Abstract: A semiconductor device includes a semiconductor element that is mounted on a substrate, an electrode pad that contains aluminum as a main component and is provided in the semiconductor element, a copper wire that contains copper as a main component and connects a connection terminal provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. When the semiconductor device is heated at 200° C. for 16 hours in the atmosphere, a barrier layer containing any metal selected from palladium and platinum is farmed at a junction between the copper wire and the electrode pad.

Abstract: There is provided a repeated type organ fixing instrument having a plurality of suturing tools. The organ fixing instrument includes a rod-shaped engaging portion, a suture fixed to the engaging portion, a puncture needle for housing a plurality of the engaging portions. A plurality of the engaging portions are extruded one by one from the puncture needle by the operation of a operation unit main body. The suture fixed to at least one of the plurality of engaging portions is inserted within the inside of the puncture needle and wherein the other suture is derived from the inside to the outside of the puncture needle.

Abstract: Provided is a heat conductive sheet obtained by including a heat conductive filler in a cured organic resin, in which the heat conductive filler is made of multiple particles obtained by coating surfaces of plastic particles with a heat conductive material, and a coefficient of variation (CV) value of particle diameters of the particles, which is computed using Equation (1) described below, is equal to or less than 10%.

Abstract: A brake pad 10 can control rotating of a disc 200. The brake pad includes a friction material 12 provided on a side of the disc and a back plate 11 bonded to the friction material on an opposite side of the disc. The back plate has non-linear first ridges 111 and/or non-linear first grooves 113 and second ridges 112 and/or second grooves 114 each formed on a surface thereof positioned on a side of the friction material so that a longitudinal direction of the first ridges and/or the first grooves corresponds to a first direction and a longitudinal direction of the second ridges and/or the second grooves corresponds to a second direction intersecting the first direction.

Abstract: A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting a heat element is provided. The metal foil-clad substrate includes: a metal foil having one surface; a resin layer formed on the one surface of the metal foil; a heat radiation metal plate formed on a surface of the resin layer opposite to the metal foil; an insulating part formed on the surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or a solidified material of a second resin composition containing a resin material.

Abstract: A metal foil-clad substrate used for forming a circuit board mounting and electrically connecting an electronic component is provided. The metal foil-clad substrate includes a metal foil having a one surface, a resin layer formed on the one surface of the metal foil; an insulating part formed on a surface of the resin layer opposite to the metal foil; and at least one bending portion in which the metal foil, the resin layer and the insulating part are bended to a side of the metal foil or the insulating part. The insulating part is constituted of a cured material of a first resin composition containing a first thermosetting resin. The resin layer is constituted of a cured material or solidified material of a second resin composition containing a resin material.

Abstract: The present invention is to provide a microfluidic device capable of allowing a fluid to stably flow in a microchannel without using an external source such as a pump or a suction device, and the microfluidic device, provided with a microchannel to which a sample liquid is transported, includes: an inlet reservoir which reserves a sample liquid to be introduced into said microchannel; an inlet which is provided on a sample-introduced side of the microchannel, and communicates with the inlet reservoir; an outlet provided on a sample-discharged side of the microchannel; and an open channel which is provided as communicating with the outlet, and part of at least one surface of which is opened to the outside atmosphere, wherein the inlet is provided at a higher position in a gravity direction than the outlet.

Abstract: A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate through which a through-hole is provided along a thickness direction thereof, an insulating film provided on the metal substrate and a metal film provided on the insulating film, wherein the through-hole opens on a surface of the metal film on the opposite side of the metal substrate via the insulating film and the metal film; an electronic component connected to the metal film, the electronic component including an electronic component main body and a conductive leg portion electrically connected to the electronic component main body and inserted into the through-hole; and an insulating portion provided at least between the leg portion locating inside the through-hole and the metal substrate, and having a function of preventing them from making contact with each other.

Abstract: A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.

Abstract: The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board. Within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region. A region other than the first region is defined as a second region. At least one groove is provided within the first region so as to surround the electronic component in a planar view of the metal-based mounting board.

Abstract: A circuit substrate 10 of the present invention includes a circuit layer 2. The circuit layer 2 includes a first terminal 21 in which a current should flow, a second terminal 22 in which a current larger than the current flowing in the first terminal 21 should flow and an insulating part 23. The insulating part 23 has a first portion 231 provided around the second terminal 22 and a second portion 232. An insulation property of the first portion 231 is higher than an insulation property of the second portion 232. The first portion 231 of the insulating part 23 is provided so as to surround an outer periphery of the second terminal 22. The circuit substrate 10 further includes a supporting substrate 1 provided on a side of a lower surface of the circuit layer 2.

Abstract: A negative-electrode material of the present invention is a carbonaceous negative-electrode material used for an alkali metal ion battery and an average layer spacing d002 of face (002) calculated by an X-ray diffraction method using CuK? radiation as a radiation source is equal to or greater than 0.340 nm. The halogen content of the negative-electrode material of the present invention is equal to or greater than 0.5 ppm and less than 50 ppm.

Abstract: There is provided a medical device which has favorable operation wire, operability and has a sufficiently reinforced structure around the operation wire. The medical device includes a medical device body; a sub-lumen which is disposed inside the medical device body so as to extend along a longitudinal direction of the medical device body; an operation wire which is inserted into the sub-lumen and extends along the longitudinal direction of the medical device body; and a first tubular reinforcing layer and a second tubular reinforcing layer. The second reinforcing layer is disposed apart from the first reinforcing layer so as to surround the periphery of the first reinforcing layer, and the space between the first reinforcing layer and the second reinforcing layer is filled with a part of a resin constituting the medical device body. The sub-lumen is disposed inside the part of the resin constituting the medical device body.

Abstract: A photosensitive resin material of the invention is a photosensitive resin material used to form a permanent film including one or more selected from a novolac-type phenol resin, a phenol aralkyl resin, and a hydroxystyrene resin as an alkali-soluble resin (A) and a photosensitive diazoquinone compound as a photosensitizing agent (B), in which a content of iron with respect to all non-volatile components, which is measured through flameless atomic absorption spectroscopy, is equal to or more than 0.005 ppm and equal to or less than 80 ppm, and non-ionic iron is included as the iron.

Abstract: The object of the present invention is to provide an optical wiring part which can connect the optical waveguide and another optical element with high optical coupling efficiency while inhibiting the decrease of the transmission loss, and an electronic device with high reliability including the optical wiring part, the present invention provides an optical wiring part including a tape-shaped optical waveguide and a ferrule having a penetration hole which is formed from a base end to a tip end of the ferrule, and a part of the optical waveguide in a longitudinal direction is inserted into the penetration hole, wherein at least one main surface of two main surfaces of the optical waveguide is fixed to an inner wall of the penetration hole, and there is a clearance between the inner wall of the penetration hole and two side surfaces of the optical waveguide.

Abstract: A straight-chain unsaturated hydrocarbon group having equal to or more than 10 carbon atoms is bonded to at least one or more of meta positions of all of phenol structure units.

Abstract: In a metal resin composite body (100) of the present invention, a resin member (101) and a metal member (102) are joined, and the metal resin composite body (100) is obtained by joining the resin member (101) and the metal member (102). The resin member (101) is formed of a thermosetting resin composition (P) including a thermosetting resin (A) as a resin component. In the metal member (102), a ratio of a real surface area by using a nitrogen adsorption BET method to an apparent surface area of a joining surface (103) joining to at least the resin member (101) is greater than or equal to 100 and less than or equal to 400.

Abstract: A method for manufacturing a catheter includes a process of supplying a resin material in a melted state to the periphery of a core wire (90) and molding a hollow tube (82) having the core wire (90) inserted thereinto; a process of arranging the hollow tube (82) having the core wire (90) inserted thereinto, on an outer peripheral side of a main lumen forming region of a tubular body part (10) made of resin; a process of extracting the core wire (90) from the inside of the hollow tube (82) to form a sublumen after the core wire (90) inside the hollow tube (82) is elongated and reduced in diameter to peel off the hollow tube (82) and the core wire (90), and a process of inserting an operating wire into the hollow tube (82).

Abstract: An optical waveguide including a first cladding layer; a core layer, including first and second core sections with cladding sections on sides thereof in the in-layer direction; and a second cladding layer. A refractive index distribution in the in-layer direction in the core layer, from the first core section to an adjacent cladding section, has a continuous change and a region with a first peak, a first dip, and a second peak in this order; the first peak at a position of the first core section, the second peak with a maximum value of refractive index smaller than of the first peak, at a position of the cladding section, and a portion, from the first cladding layer to the first core section, corresponded to a refractive index distribution in the layer-stacking direction, discontinuously changing at the boundary between the first cladding layer and first core section.

Abstract: A silicone rubber-based curable composition includes vinyl siloxane, hydrogen siloxane and silica particles, where the content of the silica particles is 26.0 wt % or more and less than 40.0 wt %, and when cured, it can form a silicone rubber exhibiting a physical property of a JIS K6253 (2006) type A durometer hardness of 40.0 mN or more. Further a method for manufacturing a silicone rubber-based curable composition includes a step of obtaining a kneaded product by kneading vinyl siloxane, hydrogen siloxane, silica particles, a silane coupling agent and a catalyst, where the content of the silica particles in the kneaded product is in the range of 40 to 84 parts by weight relative to 100 parts by weight as the total amount of the vinyl siloxane and the hydrogen siloxane.