Patents Assigned to Tai-Sol Electronics Co., Ltd.
  • Publication number: 20090244837
    Abstract: A heat-dissipating module includes a heat-dissipating member and at least one heat pipe. The heat-dissipating member includes a pillared convexity and an annular groove formed on and surrounding the heat-dissipating member. The at least one heat pipe passes through the annular groove, partially surrounding the convexity and stopped against the convexity.
    Type: Application
    Filed: June 17, 2008
    Publication date: October 1, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Cheng-Chin Chan, Chun-Huang Chou
  • Publication number: 20090244844
    Abstract: A heat-dissipating module includes a heat sink, a plurality of fixtures, and a plurality of fasteners. The heat sink includes a plurality of fins and a plurality of hollowed portions located at a periphery thereof. Each of the fixtures includes a support portion and two lap joint portions. Each of the two lap joint portions has a fasten hole. Each of the support portions has a support hole. Each of the fixtures corresponds to one of the hollowed portions. The two lap joint portions of each fixture are mounted to a top edge of the fins and close to two sides of the support portion. The fasteners fasten the lap joint portions to the heat sink. In this way, the heat sink and the fixtures are fastened with each other to enhance the structural durability of the heat-dissipating module. In addition, the heat-dissipating module is small-sized, taking less space.
    Type: Application
    Filed: June 17, 2008
    Publication date: October 1, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chin-Chun Liao, Meng-Hung Ko
  • Publication number: 20090231814
    Abstract: A protective cap for thermal grease of a heat sink includes a sheet member having a main concavity recessed downward from a center thereof; and four corner concavities recessed downward from four corners located a periphery of the main concavity respectively. Each of at least two of the corner concavities has an interference hole formed at a bottom sidewall thereof. The interference holes are to be interference fit with respective screw bolts located at the bottom side of the heat sink to fasten the sheet member, whereby the thermal grease located at a bottom side of the heat sink can be covered for protection.
    Type: Application
    Filed: June 17, 2008
    Publication date: September 17, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chin-Chun Liao, Meng-Hung Ko, De-Cheng Luo
  • Publication number: 20090219691
    Abstract: A heat sink includes a heat-dissipating member and a cooling fan. The heat-dissipating member includes at least two spaced fins. Each of the two fins has a first side, a second side, and a deflection piece mounted to a surface thereof. Each of the deflection pieces is inclined, extending from the first side toward the second side and engaging the adjacent fin. The cooling fan is mounted to the heat-dissipating member and close to the first sides of the fins. Accordingly, the heat sink enlarges the heat-dissipating area and enhances the heat-dissipating efficiency on the whole.
    Type: Application
    Filed: April 10, 2008
    Publication date: September 3, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventor: Shih-Chih Lin
  • Publication number: 20090219690
    Abstract: A heat sink capable of external deflection includes a heat-dissipating member, a cooling fan, and a deflector. The heat-dissipating member includes an entrance side and an exit side. The cooling fan is mounted at the entrance side of the heat-dissipating member. The deflector includes at least one inlet, at least one outlet, and at least one passage in communication with the at least one inlet and outlet. The deflector is mounted to the heat-dissipating member in such a way that each of the at least one inlet is close to the entrance side, each of the at lease one passage extends to an external side of said exit side, and each of the at least one outlet faces a lower side of the heat-dissipating member. Therefore, the heat sink attains relatively larger heat-dissipating range and relatively higher heat-dissipating efficiency on the whole.
    Type: Application
    Filed: April 10, 2008
    Publication date: September 3, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Shih-Chih Lin, De-Cheng Luo
  • Patent number: 7540783
    Abstract: A card connector includes a housing defining multiple accommodation chambers, pressure boards respectively and vertically movably accommodated in the accommodation chambers, each pressure board having slots and rear bearing portions protruding over the top wall, and multiple sets of metal terminals mounted in the housing and respectively curving upwardly forwards in the accommodation chambers to support the respective pressure boards in the respective accommodation chamber. By means of the effect of the rear bearing portions of the pressure boards, the inserted memory card touches only the matching metal terminals and the other metal terminals that do not match are kept away from the inserted memory card, preventing damage.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: June 2, 2009
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Yaw-Huey Lai, Gwo-Bin Shiue
  • Publication number: 20090137139
    Abstract: A fool-proof card connector includes a housing that has an opening, a card-receiving space, a chamber in a sidewall at one side of the chamber, a stop block that is pivotally mounted in the chamber and has a stop face, and a spring member mounted in the chamber for biasing the stop block toward the outside of the chamber to a biased position where the stop face of the stop block is suspending in the card-receiving space to stop incorrect insertion of a MS memory card.
    Type: Application
    Filed: March 3, 2008
    Publication date: May 28, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Gwo-Bin Shiue, Li-Guang Zou
  • Patent number: 7538356
    Abstract: An LED and liquid-vapor heat-dissipating device assembly is composed of a liquid-vapor heat-dissipating device and at least one LED unit. The liquid-vapor heat-dissipating device includes a metal housing, a predetermined amount of liquid, and a capillary member. The LED unit includes an LED chip mounted to and electrically connected with the metal housing, an insulating board mounted to the surface of the metal housing, an electrode located on the insulating board, a wire having two ends connected with the LED chip and the electrode respectively, and a sealant fully encapsulating the wire and the LED chip and at least partially encapsulating the insulating board and the electrode. Accordingly, the heat generated by the LED chip can be directly conducted to the liquid-vapor heat-dissipating device and, such that the present invention has preferably thermally conductive/dissipating efficiency.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: May 26, 2009
    Assignee: Tai-Sol Electronics Co., Ltd
    Inventor: Yaw-Huey Lai
  • Publication number: 20090104817
    Abstract: A card connector includes a housing defining multiple accommodation chambers, pressure boards respectively and vertically movably accommodated in the accommodation chambers, each pressure board having slots and rear bearing portions protruding over the top wall, and multiple sets of metal terminals mounted in the housing and respectively curving upwardly forwards in the accommodation chambers to support the respective pressure boards in the respective accommodation chamber. By means of the effect of the rear bearing portions of the pressure boards, the inserted memory card touches only the matching metal terminals and the other metal terminals that do not match are kept away from the inserted memory card, preventing damage.
    Type: Application
    Filed: March 5, 2008
    Publication date: April 23, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Yaw-Huey Lai, Gwo-Bin Shiue
  • Publication number: 20090101921
    Abstract: AN LED and thermal conductivity device combination assembly includes a thermal conductivity device, two conducting members each having a metal conducting wire and an insulator surrounding the metal conducting wire and attached to the thermal conductivity device, LED chips each having a positive electrode and a negative electrode disposed at the top side and an insulation layer disposed at the bottom side and bonded to the surface of the thermal conductivity device, lead wires connected between the positive electrode and negative electrode of the LED chips and the metal conducting wires of the conducting members to connect the LED chips in series and in parallel, and a packaging device covering the LED chips.
    Type: Application
    Filed: December 5, 2007
    Publication date: April 23, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventor: Yaw-Huey Lai
  • Publication number: 20090095961
    Abstract: A combination of LED and heat dissipating device includes a heat dissipating device, an electrically insulative thermal conductivity layer covered on a part of the surface of the heat dissipating device, thermal and electric conducting layers disposed at the electrically insulative thermal conductivity layer and electrically isolated from one another, LED units each having an LED unit installed in one thermal and electric conducting layer and a lead wire that connects the LED chip of the respective LED unit to the LED chip of another LED unit, and a packaging device covering the LED units.
    Type: Application
    Filed: December 5, 2007
    Publication date: April 16, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventor: Yaw-Huey Lai
  • Publication number: 20090098672
    Abstract: A method for making a heat dissipating device for LED installation, comprising the steps of a) preparing a thermal member having a metal surface, b) covering at least a part of the metal surface of the thermal member with a electrically insulative thermal conductivity layer, and c) providing multiple conducting layers at the electrically insulative thermal conductive layer for the installation of LED (light emitting diode) chips.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 16, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventor: Yaw-Huey Lai
  • Publication number: 20090090487
    Abstract: A heat pipe includes a pipe body having two enclosed ends and defining a heat absorbing section and a condensing section, a wick structure formed on the inside wall of the pipe body and having a thickness relatively thicker at the heat absorbing section and relatively thinner at the condensing section, and a working fluid filled in the pipe body. By means of the design that the diameter of the space surrounded by the wick structure in the condensing section is greater than that in the heat absorbing section, the heat pipe eliminates fluid accumulation and maintains excellent temperature uniformity.
    Type: Application
    Filed: December 5, 2007
    Publication date: April 9, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD
    Inventor: Yaw-Huey Lai
  • Publication number: 20090067171
    Abstract: An LED illuminating device includes a column-shaped thermally conductive member having a taper-shaped portion at a front end thereof and being electrically conductive; a first insulating layer partially covered on the taper-shaped portion; a taper-shaped member sleeved onto the first insulating layer, covered above the taper-shaped portion, and spaced from the taper-shaped portion by the first insulating layer having a plurality of through holes and being electrically conductive; and a plurality of LED units mounted to the taper-shaped portion, passing through the through holes respectively, and exposed outside the taper-shaped member. Each of the LED units includes at least one LED chip having two electrodes electrically connected with the thermally conductive member and the taper-shaped member respectively. Therefore, the LED illuminating device has preferable efficiency of thermal dissipation for LEDs and provides larger area for mounting LED units thereto.
    Type: Application
    Filed: February 29, 2008
    Publication date: March 12, 2009
    Applicant: TAI-SOL ELECTRONICS CO. , LTD.
    Inventor: Yaw-Huey Lai
  • Publication number: 20090061674
    Abstract: A card connector includes a housing, a base, a slidable member, three of which are provided in the base and define a receiving chamber for receiving a memory card thereamong, and a spring. A tongue is provided on a sidewall of the housing. The memory card has a locating recess formed at one side thereof corresponding to the tongue. The slidable member includes a recession formed on a sidewall thereof corresponding to the tongue, and an opening cut through the sidewall and in communication with the recession. A hooked member is provided in the recession. The recession is provided with a first matching portion, and the hooked member has a second matching portion for joint with the first matching portion. Therefore, the card connector is structurally simple, of secure locking, and can effectively engage and prevent an electronic card inserted therein from falling-off.
    Type: Application
    Filed: February 27, 2008
    Publication date: March 5, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventor: Yaw-Huey Lai
  • Publication number: 20090054145
    Abstract: A 3-D wireless game controller includes a housing having an upper surface, a lower surface, and a grip for holding by the user's hand; a push control element mounted to the upper surface of the housing; a rotation control element rotatably mounted to the lower surface of the housing and located corresponding to the user's forefinger pad while the user holds the grip; a gravity sensor mounted to the housing; a power unit mounted in the housing; and a wireless communication module electrically connected with the push control element, the rotation control element, and the gravity sensor. In light of this, the 3-D wireless game controller allows the user's finger pad to roll the rotation control element for additional control functions.
    Type: Application
    Filed: December 5, 2007
    Publication date: February 26, 2009
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Cheng-Yun Yang, Chun-Chin Lin
  • Patent number: 7494380
    Abstract: A multi-purpose multiple-slot card connector for use with one single card once only includes a base frame having three slots defined as a left slot, a right slot, and an upper slot, a partition spacing the left slot from the right slot, and a spacer located at a bottom side of the upper slot and having a first hollow portion formed at a midsection thereof; a horizontal swivel member located between the left and right slots and two stop walls for interference with either of the left and right slots; a vertical pivot member corresponding to the first hollow portion and pivotably mounted to two lateral sidewalls of the upper slot and having a stop plate and two extensions extending toward one side from the stop plate and located above the left and right slots; and a plurality of terminals mounted in each of the slots.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: February 24, 2009
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventor: Yaw-Huey Lai
  • Patent number: 7491074
    Abstract: A card connector includes a housing, a base, a slidable member, three of which are provided in the base and define a receiving chamber for receiving a memory card thereamong, and a spring. A tongue is provided on a sidewall of the housing. The memory card has a locating recess formed at one side thereof corresponding to the tongue. The slidable member includes a recession formed on a sidewall thereof corresponding to the tongue, and an opening cut through the sidewall and in communication with the recession. A hooked member is provided in the recession. The recession is provided with a first matching portion, and the hooked member has a second matching portion for joint with the first matching portion. Therefore, the card connector is structurally simple, of secure locking, and can effectively engage and prevent an electronic card inserted therein from falling-off.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: February 17, 2009
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventor: Yaw-Huey Lai
  • Patent number: 7465197
    Abstract: A low profile design of multi-in-one card connector includes a base frame having two upright sidewalls and a guide groove at the front side of each upright sidewall and defining a front insertion opening, multiple terminal sets mounted in the base frame, two limiter blocks vertically movably mounted in the guide grooves of the upright sidewalls each having a top stop flange and a bottom stop flange, at least one of the top and bottom stop flanges of each limiter block being held in the front insertion opening to prohibit insertion of a second memory card after insertion of a first memory card, and two elastic members supporting the limiter blocks in an upper limit position.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: December 16, 2008
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Wen-Han Wu, Chin-Hwa Wu
  • Publication number: 20080301943
    Abstract: The present invention provides a method of combining heat pipes and fins and the assembly thereof. The fins are stacked, each of which has holes, extending walls around the holes, lateral plates beside the extending walls to form a receiving portion therein communicated with a first opening of the extending wall respectively. The fins are placed with the receiving portions under the holes first. A solder material is injected into the receiving portions by a needle. The heat pipes are inserted into the holes of the fins, and then the fins are tipped over to have the receiving portions above the holes. Now the fins are heated to melt the solder material, and the molten solder material will flow to spaces between the heat pipe and the extending walls of the fins to fix the heat pipes to the fins.
    Type: Application
    Filed: August 30, 2007
    Publication date: December 11, 2008
    Applicant: TAI-SOL ELECTRONICS CO., LTD.
    Inventor: Ko-Pin Liu