Abstract: In accordance with an embodiment, a method includes receiving an enable signal. After the enable signal is asserted, it is determined whether a soft-start capacitor is electrically connected to an input of a ramp generator circuit while keeping an output of the ramp generator circuit low. If the soft-start capacitor is electrically connected to the input of the ramp generator circuit, a first current is injected into the input of the ramp generator circuit to generate a first voltage ramp at the output of the ramp generator circuit. If the soft-start capacitor is not electrically connected to the input of the ramp generator circuit, a second current is injected to the input of the ramp generator circuit to generate a second voltage ramp at the output of the ramp generator circuit. The second current is smaller than the first current.

Abstract: Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include compressive-strained SiGe on a silicon substrate, while the nFETs include tensile-strained silicon on a strain-relaxed SiGe substrate. Adjacent n-type and p-type FinFETs are separated by electrically insulating regions formed by a damascene process. During formation of the insulating regions, the SiGe substrate supporting the n-type devices is permitted to relax elastically, thereby limiting defect formation in the crystal lattice of the SiGe substrate.

Abstract: A high voltage driving circuit for driving a load receives a low voltage input signal and generates a high voltage output signal. A short circuit protection circuit including a first electronic switch operated by the low voltage input signal and a second electronic switch operated by a low voltage signal obtained by a voltage division of the output high voltage signal. The first electronic switch causing a first pull-up current to be sent to a capacitive element whose voltage controls an input of a threshold comparator. A second electronic switch causes a second pull-down current to be drawn from the capacitive element whose voltage controls the input of the threshold comparator. A short circuit detection signal is generated at an output of said threshold comparator, indicating a short circuit and capable of inhibiting operation of the driving circuit.

Abstract: An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip.

Abstract: A semiconductor die is attached to a die pad of a leadframe. The semiconductor die attached to the die pad is arranged in a molding cavity between complementary first and second mold portions. Package material is injected into the molding cavity via at least one injection channel provided in one of the complementary first and second mold portions. Air is evacuated from the molding cavity via at least one air venting channel provided in the other of the complementary first and second mold portions. An exit from the at least one air venting channel may be blocked by a retractable stopper during the injection of the package material.

Abstract: A bipolar transistor includes a stack of an emitter, a base, and a collector. The base is structured to have a comb shape including fingers oriented in a plane orthogonal to a stacking direction of the stack.

Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.

Abstract: At least one semiconductor chip or die is held within at a chip retaining formation provided in a chip holding device. The chip holding device is then positioned with the at least one semiconductor chip or die arranged facing a chip attachment location in a chip mounting substrate. This positioning produces a cavity between the at least one semiconductor chip or die arranged at the chip retaining formation and the chip attachment location in the chip mounting substrate. A chip attachment material is dispensed into the cavity. Once cured, the chip attachment material attaches the at least one semiconductor chip or die onto the substrate at the chip attachment location in the chip mounting substrate.

Abstract: A microelectromechanical system (MEMS) gyroscope sensor has a sensing mass and a quadrature error compensation control loop for applying a force to the sensing mass to cancel quadrature error. To detect fault, the quadrature error compensation control loop is opened and an additional force is applied to produce a physical displacement of the sensing mass. A quadrature error resulting from the physical displacement of the sensing mass in response to the applied additional force is sensed. The sensed quadrature error is compared to an expected value corresponding to the applied additional force and a fault alert is generated if the comparison is not satisfied.

Abstract: A memory management circuit stores information indicative of reliability-types of regions of a memory array. The memory management circuitry responds to a request to allocate memory in the memory array to a process by determining a request type associated with the request to allocate memory. Memory of the memory array is allocated to the process based on the request type associated with the request to allocate memory and the stored information indicative of reliability-types of regions of the memory array. The memory array may be a shared memory array. The memory array may be organized into rows and columns, and the regions of the memory array may be the rows of the memory array.

Abstract: A method for operating a differential memory includes: operating a main memory module differentially while executing a first program; copying first logic data from a first submodule of the main memory module to an auxiliary memory module; storing third logic data associated with a second program in a second submodule of the main memory module by overwriting second logic data associated with the first program, while maintaining the first logic data contained in the first submodule of the main memory module unaltered, where the second logic data are complementary to the first logic data; when a request for reading the first logic data is received during the storing of the third logic data in the second submodule of the main memory module, reading the first logic data from the auxiliary memory module; and executing the first or second programs by operating the main memory module in single-ended mode.

Abstract: A charge pump circuit generates a charge pump output signal at a first node and is enabled by a control signal. A diode has an anode coupled to the first node and a cathode coupled to a second node. A current mirror arrangement sources a first current to the second node and sinks a second current from a third node. A comparator causes the control signal to direct the charge pump circuit to generate the charge pump output signal as having a voltage that ramps upwardly in magnitude (but negative in sign) if the voltage at the second node is greater than the voltage at the third node, and causes the control signal to direct the charge pump circuit to cease the ramping of the voltage of the charge pump output signal if the voltage at the second node is at least equal to the voltage at the third node.

Abstract: A PWM signal generator circuit includes a multiphase clock generator that generates a number n of phase-shifted clock phases having the same clock period and being phase shifted by a time corresponding to a fraction 1/n of the clock period. The PWM signal generator circuit determines for each switch-on duration first and second integer numbers, and for each switch-off duration third and fourth integer numbers. The first integer number is indicative of the integer number of clock periods of the switch-on duration and the second integer number is indicative of the integer number of the additional fractions 1/n of the clock period of the switch-on duration. The third integer number is indicative of the integer number of clock periods of the switch-off duration, and the fourth integer number is indicative of the integer number of the additional fractions 1/n of the clock period of the switch-off duration.

Abstract: A semiconductor image sensor includes a plurality of pixels. Each pixel of the sensor includes a semiconductor substrate having opposite front and back sides and laterally delimited by a first insulating wall including a first conductive core insulated from the substrate, electron-hole pairs being capable of forming in the substrate due to a back-side illumination. A circuit is configured to maintain, during a first phase in a first operating mode, the first conductive core at a first potential and to maintain, during at least a portion of the first phase in a second operating mode, the first conductive core at a second potential different from the first potential.

Abstract: The physically unclonable function device (DIS) comprises a set of MOS transistors (TR1i, TR2j) mounted in diodes having a random distribution of respective threshold voltages, and comprising N first transistors and at least one second transistor. At least one output node of the function is capable of delivering a signal, the level of which depends on the comparison between a current obtained using a current circulating in the at least one second transistor and a current obtained using a reference current that is equal or substantially equal to the average of the currents circulating in the N first transistors. A first means (FM1i) is configured to impose on each first transistor a respective fixed gate voltage regardless of the value of the current circulating in the first transistor, and a second means (SM2j) is configured to impose a respective fixed gate voltage on each second transistor regardless of the value of the current circulating in the second transistor.

Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Abstract: A semiconductor substrate has a trench extending from a front surface and including a lower part and an upper part. A first insulation layer lines the lower part of the trench, and a first conductive material in the lower part is insulated from the semiconductor substrate by the first insulating layer to form a field plate electrode of a transistor. A second insulating layer lines sidewalls of the upper part of said trench. A third insulating layer lines a top surface of the first conductive material at a bottom of the upper part of the trench. A second conductive material fills the upper part of the trench. The second conductive material forms a gate electrode of the transistor that is insulated from the semiconductor substrate by the second insulating layer and further insulated from the first conductive material by the third insulating layer.

Abstract: Disclosed herein is an ambient light sensor formed by a substrate, and an inner central area defined on the substrate, and a concentric polygonal shape defined on the substrate about the inner central area. The concentric polygonal shape is defined by concentric polygonal isolation regions and spoke shaped isolation regions extending through respective corners of the concentric polygonal isolation regions to the inner central area to thereby divide the concentric polygonal shape into a plurality of concentric polygonal regions, with each of the plurality of concentric polygonal regions divided into a plurality of trapezoidal sections. A plurality of photodiodes ae formed on the substrate such that each of the plurality of trapezoidal sections contains at least one photodiode. A color filter is applied to the plurality of trapezoidal sections and their respective photodiodes to thereby form a plurality of color channels.

Abstract: A three-dimensional integrated structure is formed by a first substrate with first components oriented in a first direction and a second substrate with second components oriented in a second direction. An interconnection level includes electrically conducting tracks that run in a third direction. One of the second direction and third direction forms a non-right and non-zero angle with the first direction. An electrical link formed by at least one of the electrically conducting tracks electrically connected two points of the first or of the second components.

Abstract: At least one bipolar transistor and at least one variable capacitance diode are jointly produced by a method on a common substrate.