Patents Assigned to Strasbaugh
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Patent number: 9610669Abstract: A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.Type: GrantFiled: September 30, 2013Date of Patent: April 4, 2017Assignee: StrasbaughInventors: Thomas A. Walsh, Larry A. Spiegel
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Patent number: 9457446Abstract: A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.Type: GrantFiled: September 30, 2013Date of Patent: October 4, 2016Assignee: StrasbaughInventors: Thomas E. Brake, William J. Kalenian, David L. Grant
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Patent number: 9393669Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.Type: GrantFiled: January 11, 2013Date of Patent: July 19, 2016Assignee: StrasbaughInventors: William J. Kalenian, Thomas A. Walsh, Michael R. Vogtmann, Benjamin C. Smedley, Larry A. Spiegel, Thomas E. Brake
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Patent number: 9193030Abstract: A method of polishing a wafer with a wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.Type: GrantFiled: June 3, 2014Date of Patent: November 24, 2015Assignee: StrasbaughInventors: William J. Kalenian, Larry Spiegel
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Patent number: 9082713Abstract: A method of processing a device wafer in a wafer stack by chucking the wafer stack device side down and grinding the exposed side of the carrier wafer to parallel with the device wafer, and thereafter flipping the wafer stack and chucking the wafer stack carrier side down and grinding residual silicon from the device wafer.Type: GrantFiled: October 27, 2014Date of Patent: July 14, 2015Assignee: StrasbaughInventors: Thomas Brake, Thomas A. Walsh
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Publication number: 20150118826Abstract: A method of processing a device wafer in a wafer stack by chucking the wafer stack device side down and grinding the exposed side of the carrier wafer to parallel with the device wafer, and thereafter flipping the wafer stack and chucking the wafer stack carrier side down and grinding residual silicon from the device wafer.Type: ApplicationFiled: October 27, 2014Publication date: April 30, 2015Applicant: StrasbaughInventors: William J. Kalenian, Thomas A. Walsh
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Patent number: 8968052Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.Type: GrantFiled: October 19, 2012Date of Patent: March 3, 2015Assignee: StrasbaughInventors: Thomas A. Walsh, Michael R. Vogtmann
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Patent number: 8915771Abstract: A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.Type: GrantFiled: December 27, 2012Date of Patent: December 23, 2014Assignee: Strasbaugh, Inc.Inventor: Michael Vogtmann
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Publication number: 20140287657Abstract: A method of polishing a wafer with a wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.Type: ApplicationFiled: June 3, 2014Publication date: September 25, 2014Applicant: StrasbaughInventors: William J. Kalenian, Larry Spiegel
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Patent number: 8740673Abstract: A wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A.Type: GrantFiled: October 4, 2011Date of Patent: June 3, 2014Assignee: StrasbaughInventors: William J. Kalenian, Larry Spiegel
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Publication number: 20140134923Abstract: A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.Type: ApplicationFiled: September 30, 2013Publication date: May 15, 2014Applicant: StrasbaughInventors: Thomas E. Brake, William J. Kalenian, David L. Grant
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Publication number: 20140134927Abstract: A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle.Type: ApplicationFiled: September 30, 2013Publication date: May 15, 2014Applicant: StrasbaughInventors: Thomas A. Walsh, Larry A. Spiegel
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Patent number: 8565919Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.Type: GrantFiled: November 7, 2011Date of Patent: October 22, 2013Assignee: StrasbaughInventors: William J. Kalenian, Thomas A. Walsh, Dave Halley
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Patent number: 8520222Abstract: A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.Type: GrantFiled: November 8, 2011Date of Patent: August 27, 2013Assignee: StrasbaughInventors: Frederic Anthony Schraub, Michael R. Vogtmann, Benjamin C. Smedley
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Publication number: 20130130593Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.Type: ApplicationFiled: January 11, 2013Publication date: May 23, 2013Applicant: STRASBAUGHInventor: Strasbaugh
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Publication number: 20130102227Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.Type: ApplicationFiled: October 19, 2012Publication date: April 25, 2013Applicant: STRASBAUGHInventor: STRASBAUGH
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Patent number: 8182312Abstract: A CMP polishing pad with an optical sensor assembly embedded in the pad, connected to a transceiver and/or power supply mounted at the center of the pad or at the outer edge of the pad which communicates wirelessly with a control system.Type: GrantFiled: September 6, 2008Date of Patent: May 22, 2012Assignee: StrasbaughInventors: Randolph E. Truer, Michael Starman
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Patent number: 8133093Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.Type: GrantFiled: October 10, 2008Date of Patent: March 13, 2012Assignee: Strasbaugh, Inc.Inventors: Michael Vogtmann, Thomas A. Walsh
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Publication number: 20120046781Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.Type: ApplicationFiled: November 7, 2011Publication date: February 23, 2012Applicant: STRASBAUGH, A CALIFORNIA CORPORATIONInventors: William J. Kalenian, Thomas Walsh, Dave Halley
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Patent number: 8052504Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.Type: GrantFiled: July 27, 2007Date of Patent: November 8, 2011Assignee: StrasbaughInventors: William J. Kalenian, Tom Walsh, Dave Halley