Abstract: A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). (R2O)3—Si—R1—Si—(OR2)3??(1) wherein R1 represents an alkylene group having 5 to 30 carbon atoms or an organic group that includes at least one aromatic ring, and R2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification.

Abstract: Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost.

Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.

Abstract: There is provided a device including at least one light-receiving unit 11, a base substrate 12A provided with the light-receiving unit 11, a transparent base substrate 13A disposed facing the base substrate 12A and the light-receiving unit 11, and a frame member 14A disposed around the light-receiving unit 11 between the base substrate 12A and the transparent substrate 13A. The frame member 14A consists of a cured resin composition. The resin composition contains an alkali-soluble resin, a photopolymerizable resin and an inorganic filler in 9% or less by weight. The photopolymerizable resin contains an acrylic polyfunctional monomer. The frame member 14A has a moisture permeability of 12 [g/m2·24 h] or more and an elastic modulus of 100 Pa or more at 80 degrees C.

Abstract: A cover tape for packaging electronic components is formed that causes no contamination of sealing bar due to the outflow of the cushion layer, and attains superior adhesion to the carrier tape. Embodiments include a cover tape, for packaging electronic components heat-sealable to a carrier tape for packaging electronic components, comprising: at least a base layer, a cushion layer formed of resin A, a following layer formed along the heat-seal layer of resin B, and a heat-sealing layer laminated in this order; wherein resin A has a Vicat softening temperature Ta measured in accordance with ISO 306 (rate of temperature increase:50° C./hour, load: 10N),and resin B comprises a linear low density polyethylene and has a Vicat softening temperature Tb measured in accordance with ISO 306 (rate of temperature increase:50° C./hour, load: 10N) satisfying the Relational Expression 1 below; and the thickness of the following layer is not smaller than 2 ?m and not larger than 15 ?m: Ta?Tb?3(° C.).

Abstract: A method of preparing a sugar chain sample, for reducing unreacted labeling reagent in a sample solution containing a labeled sugar chain, includes (process 1) a process of bringing the sample solution containing the labeled sugar chain into contact with monolithic silica, so as to allow the monolithic silica to adsorb a sugar chain component; (process 2) a process of washing the monolithic silica with a washing liquid; and (process 3) a process of bringing the monolithic silica into contact with an eluant, so as to elute the adsorbed sugar chain.

Abstract: A semiconductor device comprises a lead frame having a die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are combined with the copper wire having predetermined properties.

Abstract: According to the electronic apparatus and cellular phone of the present invention, in an optical waveguide forming body of a flexible cable, an air layer is provided in a deforming section which experiences bending deformation as a result of the movement of a second body relative to a first body (either a pivoting or sliding movement), and the position of this air layer becomes located on the outer circumferential side of a core when the deforming section undergoes bending deformation. As a result of this, it is possible to ensure sufficient flexibility and to also achieve a sufficient improvement in the folding endurance of the core portion for this optical waveguide forming body to be utilized in practical applications. Moreover, it is possible to suppress light loss and achieve high-speed, large-capacity transmissions even when the optical waveguide forming body of a flexible cable experiences bending deformation due to the relative movement of the second body relative to the first body.

Abstract: A method of manufacturing a semiconductor device of the present invention includes a coating process in which a pasty thermosetting resin composition having a flux activity is coated on at least either one of a substrate and a semiconductor chip; a bonding process in which the substrate and the semiconductor chip are electrically bonded while placing the pasty thermosetting resin composition in between; a curing process in which the pasty thermosetting resin composition is cured under heating; and a cooling process, succeeding to the curing process, in which cooling is performed at a cooling rate between 10[° C./hour] or above and 50[° C./hour] or below.

Abstract: The present invention relates generally to resin compositions having a generally halogen-free epoxy resin that can encompass a novolak epoxy resin, a curing agent and a non-halogen flame-retardant material. For some embodiments, the curing agent can be dicyandiamide and the flame retardant can be 10-benzyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. Embodiments of the current invention also relate generally to prepregs prepared from such resin compositions; and laminates prepared from such prepregs.

Abstract: A method of manufacturing a semiconductor component of the present invention has: obtaining a semiconductor wafer having stud electrodes formed on a functional surface thereof, and a circuit board having solder bumps on one surface and having electrode pads on the other surface thereof; bonding the semiconductor wafer and the circuit board, while providing a resin layer having a flux activity between the semiconductor wafer and the circuit board, and so as to bring the stud electrodes into contact with the solder bumps, while penetrating the resin layer having a flux activity, to thereby obtain a bonded structure; applying a solder material onto the electrode pads of the bonded structure; and dicing the bonded structure to obtain a plurality of semiconductor components.

Abstract: The invention aims to improve the charge/discharge cycle characteristics of an anodic carbon material for a lithium secondary battery. An anodic carbon material for a lithium secondary battery according to the present invention comprises: particles containing carbon, or a metal or metalloid, or an alloy, oxide, nitride, or carbide thereof, the particle capable of absorbing and releasing lithium ions; a resinous carbon material enclosing the particles; and a network structure formed from carbon nanofibers and/or carbon nanotubes that bond to the surfaces of the particles and that enclose the particles.

Abstract: There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).

Abstract: A flexible wiring unit (100) includes a flexible substrate (50) having flexibility in a longitudinal direction, including a signal line (30) for transmitting and receiving signals to and from an external circuit, a front insulating layer (20) and a back insulating layer (40) holding the signal line therebetween, and a shield layer (10) provided on an upper face of the front insulating layer (20); a non-conductive substrate spacer (62) provided so as to oppose a lower face of the back insulating layer (40); and a support member (61) that sustains a longitudinal end portion of the flexible substrate (50); and the other longitudinal end portion is movable. A distance (Y) between a back face of the substrate spacer (62) and the signal line (30) in a state where the flexible substrate (50) is in contact with a surface of the substrate spacer (62) is longer than a distance (X) between a lower face of the shield layer (10) and the signal line (30).

Abstract: Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board (1) using an interlayer insulating layer (6) can suppress warpage of the entire multilayer circuit board (1) by making the interlayer insulating layer (6) serve as a buffer material. In the multilayer circuit board (1) using the interlayer insulating layer (6), conductor circuit layers (11) and interlayer insulating layers (6) are alternately arranged. The interlayer insulating layer (6) to be used in the multilayer circuit board (1) includes a first insulating layer and a second insulating layer having an elastic modulus higher than that of the first insulating layer.

Abstract: A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 ?m provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.

Abstract: A method of manufacturing a rigid-flex circuit board includes preparing a first and a second coverlay film (200, 250), and a first and a second circuit substrate (100, 150) having a first and a second circuit (103, 153) formed thereon, and a first interlayer adhesive sheet (300); Stacking the first coverlay film (200), the first circuit substrate (100) disposed such that the first circuit (103) opposes the first coverlay film (200), the first interlayer adhesive sheet (300) located in a region where a rigid portion (700) is to be formed, the second coverlay film (250), and the second circuit substrate (150) disposed such that the second circuit (153) opposes the second coverlay film (250), and executing a heat-pressing process.

Abstract: Disclosed is a photosensitive resin composition which is used as a photosensitive resin spacer for forming a cavity section between a substrate and a semiconductor element, including (A) an alkali-soluble resin, (B) a photopolymerizable resin, (C) a filler and (D) a photosensitizing agent, wherein the average particle diameter of said filler is in the range of 5 to 25 nm and the content of said filler is in the range of 1 to 15 weight %. Also disclosed is a film for a photosensitive resin spacer which is composed of the photosensitive resin composition described above.

Abstract: The object of the present invention can be achieved by an adhesive film for semiconductor element, including: a (meth) acrylic ester copolymer (A); and a silica (B), wherein the (meth) acrylic ester copolymer (A) has a hydroxyl group and a carboxylic group, or has an epoxy group, and has a weight-average molecular weight of 100,000 to 1,000,000, wherein the silica (B) has mean particle diameter of 1 to 100 nm, and wherein none of a thermosetting resin and a curing agent (C) is contained in non-volatile components, or total contents of the thermosetting resin and the curing agent (C) in the non-volatile components is equal to or lower than 5 wt %.

Abstract: A substrate on which an optical element is mounted is provided, including: an optical element; an optical circuit substrate which is formed by an optical waveguide layer having a core portion and cladding portions; and an electrical circuit substrate on which is provided a mounting portion that is used for mounting the optical element, wherein the optical element is mounted on the electrical circuit substrate via the optical circuit substrate and wherein the optical circuit substrate has an optical element mounted thereon and is provided with a receptor structure having a conductive portion that conducts electricity between an electrode of the optical element and an electrode of the electrical circuit substrate.