Abstract: A process for extracting and separating silver safely and selectively from a raw material containing slightly soluble silver compounds and recovering silver from the extract in a simple manner without resorting to electrolysis or a special reducing agent, and further recovering high-purity silver, includes mixing the raw material with an organic solvent solution of an organophosphorus compound containing in the molecule sulfur in the form of S.sup.2- ions, thereby extracting silver into an organic phase simultaneously with dissolving the slightly soluble silver compounds, stripping the silver from the organic phase containing the extracted silver with an aqueous solution of alkali sulfite and forming a stripping solution, and reducing the stripping solution to separate silver therefrom.

Abstract: A coating solution which forms a heat-ray shielding film on a transparent base of glass or plastic includes a dispersion obtained by dispersing in a dispersion medium as its main component fine particles of one or more oxides selected from the group consisting of ruthenium-, iridium- and rhodium-containing oxides, the particles having an average particle diameter of 100 nm or less.

Abstract: A transparent, electroconductive ink having therein ultra-fine ITO particles dispersed in a solvent or in a solvent containing a resin dissolved therein is coated and dried on a transparent support, then dried and optionally baked, and thereafter an overcoating liquid consisting essentially of silica sol is coated over the resulting transparent, electroconductive film formed on the support. This is then dried and optionally baked to obtain a transparent, electroconductive substrate having a specific resistance of 0.01 to 0.5 .OMEGA..cm, a haze value of 0 to 2%, and a volume content of the ultra-fine ITO particles in the film of being 40 to 75%. The substrate has a small surface resistivity and has excellent optical characteristics and weather resistance.

Abstract: It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.

Abstract: An apparatus for continuously and automatically measuring deformation and warp of a shaped electrode plate for electrolysis before the electrode plate includes means for lifting shaped electrode plates 1 hanging from crossbars 2 one by one to a predetermined measurement position by a suspending apparatus having a hanger mechanism and adjusting it about a measurement vertical plane position; for so freely suspending the electrode plate 1 vertically about the underside of a crossbar 2 that the electrode plate is not subject to deformation caused by the influence of its own weight or external forces; and a computing device 23 for continuously scanning the flatness of the electrode plate 1 by a moving mechanism which moves sensors 11a, 11b which measure distances between the electrode plate 1 and planes parallel to and facing the front and rear sides of the electrode plate 1 respectively without making contact with the electrode plate horizontally and vertically over those planes and A/D converting and analyzing

Abstract: In a lead frame for a semiconductor device which includes a multiplicity of leads, and a heat spreader having an edge to which the leads are bonded by an insulating material coated with an adhesive, and a central portion to which a semiconductor chip is bonded, the heat spreader has a ring-shaped portion defined between its central portion and the inner ends of the leads, and having a width of at least 0.5 mm. The ring-shaped portion has a plurality of through holes occupying not more than 60% by area of that portion, and each of those holes has a width of at least 0.5 mm.

Abstract: Disclosed are a powder of indium-tin oxide aciculae suitable as an electroconductive filler for an electroconductive ink to be used for forming a transparent electroconductive film, a method for producing a raw material to be used for producing the powder of indium-tin oxide aciculae, which has a major diameter of 5 .mu.m or more and a ratio of the major diameter to the minor diameter of 5 or more, an electroconductive paste capable of forming a light-transmitting electroconductive film having sufficient electroconductivity and light transmittance by printing, such as screen-printing, followed by high-temperature baking, and a light-transmitting electroconductive film to be formed from the paste. The raw material is produced by heating and concentrating an aqueous solution containing indium ions and nitrato ions to form a high-viscosity slurry followed by separating a powder of aciculae from the slurry. By calcining the raw material, a powder of indium-tin oxide aciculae is produced.

Abstract: The temperature coefficient of resistance (TCR) is made zero with reduced noise in a thick film resistor composition essentially consisting of Pb.sub.2 Ru.sub.2 O.sub.6-7, organic vehicle and non-conductive glass by adding Ta.sub.2 O.sub.5 up to five weight %.

Abstract: An optical fiber guide structure used in industrial applications and a method of fabricating this structure. The optical fiber guide structure is excellent in dimensional accuracy, produces only small connection losses, and facilitates axial alignments and positioning. The method is initiated with preparing a silicon single-crystal substrate having a face of (110) orientation. An etching stopping layer, an epitaxial silicon layer, and a masking layer of silicon oxide are successively formed on the substrate. A photoresist is applied to the surface of the masking layer. Then, a development step, an etching step, and a peeling step are carried out. Thus, a substrate provided with rectangular grooves extending parallel to a (111) plane of the substrate is fabricated.

Abstract: A lead frame in which a bulgy portion is disposed to each of inner leads or outer leads at a position corresponding to a mold line, whereby a lead gap in the portion is defined as less than 0.15 mm.The lead frame has such a shape as causing less resin leakage upon applying resin molding to a packaging main body upon preparing an IC plastic package. This enables to improve the yield in preparing the IC plastic package and reduce the manufacturing cost.

Abstract: A process for dissolving used catalyst includes the steps of roasting, after subjecting to an optional deoiling treatment, the used catalyst at a temperature lower than 1,000.degree. C. but not lower than the temperature at which any of the residual components in the used catalyst undergoes ignition and combustion where the residual components are selected from the group consisting of oils, sulfur components, and carbon components; and dissolving the roasted product using sulfuric acid after adding a metal to the roasted product as a catalyst for accelerating dissolution. The process provides a simple and efficient method for completely dissolving a used catalyst having a carrier containing alumina as the principal component.

Abstract: The gasification burner of this invention capable of maintaining a high combustion rate for a long period of time comprises a combustion chamber having a ceiling with a small hole in its center, a pre-mixing pipe fitted into the small hole and having a nozzle at its top, wherein the pre-mixing pipe and the combustion chamber are concentric, and the spread angle of the gas flow sprayed from the end of the pre-mixing pipe is between 10 and 40 degrees, so that the relationship between the bottom of the combustion chamber and the conical gas flow is regulated by keeping a good balance between the gasification rate of the powdered coke and the life of the combustion chamber.

Abstract: A ceramic substrate sintered at low temperature comprising: 20 to 50% by volume of an anorthite (CaAl.sub.2 Si.sub.2 O.sub.8) crystal phase, 1 to 20% by volume of a gahnite (ZnAl.sub.2 O.sub.4) crystal phase and the balance of a glass phase and, further, containing 35 to 50% by weight of alumina (Al.sub.2 O.sub.3) as a filler. Since the substrate can be sintered at a temperature lower than 900.degree. C., has a mechanical strength as large as more than 2500 kgf/cm.sup.2 and a thermal expansion coefficient of less than 60.times.10.sup.-7 /.degree.C., Au Ag and Cu can be used as a conductor and the substrate can be used like that existent alumina substrate.

Abstract: Disclosed are a flexible wiring board in which the thickness of at least one part of the insulating film support to be bent in actual use of the board is made thinner than that of the other parts of it and the surfaces of the conductive patterns containing the part to be bent are covered each with a silicone rubber coveray, and a method of preparing the board. The board has sufficient flexibility enough to be well bent at the determined part in actual use thereof with ensuring the reliability of connection at the bent part.

Abstract: A powder for producing permanent magnets, comprising a blend of powders [A] and [B] or [C] wherein:alloy powder [A] has an R.sub.2 Fe.sub.14 B phase and contains, in atomic percent, from 11 to 13% of at least one rare element, R, inclusive of Y, from 4 to 12% of B, and the balance Fe; or optionally, said powder has an R.sub.2 (Fe,Co).sub.14 B phase, an R.sub.2 (Fe,Ni).sub.14 B phase or an R.sub.2 (Fe,Co,Ni).sub.14 B phase, containing at least one selected from the group consisting of 10% or less of Co and 3% or less of Ni as a partially substitute for Fe;powder [B] is an intermetallic compound having an intermetallic compound phase of R with Fe or Co inclusive of an R.sub.

Abstract: A method of manufacturing a copper-polyimide substrate, includes hydrophilicating the surface(s) of a polyimide film, applying a catalyst thereto, subjecting the film to electroless plating, heat-treating it in an inert atmosphere, and subjecting it to electroless copper plating or to electroless copper plating followed by electrolytic copper plating. The hydrophilication of the surface(s) of the polyimide film is effected with an aqueous solution containing a hydrazine hydrate and an alkali metal hydroxide or with an aqueous solution containing a permanganate and/or a hypochlorite, then a catalyst is applied to the surface(s) by an ordinary way, then the surface(s) is/are subjected to electroless plating with any one of nickel, cobalt nickel alloys or cobalt alloys to form a plated layer thereon having a thickness of from 0.01 to 0.1 .mu.

Abstract: A process for fabricating a magnetic disk which comprises texturing a magnetic disk substrate made of a non-magnetic material having provided on the surface thereof a hard layer of a metal or an oxide to thereby provide fine irregularities on the surface of said substrate, followed by establishing thereon a magnetic recording layer comprising a film of a ferromagnetic metal, wherein said texturing is carried out using a processing solution comprising an aqueous solution of a surface active agent having dispersed therein diamond abrasive grains substantially only not larger than 4 .mu.m in grain diameter.

Abstract: A two-layer film carrier for TAB is made from a substrate prepared by forming a copper layer on a polyimide film by additive plating. A photoresist layer is formed on the copper layer, and another photoresist layer on the polyimide film. Both of the photoresist layers are simultaneously exposed to light through a mask applied to each of them to define a desired pattern. The exposed portions of the photoresist layer on the copper layer are subjected to development and postbaking, whereby selected portions of the copper layer are exposed. The exposed portions of the copper layer are additive plated with copper, whereby leads are formed. The exposed portions of the photoresist layer on the polyimide film are subjected to development and postbaking, whereby selected portions of the polyimide film are exposed. The remaining portions of the photoresist layer are removed from the copper layer and the underlying copper layer is etched.

Abstract: A composite lead frame in which an island formed with a greater diameter than that of a semiconductor device to be mounted is attached to a lead frame main body having leads being integrally protruded inward, the top ends of the leads are bonded with corresponding fine leads of the island at one ends thereof and lead terminals of the semiconductor device are connected respectively to the other ends of the corresponding fine leads, wherein the composite lead frame comprises an insulating sheet appended on one surface of the island and having the fine leads secured thereto being protruded outward and through holes disposed discretely passing through the insulating sheet and the island so that the wire bonding portions at the other ends of the fine leads are exposed.

Abstract: A method of preparing a catalyst for hydrogenation of a hydrocarbon oil, wherein an aqueous solution containing a metal of Group VI of the Periodic Table and a metal of Group VIII of the same, along with a hydroxycarboxylic acid and optionally phosphoric acid is added to a carrier substance consisting essentially of at least one of an inorganic oxide and an inorganic hydrate, and the resulting blend is kneaded, shaped and thereafter dried at a temperature not higher than 200.degree. C. The catalyst has a high catalyst activity and is used for hydrogenation of a hydrocarbon oil, especially satisfying the requirement of reducing the sulfur content in a light oil.