closeness to the location where the first touch type is expected to occur. The weighting may be zero if its associated conductive line is outside of the location where the first touch type is expected to occur, and may be one if inside of the location where the first touch type is expected to occur.

Abstract: An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.

Abstract: An oscillatory electric signal having an oscillation frequency is processed by time-sampling to generate a sampled oscillatory electric signal. A nonlinear circuit driven by the sampled oscillatory electric signal outputs a hysteretic response signal as a function of the sampled oscillatory electric signal. The hysteretic response signal has a frequency in a first frequency range as a result of an increase in the oscillation frequency of the oscillatory electric signal, and a frequency in a second frequency range as a result of a decrease in the oscillation frequency of the oscillatory electric signal. A detection circuit processes the hysteretic response signal to compute an envelope signal of the hysteretic response signal, perform a comparison of the envelope signal with a threshold, and produce a signal indicative of an increase or a decrease in the oscillation frequency of the oscillatory electric signal as a result of the outcome of the comparison.

Abstract: An electronic assembly includes a board and a system mounted to the board. The system includes an impedance matching circuit coupled to a contactless component. A detection circuit operates to carrying out a process for detecting on the board of potential faults in the system mounted to the board. The detection circuit includes a circuit incorporated into the contactless component itself and configured to carrying out a first part of the process for detecting. A processing circuit of the detection circuit performs a second part of the process for detecting based on results of the first part.

Abstract: A device includes a current source, a first transistor connected between a first supply rail and an output terminal, and a second transistor connected between the output terminal and a first terminal of the current source, wherein a second terminal of the current source is connected to a second supply rail. A variable-gain amplifier circuit responds to a potential at the first terminal of the current source by applying a potential to the control terminal of the first transistor. A gain of the amplifier circuit is determined by a potential at the output terminal.

Abstract: An image projection device, such as a pico projector or LCD projector, includes image projection circuitry configured to generate a light beam having a power. The image projection circuitry projects the light beam onto and focuses the light beam on a projection surface located an imaging distance from the image projection circuitry. A time-of-flight sensor is configured to sense the imaging distance between the image projection circuitry and the projection surface and to generate an imaging distance signal indicating the sensed imaging distance. Control circuitry is coupled to the image projection circuitry and to the time-of-flight sensor and is configured to adjust the power and the focus of the light beam based upon the imaging distance signal.

Abstract: A synchronous rectifier driver circuit is configured to drive a synchronous rectifier FET and includes a first terminal configured to be connected to a source terminal of the synchronous rectifier FET. A second terminal is configured to be connected to a drain terminal of the synchronous rectifier FET, and a third terminal is configured to be connected to a gate terminal of the synchronous rectifier FET. The synchronous rectifier driver circuit is configured to measure the voltage between the second terminal and the first terminal, and detect a switch-on instant in which the measured voltage reaches a first threshold value and a switch-off instant in which the measured voltage reaches a second threshold value. The synchronous rectifier driver circuit generates a drive signal between the third terminal and the first terminal as a function of the measured voltage.

Abstract: A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.

Abstract: A semiconductor substrate includes a doped region having an upper surface. The doped region may comprise a conduction terminal of a diode (such as cathode) or a transistor (such as a drain). A silicide layer is provided at the doped region. The silicide layer has an area that only partially covers an area of the upper surface of the doped region. The partial area coverage facilitates modulating the threshold voltage and/or leakage current of an integrated circuit device.

Abstract: A device of protection against electrostatic discharges is formed in a semiconductor substrate of a first conductivity type that is coated with a semiconductor layer of a second conductivity type. A buried region of the second conductivity type is positioned at an interface between the semiconductor substrate and the semiconductor layer. First and second wells of the first conductivity type are formed in the semiconductor layer and a region of the second conductivity type is formed in the second well. A stop channel region of the second conductivity type is provided in the semiconductor layer to laterally separating the first well from the second well, where no contact is present between this stop channel region and either of the first and second wells.

Abstract: A method of compensating electromagnetic emissions of a device for use in a communication bus, the method including: transmitting a test signal over the communication bus; receiving, at the device, the test signal after propagation over the communication bus; performing frequency analysis processing of the test signal received to detect a set of harmonic components of the test signal received having an amplitude exceeding a certain threshold; storing respective values of frequency of harmonic components in the set of harmonic components having an amplitude exceeding the certain threshold; and generating and transmitting over the communication bus a set of compensation signals, each compensation signal in the set of compensation signals being a sinusoidal signal having a respective frequency equal to one of the frequencies stored, and being in anti-phase with respect to the harmonic component of the test signal received having the respective frequency.

Abstract: A touch screen controller includes an input stage configured to receive and condition a touch output from a touch matrix to produce a touch signal. An accumulation stage is configured to receive the touch signal and accumulate the touch signal to produce an accumulated output. The accumulated output is digitized by an analog to digital converter to produce a touch strength value. A given amount of charge is subtracted from or added to accumulated output during a next accumulation if the touch strength value is greater than an upper threshold or less than a lower threshold. This avoids saturation of components in the touch screen controller and therefore increases the signal to noise ratio.

Abstract: A semiconductor substrate has a back face and a front face and includes a semiconductor well that is electrically isolated from the semiconductor substrate. A device is configured to detect a thinning of the semiconductor substrate from the back face. The device includes at least one trench that extends within the semiconductor well between two peripheral locations from the front face down to a location situated at a distance from a bottom of the semiconductor well. The trench is electrically isolated from the semiconductor well. A detection circuit is configured to measure a physical quantity representative of well electrical resistance between two contact areas respectively situated on either side of the at least one first trench.

Abstract: An electronic envelope detection circuit includes an input signal detecting circuit having at least one MOS transistor configured to receive a radiofrequency input signal and to deliver an internal signal on the basis of the input signal. The biasing point of the at least one transistor is controlled by the input signal and a control signal. A processing circuit that is coupled to the input signal detecting circuit is configured to deliver a low-frequency output signal on the basis of the internal signal and further deliver the control signal on the basis of the output signal. In operation, the value of the control signal decreases when the average power of the input signal increases, and vice versa.

Abstract: A bipolar transistor includes a collector. The collector is formed by: a first portion of the collector which extends under an insulating trench, and a second portion of the collector which crosses through the insulating trench. The first and second portions of the collector are in physical contact.