Abstract: A circuit board (1) exhibits an average coefficient of thermal expansion (A) of the first insulating layer (21) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point of equal to or higher than 3 ppm/degrees C. and equal to or lower than 30 ppm/degrees C. Further, an average coefficient of thermal expansion (B) of the second insulating layer (23) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point is equivalent to an average coefficient of thermal expansion (C) of the third insulating layer (25) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point. (B) and (C) are larger than (A), and a difference between (A) and (B) and a difference between (A) and (C) are equal to or higher than 5 ppm/degrees C. and equal to or lower than 35 ppm/degrees C.

Abstract: An object of the invention is to provide a method of manufacturing a light-emitting element, in which residue from a fixing resin layer is less likely to be left on a semiconductor layer and a supporting base in the case of manufacturing the light-emitting element by a laser lift-off technique. Furthermore, another object of the invention is to provide a highly reliable light-emitting element that is manufactured by the method of the present invention. The above-described objects are accomplished by applying a thermally decomposable resin composition as a fixing resin layer that fixes the semiconductor layer to a supporting base, and by thermally decomposing the fixing resin layer at the time of peeling off the semiconductor layer from the supporting base.

Abstract: A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

Abstract: Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation.

Abstract: A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 ?m provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.

Abstract: The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity.

Abstract: A positive-type photosensitive resin composition includes (A) a polyamide resin that includes a structural unit shown by the following formula (1) and a structural unit shown by the following formula (2), and (B) a photosensitive compound, the polyamide resin (A) having a weight average molecular weight (Mw) of 5000 to 80,000, and a cured film obtained by curing the positive-type photosensitive resin composition at 250° C. having a tensile modulus of elasticity of 2.0 to 4.0 GPa and a tensile elongation of 10 to 100%. According to the present invention, a positive-type photosensitive resin composition that can be cured at a low temperature and a highly reliable semiconductor device including a cured film of the positive-type photosensitive resin composition can be provided.

Abstract: According to the invention, a mold for measuring flow characteristics which is used to measure the flow characteristics of a resin composition, which is a measurement subject, by injecting the resin composition into a flow path provided in the mold, in which the minimum distance from the cross-sectional center of gravity to the outline in the cross-sectional shape of the flow path is equal to or more than 0.02 mm and equal to or less than 0.4 mm, and a method for measuring flow characteristics in which a resin composition, which is a measurement subject, is injected into the flow path of the mold for measuring flow characteristics, and made to flow in a single direction, and the flow distance from the start point to the end point of the flow of the resin composition is obtained as the flow length are provided.

Abstract: A medical device includes a main body elongated in a vertical direction. A guide section protrudes from a lower end of the main body in a direction crossing the vertical direction and includes first and second guide holes. A first unit includes a first puncture needle slidably supported by the main body near an upper end of the first puncture needle in the vertical direction and having a sharp lower end slidably inserted into the first guide hole from above. The first unit has a first holding plate integrally fixed to the first puncture needle. A second unit includes a second puncture needle slidably inserted into the second guide hole from above and a second holding plate integrally fixed to the second puncture needle. The second holding plate separably abuts on the first holding plate from above. A position of the second guide hole is selectable along the guide section.

Abstract: A seal agent D and liquid crystal C are clamped to a lower substrate 6, a pair of the lower substrate 7 and an upper substrate 7 are laminated with the seal agent D and the liquid crystal C interposed therebetween, and at least one of the pair of substrates is a roll-shaped long flexible resin film. When the substrates are laminated, the lower substrate 6 on one hand is aligned to the upper substrate 7 on the other hand in every arbitrary length. With this arrangement, productivity can be improved as well as a positional dislocation due to accumulation of positioning errors can be prevented.

Abstract: A medical device (1) includes a main body (2); a first piercing needle (4) provided slidably with respect to the main body (2); a first holding plate (61) adapted to hold the first piercing needle (4) and provided slidably on the main body (2); and a second holding plate (62) adapted to hold a second piercing needle (3) and detachably and movably mounted on the first holding plate (61), wherein the second holding plate (62) is mounted so as to move to the first holding plate (61) in a predetermined direction.

Abstract: A packaged article containing an electronic device which comprises an electronic device-packaging carrier tape and an electronic device-packaging cover tape, wherein a layer in the cover tape contacting with the carrier tape contains an adhesive resin (A), an electrically-charged resin. (B) charging opposite to the charging polarity of the adhesive resin (A) generating at the time of friction between the adhesive resin (A) and the electronic device, and a metallic filler and/or carbon, and wherein the packaged article containing an electronic device is capable of preventing the adhesion of the electronic devices to the cover tape (pickup failure) resulting from the static and the part breakage by ESD, by inhibiting the static caused by the friction between the contained electronic devices, particularly small/light weight electronic devices, and the cover tape.

Abstract: Disclosed is a method for manufacturing an electronic device, the method including: placing an electronic component on a substrate 11; forming standing portions 13 on the surface of the substrate 11 on which the electronic component 10 is placed, the standing portions 13 comprising a thermally decomposable resin; applying an encapsulating material 14 so as to encapsulate the electronic component 10 and cover around the standing portions 13 while exposing a portion of each of the standing portions 13 from the surface of the encapsulating material 14; heating the standing portions 13 to decompose and remove the standing portions 13, thereby forming holes 141 through the encapsulating material 14; and placing a conductive material 15 in the holes 141.

Abstract: An inner diameter measurement instrument (100) includes a first channel (120) and a second channel (140) respectively communicating with a balloon (110), a fluid injection mechanism (130), a fluid lock mechanism (150), and an amount measurement unit (160). The fluid injection mechanism (130) injects an incompressible fluid into the balloon (110) through the first channel (120) or the second channel (140). The fluid lock mechanism (150) closes the first channel (120) or the second channel (140). The amount measurement unit (160) measures the amount of an incompressible measurement fluid additionally injected after the balloon (110), the first channel (120), and the second channel (140) are filled with the fluid and the fluid lock mechanism (150) closes one of the first channel (120) and the second channel (140), by the fluid injection mechanism (130) through the other of the first channel (120) and the second channel (140).

Abstract: A method of manufacturing a semiconductor component of the present invention has: obtaining a semiconductor wafer having stud electrodes formed on a functional surface thereof, and a circuit board having solder bumps on one surface and having electrode pads on the other surface thereof; bonding the semiconductor wafer and the circuit board, while providing a resin layer having a flux activity between the semiconductor wafer and the circuit board, and so as to bring the stud electrodes into contact with the solder bumps, while penetrating the resin layer having a flux activity, to thereby obtain a bonded structure; applying a solder material onto the electrode pads of the bonded structure; and dicing the bonded structure to obtain a plurality of semiconductor components.

Abstract: Disclosed is a carbon material for lithium ion secondary cell having a positron lifetime of 370 picoseconds or longer, and 480 picoseconds or shorter, when measured by positron annihilation spectroscopy under conditions (A) to (E) below: (A) positron radiation source: positrons generated from electron-positron pairs using an electron accelerator; (B) gamma ray detector: a BaF2 scintillator and a photoelectron multiplier; (C) measurement temperature and atmosphere: 25° C., in vacuum; (D) annihilation ?-ray counts: 3×106 or larger; and (E) positron beam energy: 10 keV.

Abstract: Disclosed is a method of manufacturing an electronic device, that includes obtaining a stack of the first electronic component and the second electronic component, while placing a resin layer which contains a flux-active compound and a thermosetting resin, between the first terminals and the second terminals; bonding the first terminals and the second terminals with solder, by heating the stack at a temperature not lower than the melting point of solder layers on the first terminals, while pressurizing the stack using a fluid; and curing the resin layer. The duration from the point of time immediately after the start of heating of the stack, up to the point of time when the temperature of the stack reaches the melting point of the solder layers, is set to 5 seconds or longer, and 15 minutes or shorter.

Abstract: The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000 Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection tell finals as well as highly-reliable insulation between adjacent terminals can be achieved.

Abstract: A substrate on which an optical element is mounted is provided, including: an optical element; an optical circuit substrate which is formed by an optical waveguide layer having a core portion and cladding portions; and an electrical circuit substrate on which is provided a mounting portion that is used for mounting the optical element, wherein the optical element is mounted on the electrical circuit substrate via the optical circuit substrate and wherein the optical circuit substrate has an optical element mounted thereon and is provided with a receptor structure having a conductive portion that conducts electricity between an electrode of the optical element and an electrode of the electrical circuit substrate.

Abstract: Disclosed is an adhesive film in which the adhesive film contains a thermosetting resin (A), a curing agent (B), a compound having flux activity (C) and a film forming resin (D), the minimum melt viscosity of the adhesive film is 0.01 to 10,000 Pa·s, and the adhesive film satisfies the following formula (1) when the exothermic peak temperature of the adhesive film is defined as (a) and the 5% weight loss temperature by thermogravimetry of the adhesive film is defined as (b), (b)?(a)?100 degrees centigrade??(1).