Abstract: A contact structure disposed on a substrate is provided. The contact structure includes at least one pad, at least one polymer bump and at least one conductive layer. The pad is disposed on the substrate and the polymer bump is disposed on the substrate. The polymer bump has a curved surface having a plurality of concave-convex structures. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Abstract: A method for fabricating a display substrate is provided. A substrate is provided first. After that, an alignment film coating and an alignment treatment are performed to the substrate, and a layer of photoreactive monomer material is coated on the surface of the substrate after the alignment treatment. Thereafter, the layer of photoreactive monomer material is selectively irradiated by UV light in an exposed region, and the layer of photoreactive monomer material in an unexposed region is removed for liquid crystal molecules to have different pretilt angles in the exposed region and the unexposed region.

Abstract: A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.

Abstract: A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

Abstract: A electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.

Abstract: An etchant for patterning composite layer containing copper is provided. The etchant includes peracetic acid being about 5% to 40% by weight and serving as a major component, a peracetic acid stabilizer being about 5% to 15% by weight, an organic acid being about 5% to 10% by weight, an inorganic acid being about 5% to 15% by weight, a salt being about 8% to 15% by weight, which are based on the total weight of the etchant.

Abstract: A method to control the pretilt angle of a liquid crystal device is disclosed. The claimed invention provides two substrates and at least one vertical alignment layers, which are fabricated on one side of each substrate and are opposite to each other. Moreover, a liquid crystal layer is sandwiched between the alignment layers, and the preferred embodiment of the liquid crystal device has an Optically Compensated Birefrigence (OCB) configuration. More particularly, before the process of alignment for the liquid crystal device is performed, a pretilt angle disclosed in the present invention is adjusted since at least one vertical alignment layer is treated with a particle beam generated by plasma or ions. The pretilt angle can range between 5 and 85 degrees.

Abstract: A method of manufacturing an optical film includes steps of providing a substrate first and performing an alignment treatment on the surface of the substrate or forming an alignment layer on the substrate. A first liquid crystal layer is then coated on the aligned surface of the substrate or on the surface of the alignment layer, and thereafter, a first curing step is performed. After a second alignment layer is coated on the surface of the first liquid crystal layer, a second curing step is performed so as to form a multi-layer including the first and second liquid crystal layers.

Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract: A method for producing a thin film transistor and including the following steps for preparing a glass substrate; having a positive photosensitive coating on the glass substrate; providing a transparent mold plate, having a plurality of ladder opaque protrusions in accordance with a predetermined pattern having different depth; controlling the transparent mold plate downwardly to press into the positive photosensitive coating and non-contacting to the glass substrate; exploring a part of the positive photosensitive coating via an explosion by a UV light; remaining the other part of the positive photosensitive coating, which is shielded by the protrusions and shaped corresponding to the predetermined pattern; separating the transparent mold plate from the glass substrate, and removing the other parts of the photosensitive coating unshielded via a chemical solvent. Thereby, after the positive photosensitive coating is pressed, cured, and cleaned the thin film transistor is formed.

Abstract: A method of measuring image-sticking of a display device based on a vision model is described. A display device is provided, and a test frame is displayed on the display device. The test frame has a pattern formed by a maximum gray level and a minimum gray level. After burning-in the test frame for a period of time, a gray frame at a medium gray level is displayed on the display device. The test frame, including portions of extreme black and extreme white, leaves image-sticking on the gray pattern at a medium gray level at the same time. Next, an image capture device is used to capture the image-sticking on the display device after burn-in. Finally, a vision model is employed to simulate the human visual perception on the image-sticking and to grade the image-sticking according to the human eye sensitivity for viewing the image-sticking on the display device.

Abstract: A method for fabricating a thin film transistor (TFT) is provided. A substrate having a gate, a dielectric layer, a channel layer and an ohmic contact layer formed thereon is provided. Next, a metal layer is formed over the substrate covering the ohmic contact layer. Next, the metal layer and the ohmic contact layer are simultaneously etched by a wet etching process to form a source/drain and expose the channel layer. Because the wet etching process can be used to selectively etch the ohmic contact layer, damage to the underlying channel layer may be negligible. Thus, the reliability of the device may be promoted. Furthermore, the process may be simplified, the production yield and the throughput of TFT may be increased.

Abstract: A bump structure including at least one contact pad, at least one first polymer bump, at least one second polymer bump, and a conductive layer is provided. The contact pad is disposed on a substrate, and the first polymer bump is also disposed on the substrate. The second polymer bump is disposed on the substrate and is connected to the first polymer bump. The conductive layer covers the first polymer bump and electrically connects the contact pad.

Abstract: A method for fabricating a reflective optical film is provided. A substrate is first provided. Next, a phase retardation film is formed on at least one side of the substrate by means of coating. Afterward, a cholesteric liquid crystal (CLC) layer is formed on the phase retardation film by means of coating. Hence, the conventional external bond fabrication process can be simplified. Further, the undesired optical results caused by the more disordered alignment in the upper layer of CLC being more disordered compared to that in the lower layer of CLC and the failure to display the compensation effect can be overcome.

Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.

Abstract: A light emitting optical film at least including a substrate, an alignment layer and a polarized light emitting liquid crystal film is provided, in which the polarized light emitting liquid crystal film includes liquid crystal and light-emitting dye. The alignment layer is located on one side of the substrate, and the polarized light emitting liquid crystal film is located on the alignment layer. The light emitting optical film can be applied to polarizing film, phase retardation film or color filter. Moreover, it is unnecessary to use conventional backlight module because overall arrangement of liquid crystal can fully emit uniform polarized light, whereby greatly reducing cost of conventional backlight module.

Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.

Abstract: A method that uses at least one hydrogen ion beam for alignment of liquid crystal molecules is proposed in the present invention. The method of the present invention is proposed to resolve the problems of physical destruction and surface deterioration of the alignment films caused by the conventional method using argon ions beams. The method of the present invention directly uses at least one hydrogen ion beam to impact the alignment film. Hence, the physical destruction of the alignment film is reduced. In addition, via the reaction between hydrogen ions and the alignment films, the quality of the alignment film is improved.

Abstract: A manufacturing method of an optical film is provided. The method includes the following steps. A substrate is provided first and a surface of the substrate is aligned or an alignment layer is formed on the substrate. Next, a defined pattern layer is formed on the aligned surface of the substrate or on a surface of the alignment layer at a first temperature. A first liquid crystal layer is then coated on the aligned surface of the substrate or the surface of the alignment layer to cover the defined pattern layer. Then, a first curing step is performed at a second temperature to enable the defined pattern layer and the first liquid crystal layer to form the optical film. A portion of the optical film having the defined pattern layer is characterized by a different liquid crystal alignment property from the other portion of the optical film.