Abstract: A method for preparing a photosensitive resin composition including at least (A) an alkali-soluble resin, (B) a photoacid generator, (C) a surfactant and (D) an organic solvent includes a step of obtaining a dispersion liquid which contains (C) the surfactant and (D) the organic solvent, and does not contain (A) the alkali-soluble resin and (B) the photoacid generator, and a step of adding (A) the alkali-soluble resin and (B) the photoacid generator to the dispersion liquid.

Abstract: An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a p

Abstract: Embodiments in accordance with the present invention provide waveguide structures and methods of forming such structures where core and laterally adjacent cladding regions are defined. Some embodiments of the present invention provide waveguide structures where core regions are collectively surrounded by laterally adjacent cladding regions and cladding layers and methods of forming such structures.

Abstract: Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein, in the particle size distribution as determined by sieving the whole epoxy resin composition for encapsulating a semiconductor using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is from 0.5% by mass or more to 60% by mass or less, and the ratio of microfine particles having a size of less than 106 ?m is not more than 5% by mass.

Abstract: It has been found out that it is possible to increase the ionization efficiency of a sample sugar chain by methylating hydroxyl groups of the sugar chain before MALDI-TOF MS measurement. This enables quantitative and structural analyses on the sample sugar chain with high accuracy.

Abstract: The object of the present invention is to provide a resin composition sheet that when used in the manufacture of product packaging such as carrier tapes, and the like, molding temperatures can be lowered from 260-280° C. to 200-250° C., even when heated to relatively high temperatures using a contact heating device with a mold-releasing film interposed therebetween, wherein poor appearance due to the replication of mold-releasing film features is unlikely to occur. The resin composition sheet relating to one aspect of the present invention comprises polycarbonate resin, amorphous polyester resin, and silicate compound filler. Furthermore, this resin composition sheet is suitable for use in the manufacture of product packaging such as carrier tapes, and the like. Furthermore, when an object that is vulnerable to static electricity is to be accommodated within product packaging, it is preferable to add a conductive filler to prevent the static charge in the accommodated product.

Abstract: An object of the present invention is to provide a multilayer film and a package body of which the thickness can be reduced than that of a conventional multilayer film, by having a good impact resistance, flex resistance, and anti-pinhole property. A multilayer film 100 according to the present invention includes a repeatedly laminated part 130. The repeatedly laminated part 130 is formed by alternately and repeatedly laminating a first layer 131 and a second layer 132. The first layer 131 consists mainly of a polyamide resin (excluding elastomers). The second layer 132 consists mainly of a copolymer of an olefin-based hydrocarbon having carbon number of 2 to 4 and a vinyl group-containing monomer.

Abstract: According to the present invention, an epoxy resin composition for semiconductor encapsulant including (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a compound in which a copolymer of a 1-alkene having 5 to 80 carbon atoms and maleic anhydride is esterified with an alcohol having 5 to 25 carbon atoms in the presence of a compound represented by General Formula (1), wherein R1 in General Formula (1) is selected from the group consisting of an alkyl group having 1 to 5 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, and an aromatic group having 6 to 10 carbon atoms is provided.

Abstract: A method of manufacture of novolac-type phenol resin, wherein phenols and aldehydes are allowed to react with each other, a water-soluble organic phosphonic acid is used as a reaction catalyst, and a tertiary phosphine compound is used as a reaction promoter. It is preferable that the aforementioned organic phosphonic acid have the structure shown in the following general formula (1): R—PO(OH)2 ??(1) (R is a group which contains a carbon atom, and which contains —COON and/or —PO(OH)2).

Abstract: Provided is a phenolic resin molding compound including (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.

Abstract: A method for manufacturing a base material having a gold-plated metal fine pattern is disclosed, comprising the steps of preparing a base material having a supporting surface made of a resin; forming a primer resin layer having surface roughness of 0.5 ?m or less on the supporting surface, and forming a metal fine pattern thereon by an SAP process to obtain a base material having a metal fine pattern; and applying a gold-plating treatment to at least one part of a surface of the metal fine pattern; wherein the base material having a metal fine pattern is subjected to a palladium removal treatment in an optional stage before carrying out the gold-plating treatment.

Abstract: According to the invention, a method of manufacturing an esterified substance including a process in which a copolymer is obtained by copolymerizing a 1-alkene having 5 to 80 carbon atoms and maleic anhydride, and a process in which an esterification reaction of the copolymer and an alcohol having 5 to 25 carbon atoms is caused in a presence of trifluoromethanesulfonic acid in order to obtain a reaction mixture containing an esterified substance including at least one repetition unit selected from formulae (c) to (f) is provided, and, in the formulae (c) to (f), R represents an aliphatic hydrocarbon group having 3 to 78 carbon atoms, R2 represents a hydrocarbon group having 5 to 25 carbon atoms, m represents the copolymerization molar ratio X/Y of the 1-alkene (X) to the maleic anhydride (Y) and is 1/2 to 10/1, and n is an integer of more than or equal to 1.

Abstract: Provided is a method of manufacturing an electronic device having a first electronic component having a first terminal and a second electronic component having a second terminal, wherein the first electric component is electrically connected to the second electronic component by connecting the first terminal to the second terminal with solder, the method including: providing a resin layer having a flux action between the first terminal and the second terminal to obtain a laminate including the first electronic component, the second electronic component, and the resin layer, wherein a solder is provided on the first terminal or the second terminal; soldering the first terminal and the second terminal; and curing the resin layer while pressing the laminate with a pressurized fluid.

Abstract: Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.

Abstract: According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.

Abstract: A liquid crystal display element (10) in accordance with the present invention includes: a pair of substrates (1), at least one of which is a flexible substrate; a liquid crystal layer (3) sealed in a gap between the pair of substrates (1); and spacer members (4), provided between the pair of substrates (1), which sustain the gap between the pair of substrates (1). A thickness of the liquid crystal layer (3) falls in a range of 93% to 98% of heights of the spacer members (4) while no pressure is applied to the spacer members. Adjacent spacer members (4) are provided at intervals of less than 400 ?m.

Abstract: A method for producing a positive-type photosensitive resin composition which includes a process of filtering the positive-type photosensitive resin composition containing a surfactant by using a filter, wherein a contact angle on one surface of the filter is equal to or more than 30 degrees and equal to or less than 80 degrees when measured using formamide.

Abstract: Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.

Abstract: Disclosed is a solid resol-type phenolic resin having: methylol groups and dimethylene ether bonds, as functional groups bound to phenolic nuclei; a content of methylol group, per 1 mol of the phenolic nuclei, of 0.8 mol or more and 1.3 mol or less; a content of dimethylene ether bond, per 1 mol of the phenolic nuclei, of 0.1 mol or less; a weight-average molecular weight of a tetrahydrofuran-soluble fraction, measured by gel permeation chromatography (GPC), of 800 or larger and 4,000 or smaller; and a content of mononuclear phenolic compound of 10% by weight or less.

Abstract: Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.