Miniaturized semiconductor manufacturing device

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Description

FIG. 1 is a top, front, right perspective view of a miniaturized semiconductor manufacturing device showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines in the drawings illustrate portions of the miniaturized semiconductor manufacturing device which form no part of the claimed design.

Claims

We claim the ornamental design for a miniaturized semiconductor manufacturing device, as shown and described.

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Patent History
Patent number: D990538
Type: Grant
Filed: Feb 5, 2021
Date of Patent: Jun 27, 2023
Assignee: Syskey Technology Co., Ltd. (Hsinchu County)
Inventors: Hsueh-Hsien Wu (Hsinchu), Chih-Yuan Chan (Hsinchu County)
Primary Examiner: Patricia A Palasik
Application Number: 29/769,489