Abstract: There is provided a semiconductor device having excellent moisture resistance and high temperature storage properties. The semiconductor device includes a lead frame that has a die pad and an inner lead, as a substrate, a semiconductor element that is mounted on the die pad, an electrode pad that is provided in the semiconductor element, a copper wire that connects the inner lead provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. A region of the electrode pad disposed within a range of at least equal to or less than 3 ?m from a junction surface with the copper wire in a depth direction includes a metal, which is less likely to be ionized than aluminum, as a main component, and a content of sulfur in the copper wire is equal to or more than 15 ppm and equal to or less than 100 ppm with respect to a total amount of the copper wire.

Abstract: The present invention provides substance which can specifically interact with sugar chains. Further, the present invention provides a method for separating, concentrating, or purifying sugar chains or a sugar chain-containing substance in a sample, comprising the steps of: a) contacting a sugar chain-trapping carrier comprising a substance which can specifically interact with sugar chains with the sample in a fluid phase under conditions that the sugar chain-trapping carrier can react with the sugar chains or sugar chain-containing substance; b) isolating a composite of the sugar chain-trapping carrier and the sugar chains or sugar chain-containing substance from the fluid phase; and c) exposing the composite to the conditions that the interaction between the sugar chain-trapping carrier and the sugar chains or sugar chain-containing substance is at least partially eliminated.

Abstract: The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.

Abstract: Provided are substance and method enabling quick and easy detection of a sugar chain-recognizing molecule with high sensitivity in any place. Specifically, provided are: a membrane support for immunochromatography, the membrane support comprising a detection line on which a protein having the sugar chain binding thereto is immobilized; a device comprising the membrane support; and a method using these for detecting by immunochromatography a molecule capable of recognizing the sugar chain.

Abstract: There is provided a polymer including a structural unit represented by the following Formula (1a), a structural unit represented by the following Formula (1b) and a structural unit represented by the following Formula (1c) (In Formula (1a), n represents 0, 1 or 2. Each of R1, R2, R3 and R4 independently represents a hydrogen atom or an organic group having 1 to 10 carbon atoms. In Formula (1c), R5 represents an organic group having 1 to 10 carbon atoms.

Abstract: According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.

Abstract: According to the present invention, there is provided a laminate (1A) including a substrate (2) and a layer (8) which is provided on the substrate (2) and contains a fiber filler (fiber piece) and a resin. The layer (8) is a paper-making sheet obtained by subjecting the fiber filler and the resin to paper-making.

Abstract: Provided is a method of manufacturing a semiconductor device that has a plurality of semiconductor components and a plurality of resin layers, the method including: a step in which resin layers and semiconductor components are laminated alternately on a substrate, and the same is adhered by being subjected to heating and pressurization at a temperature lower than the temperature at which the substrate and/or a solder layer of the semiconductor components melts; and a step in which heat and pressure are applied at a temperature at which the solder layer melts or a temperature higher than said temperature.

Abstract: A medical treatment tool (10) includes a retractor main body (30) and a converter (20). The retractor main body (30) forms a cylindrical shape and is placed in an incision. The converter (20) is detachably installed on an opening end (32) of the retractor main body (30) and closes the opening end (32). Ports (22a) to (22d) through which treatment tools are respectively inserted into the retractor main body (30) are provided in a plurality of sites of the converter (20). The converter (20) can be installed on the opening end (32) at an installation angle which is selected from a plurality of angles. The positional relationships of the ports (22a) to (22d) with respect to the retractor main body (30) when the converter (20) is installed on the opening end (32) at the respective installation angles become different from each other.

Abstract: According to the present invention, there is provided an article including: a main body portion (10) that is formed of a material composition containing a fiber filler and a resin and obtained using a paper-making method; and a functional layer (20) that covers the main body portion (10).

Abstract: The correlation between the aggregation structure of inorganic fillers such as silica microparticles in silicone rubbers and tensile strength and tear strength still has not been elucidated. The purpose of the invention is to provide a curable silicone rubber composition with which a silicone rubber of superior tensile strength and tear strength can be obtained. The invention provides a curable silicone rubber composition that is characterized in that the aggregate size of the inorganic filler prior to extending as determined by synchrotron X-ray diffraction measurement is 20-25 nm and the maximum value for the orientation coefficient of the curable silicone rubber composition when drawn as determined by synchrotron X-ray diffraction measurement is 0.25-0.35.

Abstract: An object of the present invention is to provide an optical waveguide module which has a small optical coupling loss between the light element and the optical waveguide and can perform high-quality optical communication, a method for producing the optical waveguide module with high efficiency, and an electronic apparatus which includes the optical waveguide module and can perform high-quality optical communication, and the present invention provides an optical waveguide module including: an optical waveguide including a core portion, a clad portion that is provided to cover a side surface of the core portion, and an optical path-converting unit that is provided partway along the core portion or on an extended line of the core portion and that converts an optical path of the core portion to the outside of the clad portion; an optical element that is provided over the clad portion; a circuit board that is provided between the optical waveguide and the optical element and has a through-hole formed along an optic

Abstract: In an aspect, the present disclosure relates to a polyamide solution including aromatic polyamide and a solvent. A dimension change gap between a cast film of the polyamide solution and the cast film after being subjected to a heat treatment is not more than a predetermined value. In another aspect, the present disclosure relates to a method for manufacturing a display element, an optical element, an illumination element or a sensor element, including a step of forming a polyamide film by using the polyamide solution.

Abstract: One object of the present invention is to provide a medicine packaging sheet, and a medicine package, which do not need to enclose an oxygen absorbent in the package in addition to add the oxygen absorbent in the package material, and which have excellent oxygen absorbing properties and oxygen barrier properties. The present invention provides a medicine packaging sheet including a barrier layer and an oxygen absorbing layer, wherein the oxygen absorbing layer is composed of a resin composition including a base resin, an oxygen absorbing resin, and a reaction accelerator.

Abstract: An analysis carrier for trapping a biologically active substance includes a carrier body having a carrier surface on which one or more polymers are immobilized. The polymer includes a first repeating unit and a second repeating unit, the first repeating unit has a side chain including a functional group of a betaine structure, and the second repeating unit has a side chain whose terminal group is an active ester group.

Abstract: A carbonaceous negative-electrode material for an alkali metal ion battery is provided in which an average layer spacing d002 of face (002) which is calculated by an X-ray diffraction method using CuK? radiation as a radiation source is equal to or greater than 0.340 nm. The negative-electrode material is maintained under conditions of a temperature of 40° C. and a relative humidity of 90% RH for 120 hours and then (A) a step of maintaining the negative-electrode material under conditions of a temperature of 130° C. and a nitrogen atmosphere for 1 hour and (B) a step of raising the temperature of the negative-electrode material subjected to the step of (A) at 10° C./min from 40° C. to 540° C. under the nitrogen atmosphere and measuring a decrease in weight of the negative-electrode material are sequentially performed using a thermogravimetric apparatus.

Abstract: A resin composition is used for forming a surface layer coating at least a part of an outer surface of a particle. The particle is adapted to be packed into a fracture formed in a subterranean formation, and contains a thermosetting resin and a hydrophilic polymer. It is preferred that the resin composition further contains a surfactant. According to the present invention, it is possible to provide an effect of preventing pieces of core particles from being scattered due to the action of a thermo-setting resin and an effect of improving compatibility with respect to water (that is, fluid repellent with respect to hydrocarbon) due to the action of a hydrophilic polymer in a synergistic manner. This increases conductivity of packed spaces of a subterranean formation (that is, fractures of the subterranean formation) in which coated particles are packed.

Abstract: The present invention relates to a medical instrument capable of enhancing the slidability of an operating wire in a lumen. The medical instrument (for example, a catheter (10) of the present invention) includes: a medical instrument body (a sheath (16)) which has a long length and flexibility and is inserted into a body cavity; a lumen (for example, a sub-lumen (30)) which is formed in the medical instrument body along a longitudinal direction of the medical instrument body; and an operating wire (40). The operating wire (40) is accommodated in the lumen, extends along a longitudinal direction of the lumen, and is slidable in the longitudinal direction of the lumen, and the medical instrument body can be bent by an operation of pulling the operating wire (40). A lubricating liquid (45) adheres to at least a surface of the operating wire (40).

Abstract: The present invention is a method for decomposing a polymer material by chemically decomposing a polymer material containing a first monomer and a second monomer in a mixture of the polymer material with the first monomer or a derivative of the first monomer to produce a chemical raw material. A relationship between a proportion of number of molecules of the second monomer to number of molecules of the first monomer in a reaction system for decomposing the polymer material and the molecular weight of the chemical raw material produced in the reaction system is acquired in advance (S101). Subsequently, an addition mount of the derivative of the first monomer to be added to the polymer material is determined based on the above relationship (S102). The first monomer in the addition amount determined is then mixed with the polymer material (S103).

Abstract: An object of the present invention is to provide a simple method for fluorescent labeling of sugar chains, and a sugar chain capturing carrier used therein. According to the present invention, a sugar chain fluorescent labeling method is provided in which sugar chains are captured, recovered and purified by primary amino groups in a sugar chain capturing carrier having the primary amino groups that is used to capture sugar chains, and the captured sugar chains are released from the carrier and then labeled with a fluorescent substance including aromatic amine at a concentration of 0.5 mol/L or more.