Abstract: A multi-chamber semiconductor manufacturing system is provided, including: a base, a plurality of processing units and a transfer unit. The base includes a main body and a plurality of supporting frames protrudingly disposed on a mounting surface of the main body. The plurality of processing units are connected to the plurality of supporting frames. The transfer unit is connected to the plurality of supporting frames and located between the plurality of processing units. The transfer unit is configured to transfer a substrate between the plurality of processing units. An aspect ratio value of the base is between 1 and 3.

Abstract: An atomic layer deposition system is provided, including: a main body, a platform, a gas distribution showerhead assembly and a first ring member. The main body defines a reaction chamber, and the platform is located in the reaction chamber. The gas distribution showerhead assembly is disposed on the main body and includes at least one gas inlet channel and at least one gas diffusion plate. Each of the at least one gas diffusion plate includes a plurality of through holes. The first ring member defines a radial direction and is disposed between the platform and the at least one gas diffusion plate. A region of the at least one gas diffusion plate distributed with the plurality of through holes defines an outermost distribution profile. An inner circumferential wall of the first ring member and the outermost distribution profile keep a distance in the radial direction.

Abstract: A miniaturized semiconductor manufacturing system including: a housing, a lifting mechanism, a processing chamber and a transportation mechanism. The housing includes an inner space and an opening communicated with the inner space. The lifting mechanism is disposed in the inner space and includes a holder configured for a substrate to be placed thereon. The holder is movable in a first direction relative to the opening between a first position and a second position. The processing chamber is disposed in the inner space and includes a holding portion configured for the substrate to be placed thereon. The transportation mechanism is disposed between the lifting mechanism and the processing chamber and is movable in a second direction. Wherein an aspect ratio value of the housing is between 1 to 6.