Abstract: Embodiments that allow both high density and low density interconnection between microelectronic die and motherboard via. Direct Chip Attach (DCA) are described. In some embodiments, microelectronic die have a high density interconnect with a small bump pitch located along one edge and a lower density connection region with a larger bump pitch located in other regions of the die. The high density interconnect regions between die are interconnected using an interconnecting bridge made out of a material that can support high density interconnect manufactured into it, such as silicon. The lower density connection regions are used to attach interconnected die directly to a board using DCA. The high density interconnect can utilize current Controlled Collapsed Chip Connection (C4) spacing when interconnecting die with an interconnecting bridge, while allowing much larger spacing on circuit boards.

Abstract: A method and apparatus for monitoring an internet-of-things (INT) battery device (IBD). An example IBD includes a radio transceiver to communicate with an loT charging device (ICD), a battery, and a battery monitor to determine a state of charge for the battery. An alerter is included to send an alert message to the ICD, via the radio transceiver, to indicate that the SoCh is less than an alert threshold.

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a first die on a board, attaching an interposer on a top surface of the first die, and attaching a second die on the top surface of the first die that is adjacent the interposer, wherein the second die is offset from a center region of the first die. A first wire conductive structure may be attached to the second die that extends from the second die to a top surface of the interposer. A second wire conductive structure is attached to the interposer and extends from the interposer to the board.

Abstract: Techniques to couple a high bandwidth memory device on a silicon substrate and a package substrate are disclosed. Examples include selectively activating input/out (I/O) or command and address (CA) contacts on a bottom side of a logic layer for the high bandwidth device based on a mode of operation. The I/O and CA contacts are for accessing one or more memory devices include in the high bandwidth memory device via one or more data channels.

Abstract: An electronic device may include a substrate, and the substrate may include one or more layers. The one or more layers may include a first dielectric material and one or more electrical traces. A cavity may be defined in the substrate, and the cavity may be adapted to receive one or more electrical components. One or more lateral traces may extend through a wall of the cavity. The lateral traces may provide electrical communication pathways between the substrate and the electrical components.

Abstract: Embodiments of a system and method for controlling a device charging on a wireless charger are generally described herein. A method may include disabling, in response to determining that the device is currently charging on the wireless charger, haptic feedback at the device, determining whether the device is in a night mode or a day mode, in response to determining that the device is in the night mode and currently charging on the wireless charger, disabling notifications of the device, and enabling, in response to determining that the device is in the day mode, the haptic feedback and the notifications when the device has been removed from the wireless charger.

Abstract: Non-planar semiconductor devices having doped sub-fin regions and methods of fabricating non-planar semiconductor devices having doped sub-fin regions are described. For example, a method of fabricating a semiconductor structure involves forming a plurality of semiconductor fins above a semiconductor substrate. A solid state dopant source layer is formed above the semiconductor substrate, conformal with the plurality of semiconductor fins. A dielectric layer is formed above the solid state dopant source layer. The dielectric layer and the solid state dopant source layer are recessed to approximately a same level below a top surface of the plurality of semiconductor fins, exposing protruding portions of each of the plurality of semiconductor fins above sub-fin regions of each of the plurality of semiconductor fins. The method also involves driving dopants from the solid state dopant source layer into the sub-fin regions of each of the plurality of semiconductor fins.

Abstract: Embodiments of an invention related to compacted context state management are disclosed. In one embodiment, a processor includes instruction hardware and state management logic. The instruction hardware is to receive a first save instruction and a second save instruction. The state management logic is to, in response to the first save instruction, save context state in an un-compacted format in a first save area. The state management logic is also to, in response to the second save instruction, save a compaction mask and context state in a compacted format in a second save area and set a compacted-save indicator in the second save area. The state management logic is also to, in response to a single restore instruction, determine, based on the compacted-save indicator, whether to restore context from the un-compacted format in the first save area or from the compacted format in the second save area.

Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

Abstract: Systems, methods, and circuitries are disclosed for a per-process memory encryption system. At least one translation lookaside buffer (TLB) is configured to encode key identifiers for keys in one or more bits of either the virtual memory address or the physical address. The process state memory configured to store a first process key table for a first process that maps key identifiers to unique keys and a second process key table that maps the key identifiers to different unique keys. The active process key table memory configured to store an active key table. In response to a request for data corresponding to a virtual memory address, the at least one TLB is configured to provide a key identifier for the data to the active process key table to cause the active process key table to return the unique key mapped to the key identifier.

Abstract: An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 11 nanometers, fin height is greater than 155 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. An integrated circuit device with a substrate and a plurality of fins is provided where fin width is less than 15 nanometers, fin height is greater than 190 nanometers and spacing between any two neighboring fins is less than 30 nanometers and each fin is in non-collapsed state. A method for forming a fin-based transistor structure is provided where a plurality of fins on a substrate are pre-treated with at least one of a self-assembled monolayer, a non-polar solvent, and a surfactant. One or more of these treatments is to reduce adhesion and/or cohesive forces to prevent occurrence of fin collapse.

Abstract: The present disclosure is directed to a computer-assisted or autonomous driving (CA/AD) vehicle with a controller to control one or more light emitters to produce a light pattern that uniquely identify the vehicle. It may also be directed to a system to receive image data from one or more video cameras located in a location vicinity of the CA/AD vehicle emitting a pattern of light, and to analyze the received image data to determine a physical location of the vehicle.

Abstract: Computer-readable storage media, computing devices, and methods associated with an adaptive learning environment associated with an adaptive learning environment are disclosed. In embodiments, a computing device may include an instruction module and an adaptation module operatively coupled with the instruction module. The instruction module may selectively provide instructional content of one of a plurality of instructional content types to a user of the computing device via one or more output devices coupled with the computing device. The adaptation module may determine, in real-time, an engagement level associated with the user of the computing device and may cooperate with the instruction module to dynamically adapt the instructional content provided to the user based at least in part on the engagement level determined. Other embodiments may be described and/or claimed.

Abstract: Power governance circuitry is provided to control a performance level of a processing unit of a processing platform. The power governance circuitry comprises measurement circuitry to measure a current utilization of the processing unit at a current operating frequency and to determine any change in utilization or power and frequency control circuitry is provided to update the current operating frequency to a new operating frequency by determining a new target quantified power expenditure to be applied in a subsequent processing cycle depending on the determination of any change in utilization or power. A new operating frequency is selected to satisfy the new target quantified power based on a scalability function specifying a variation of a given value of utilization or power with the operating frequency. A processing platform and machine readable instructions are provided to set a new quantified target power of a processing unit.

Abstract: Examples disclosed herein include a mobile computing device to determine network condition information associated with a route segment. The route segment may be one of a number of route segments defining at least one route from a starting location to a destination. The mobile computing device may determine a route from the starting location to the destination based on the network condition information. The mobile computing device may upload the network condition information to a crowdsourcing server. A mobile computing device may predict a future location of the device based on device context, determine a safety level for the predicted location, and notify the user if the safety level is below a threshold safety level. The device context may include location, time of day, and other data. The safety level may be determined based on predefined crime data.

Abstract: Methods and apparatus are disclosed for battery current monitoring. An example apparatus includes a haptic device, an isolation switch to deliver power from a battery to the haptic device, an integrator to integrate a signal based on a current from the battery to the haptic device to generate an integrator output, and control logic to control the isolation switch based on a comparison of the integrator output to a threshold.

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate, at least one dielectric layer on the substrate and a plurality of conductive lines within the at least one dielectric layer. The microelectronic device also includes an air gap structure that is located below two or more of the plurality of conductive lines.

Abstract: Techniques are provided for generation of synthetic 3-dimensional object image variations for training of recognition systems. An example system may include an image synthesizing circuit configured to synthesize a 3D image of the object (including color and depth image pairs) based on a 3D model. The system may also include a background scene generator circuit configured to generate a background for each of the rendered image variations. The system may further include an image pose adjustment circuit configured to adjust the orientation and translation of the object for each of the variations. The system may further include an illumination and visual effect adjustment circuit configured to adjust illumination of the object and the background for each of the variations, and to further adjust visual effects of the object and the background for each of the variations based on application of simulated camera parameters.

Abstract: Embodiments of a system and method for controlling a device charging on a wireless charger are generally described herein. A method may include disabling, in response to determining that the device is currently charging on the wireless charger, haptic feedback at the device, determining whether the device is in a night mode or a day mode, in response to determining that the device is in the night mode and currently charging on the wireless charger, disabling notifications of the device, and enabling, in response to determining that the device is in the day mode, the haptic feedback and the notifications when the device has been removed from the wireless charger.

Abstract: A method and apparatus for monitoring an internet-of-things (IoT) battery device (IBD). An example IBD includes a radio transceiver to communicate with an IoT charging device (ICD), a battery, and a battery monitor to determine a state of charge for the battery. An alerter is included to send an alert message to the ICD, via the radio transceiver, to indicate that the SoCh is less than an alert threshold.