Patents Assigned to TDK-MICRONAS GMBH
  • Patent number: 9746345
    Abstract: A method and an apparatus for determining a rotation angle of a rotor in a motor with the aid of angle sensors by measurement of reference values and correction of the effected computations. The method is used, for example, in a synchronous motor.
    Type: Grant
    Filed: October 18, 2015
    Date of Patent: August 29, 2017
    Assignee: TDK-Micronas GmbH
    Inventors: Marc Baumann, Redouane Sadeq
  • Patent number: 9739845
    Abstract: A method for testing a signal path of a first IC formed as a monolithically integrated circuit on a semiconductor body together with a magnetic field sensor and has a signal output and a power supply connection and a test mode state and a normal operating state. A power supply of the first IC is switched off, and a signal output is connected with a reference potential, and the power supply of the first IC is switched on and the signal output is disconnected from the reference potential. Subsequently in a test mode state, a self-test is performed in the first IC and a test pattern is configured at the signal output or at the power supply connection and the test pattern is evaluated by the control unit for testing of the signal path.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: August 22, 2017
    Assignee: TDK-Micronas GmbH
    Inventors: David Muthers, Joachim Ritter, Michael Wagner, Markus Von Ehr, Thomas Kauter
  • Patent number: 9739649
    Abstract: A method for increasing a reliability of a transducer is provided. The transducer has a first and a second IC, wherein the two ICs each have substantially the same monolithically integrated circuit components with one sensor apiece, and a signal contact for bidirectional data transmission. A reference contact on each of the two ICs is connected to or disconnected from the signal contact by a controllable switch, and a signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the signal contact. The two ICs are integrated into a common IC package, and a supply voltage contact of the first IC is connected to a first package contact, and the first package contact is connected to a first terminal of a control unit, and the supply voltage contact of the second IC is connected to a second package contact.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: August 22, 2017
    Assignee: TDK-Micronas GmbH
    Inventor: Michael Drescher
  • Patent number: 9733105
    Abstract: A magnetic field measuring device having a semiconductor body with a surface parallel to an x-y plane and having a magnet with a flat main extension surface parallel to the x-y plane, the direction of magnetization changes along the main extension surface due to at least two adjacent magnetic poles, the magnet being rotatable relative to the IC package about an axis of rotation extending in a z direction and the z direction being orthogonal to the x-y plane. An imaginary extension of the axis of rotation passes through the magnet. The semiconductor body has three magnetic field sensors spaced apart from one another on the surface, and each of the magnetic field sensors measures the same component of the magnetic field. All magnetic field sensors are located along the imaginary extension of the axis of rotation within the projection of the main extension surface.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: August 15, 2017
    Assignee: TDK-Micronas GmbH
    Inventor: Stefan Albrecht
  • Publication number: 20170227578
    Abstract: A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.
    Type: Application
    Filed: February 10, 2017
    Publication date: August 10, 2017
    Applicant: TDK-Micronas GmbH
    Inventors: Timo KAUFMANN, Klaus HEBERLE, Joerg FRANKE, Oliver BREITWIESER
  • Patent number: 9718224
    Abstract: An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: August 1, 2017
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Timo Kaufmann, Oliver Breitwieser, Klaus Heberle
  • Patent number: 9720873
    Abstract: A method for a deterministic selection of a sensor from a plurality of sensors, having a control unit and multiple sensors connected to the control unit by means of a three-wire bus, wherein the sensors are connected to the three-wire bus through at least two lines in parallel to one another, and a protocol frame in conformity with the SENT specification is used between the control unit and the sensors for a data exchange, and a particular sensor is selected within the protocol frame by the control unit through the predefined duration of a selection signal, wherein the duration of the selection signal is determined by the interval between a first falling signal edge and a second falling signal edge.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: August 1, 2017
    Assignee: TDK-Micronas GmbH
    Inventor: Michael Drescher
  • Patent number: 9714962
    Abstract: A monitoring device is provided that includes a first line section with a first connection point and a second connection point spaced apart from the first connection point in the direction of the line, and with a control unit and with a first current sensing unit, having a current source. A first switch is inserted into the first connecting line and connects the first current source to the first connection point or disconnects it therefrom. In a first state the first switch is closed and the first current is impressed on the first line section and a first voltage determined by the amplitude of the actual current, and in a second state the first switch is open and a second voltage is determined, and the control unit is configured to ascertain the amplitude of the first actual current from the two voltages.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: July 25, 2017
    Assignee: TDK-Micronas GmbH
    Inventor: Stefan Antonius Albrecht
  • Patent number: 9709639
    Abstract: A Hall effect sensor with multiple Hall effect elements, each of the Hall effect elements having a first contact terminal, a second contact terminal, and a third contact terminal arranged along a straight line. The multiple Hall effect elements are electrically connected in series in a closed circuit. The second contact terminals of the Hall effect elements are supply voltage connections or Hall voltage pickoffs, and the applicable second contact terminal of the Hall effect element is a center contact of the Hall effect element. The Hall effect elements form two pairs, and the Hall effect elements of one pair each measure the same component of a magnetic field and an operating current is impressed on the series circuit in the two Hall effect elements of this one pair, and a supply voltage is applied to the Hall effect elements of the other pair.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: July 18, 2017
    Assignees: TDK-Micronas GmbH, Albert-Ludwigs-Universitaet Freiburg
    Inventors: Christian Sander, Oliver Paul
  • Patent number: 9689931
    Abstract: A magnetic field sensor having a Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, whereby a first switch with a control input is provided between the first terminal contact and the fifth terminal contact, and the first switch connects or disconnects the first terminal contact to/from the fifth terminal contact, and a control unit is provided and the control unit is connected to the control input of the first switch.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: June 27, 2017
    Assignees: TDK-Micronas GmbH, Albert-Ludwigs-Universitaet Freiburg
    Inventors: Timo Kaufmann, Patrick Ruther, Roiy Raz, Oliver Paul
  • Patent number: 9653451
    Abstract: A semiconductor arrangement (10) with an electrostatic discharge (ESD) protection circuit is disclosed. The semiconductor arrangement (10) comprises a first semiconductor chip (20a) with a first integrated circuit (25a) and a second semiconductor chip (20b) with a second integrated circuit (25b). The semiconductor arrangement has an ESD protection circuit (30). The first semiconductor chip (20a) is isolated otherwise form the second semiconductor chip (20b) and the first integrated circuit (25a) is connected to the second integrated circuit (25b) exclusively via the ESD protection circuit (30).
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: May 16, 2017
    Assignee: TDK-MICRONAS GMBH
    Inventor: Lothar Schmidt