Miniaturized semiconductor manufacturing device
Description
The broken lines in the drawings illustrate portions of the miniaturized semiconductor manufacturing device which form no part of the claimed design.
Claims
We claim the ornamental design for a miniaturized semiconductor manufacturing device, as shown and described.
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Patent History
Patent number: D990538
Type: Grant
Filed: Feb 5, 2021
Date of Patent: Jun 27, 2023
Assignee: Syskey Technology Co., Ltd. (Hsinchu County)
Inventors: Hsueh-Hsien Wu (Hsinchu), Chih-Yuan Chan (Hsinchu County)
Primary Examiner: Patricia A Palasik
Application Number: 29/769,489
Type: Grant
Filed: Feb 5, 2021
Date of Patent: Jun 27, 2023
Assignee: Syskey Technology Co., Ltd. (Hsinchu County)
Inventors: Hsueh-Hsien Wu (Hsinchu), Chih-Yuan Chan (Hsinchu County)
Primary Examiner: Patricia A Palasik
Application Number: 29/769,489
Classifications
Current U.S. Class:
Material Working, Abrading, Or Founding Machinery (D15/122)