Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Abstract: Coated particles of the present invention are adapted to be packed in fractures formed in a subterranean formation. Each of the coated particles includes: a core particle having an outer surface; and a surface layer coating at least a part of the outer surface of the core particle, wherein the surface layer contains an acid curing agent and an acid curable resin to be cured in the presence of an acid, and wherein the acid curing agent is composed of acidic compounds having acidic groups, and at least a part of the acidic groups of the acidic compounds are blocked by block compounds having reactivity with the acidic groups. This makes it possible to provide the coated particles adapted to be packed in the fractures formed in the subterranean formation and capable of maintaining high fluid permeability thereof, an injection material containing the coated particles, and a packing method for injecting such an injection material into the fractures.

Abstract: A resin composition of the present invention is used for forming surface layers coating at least a part of outer surfaces of particles, the particles adapted to be packed in fractures formed in a subterranean formation. The resin composition contains an acid curing agent having an acidic group, an acid curable resin to be cured in the presence of an acid, and a polyester. The acid curing agent exists in a state that the acidic group thereof is blocked by a compound having reactivity with the acidic group. This makes it possible to provide a resin composition which can reliably cure an acid curable resin at a required place, an injection material containing such a resin composition and particles, and a packing method for packing such particles in the fractures formed in the subterranean formation.

Abstract: To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

Abstract: There is provided a carbonaceous negative electrode material used for an alkali metal ion battery. The average layer plane spacing d002 of a (002) plane obtained using an X-ray diffraction method in which a CuK? ray is used as a radiation source is 0.340 nm or greater, and either or both the following condition A and condition B are satisfied. In addition, in a specific condition, the cross section includes a first region (101) and a second region (103) having different hardness values measured by means of micro-hardness measurement. Alternatively, the cross section includes a first region (101) and a second region (103) having different intensities of a peak, which corresponds to a lattice constant of graphite, of a curve obtained by means of an image analysis of an electron beam diffraction image observed using a transmission electron microscope.

Abstract: According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device (10) of the present invention includes: a base material (die pad) (2), a semiconductor element (3), and an adhesive layer (1) intervening the space between the base material and the semiconductor element (3) to adhere the base material and the semiconductor element. Thermal conductive filler (8) is contained in the adhesive layer (1), and when the content of the thermal conductive filler dispersed in the whole of the adhesive layer is expressed as C, the content of the thermal conductive filler in the region 1 ranging from the interface of the adhesive layer at the side of the semiconductor element to the depth by 2 ?m is expressed as C1, and the content of the thermal conductive filler in the region 2 ranging from the interface of the adhesive layer at the side of the base material to the depth by 2 ?m is expressed as C2, the following formulae are satisfied: C1<C, and C2<C.

Abstract: A compound having the following structure has been found out: (R1 and R2 each independently represent any one of a hydrogen atom and an alkyl group).

Abstract: An acid curing agent inclusion according to the present invention contains an acid curing agent having an acidic group; and a polyester. The acid curing agent exists in a state that the acidic group thereof is blocked by a compound having reactivity with the acidic group. This makes it possible to provide an acid curing agent inclusion capable of preparing a resin composition which can reliably cure an acid curable resin at a required place, and a method for producing (preparing) such an acid curing agent inclusion.

Abstract: Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.

Abstract: A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.

Abstract: Cancer-associated O-glycopeptide combination epitopes derived from the VNTR of MUC1 are disclosed. Autoantibodies present in human sera target the combination epitopes and are reduced or absent in cancer patients. The epitopes are useful as therapeutic and immunoprophylactic cancer vaccines. Monoclonal antibodies directed against the epitopes are also useful as immunotherapeutics for treatment and prevention of cancer. Diagnostic methods using the epitopes and antibodies are also disclosed.

Abstract: The present invention provides a packing sheet and PTP packing body, which do not include halogen materials such as chlorine and fluorine and have high water vapor barrier property. The packing sheet of the present invention includes at least a high-density polyethylene resin (A), petroleum resin (B), and amorphous polyolefin resin (C). Also, it is preferable that the weight blending ratio ((A+B)/C) of the total weight of the high-density polyethylene (A) and the petroleum resin (B) to the weight of the amorphous polyolefin (C) be 50/50 or more and 90/10 or less.

Abstract: Disclosed are hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound, in which with respect to the hydrophobic inorganic particles subjected to a washing step, a weight reduction rate is calculated under measurement conditions described below, and the number of molecules of the organic compound per 1 nm2 of inorganic particles before a surface treatment, which is calculated by a calculation expression described below, is 1.7 to 20. (Calculation Expression) If the number of molecules of the organic compound per 1 nm2 of inorganic particles is N, a weight reduction rate (%) is R, a specific surface area of inorganic particles is S (m2/g), and a molecular weight of organic compound is W (g), N=(6.

Abstract: The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

Abstract: The object of the present invention is to provide a cover tape for packaging an electronic part which enables the reduction of the production time, and decreases the defective fraction due to the temperature variation of the sealing trowel, the present invention provides a cover tape for packaging an electronic part which includes a base layer and a sealant layer, and is closely adhered to a carrier tape, wherein the sealant layer is made of a resin composition; a main component in the resin composition has a melting point of 100° C. or less; a peeling strength A under fixed measurement conditions after heat-sealing to a polycarbonate sheet through the sealant layer at 220° C. for 0.015 seconds and a peeling strength C under the fixed measurement conditions after heat-sealing to a polycarbonate sheet through the sealant layer at 180° C. for 0.

Abstract: A resin composition for a thermally conductive sheet includes a thermosetting resin and a filler dispersed in the thermosetting resin. The filler includes secondary agglomerated particles satisfying the following conditions: a void is formed in the central portion; a communicating pore which begins from the void and communicates with the outer surface of the secondary agglomerated particle is formed; and the ratio of the average pore diameter of the communicating pores to the average void diameter of the voids is equal to or more than 0.05 and equal to or less than 1.0.

Abstract: Disclosed are hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound, in which, when 200 parts by mass of ethanol is added to 1 part by mass of the hydrophobic inorganic particles, ultrasonic washing is performed for 10 minutes, solid-liquid separation is performed, and 0.1 g of the dried hydrophobic inorganic particles are dispersed in 40 g of a liquid mixture obtained by mixing hexane and water in a volume ratio of 1:1, 50% by mass or greater of the hydrophobic inorganic particles are transformed to a phase in which hexane is included.

Abstract: Embodiments in accordance with the present invention encompass water soluble polycyclic vinyl addition polymers having a norbornene type repeat unit derived from a norbornene type of monomer that encompasses a saccharide functional moiety. Embodiments in accordance with the present invention also encompass low and high molecular weight polymers with low catalyst loading.

Abstract: The high-frequency treatment tool includes a flexible tube inserted into a body cavity; an operating wire inserted through the flexible tube to be movable back and forth; a treatment part arranged on a distal end of the operating wire and treats biological tissue by applying a high-frequency current; a main body that fixes a base end of the flexible tube; a slider-fixing part that fixes a base end of the operating wire guided from the base end of the flexible tube and slides the operating wire in an axis direction with respect to the main body; and a slider-gripping part provided to encircle at least a portion of an outer peripheral surface of the slider-fixing part and slides the slider-fixing part by the operation of a user. The slider-fixing part is unrotatably coupled to the main body and the slider-gripping part is rotatably coupled to the slider-fixing part.

Abstract: Provided is a resin-supported catalyst including a cured body of a thermosetting resin and fine particles having catalytic activity supported onto the surface of the cured body, in which the thermosetting resin has a phenolic hydroxyl group.