Patents Assigned to Technologies AG
  • Patent number: 11682644
    Abstract: A method for fabricating a semiconductor device with a heterogeneous solder joint includes: providing a semiconductor die; providing a coupled element; and soldering the semiconductor die to the coupled element with a first solder joint. The first solder joint includes: a solder material including a first metal composition; and a coating including a second metal composition, different from the first metal composition, the coating at least partially covering the solder material. The second metal composition has a greater stiffness and/or a higher melting point than the first metal composition.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Swee Kah Lee, Sook Woon Chan, Fong Mei Lum, Joachim Mahler, Muhammad Muhammat Sanusi
  • Patent number: 11683152
    Abstract: A method comprises generating a signed blockchain transaction using a secure computing device arranged in a local area, and an apparatus set up for short-range communication. The method comprises associating the signed blockchain transactions with the local area, wherein the signed blockchain transaction indicates a presence of the apparatus in the local area.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Andrea Hoeller, Walther Pachler
  • Patent number: 11682700
    Abstract: An power semiconductor device having a barrier region is provided. A power unit cell of the power semiconductor device has at least two trenches that may both extend into the barrier region. The at least two trenches may both have a respective trench electrode coupled to a control terminal of the power semiconductor device. For example, the trench electrodes are structured to reduce the total gate charge of the power semiconductor device. The barrier region may be p-doped and vertically confined, i.e., in and against the extension direction, by the drift region. The barrier region can be electrically floating.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Alexander Philippou, Roman Baburske, Christian Jaeger, Johannes Georg Laven, Helmut Maeckel
  • Patent number: 11681013
    Abstract: A radar system and a method for a radar system are described. In accordance with one exemplary embodiment, the method includes generating a local oscillator signal in a first radar chip, generating a frequency-divided signal from the local oscillator signal by means of a frequency divider arranged in the first radar chip, transmitting the frequency-divided signal to a second radar chip, and transmitting the local oscillator signal to the second radar chip. The local oscillator signal received in the second radar chip is fed to an output channel of the second radar chip, which generates an output signal on the basis thereof. The method further includes generating—on the basis of the output signal of the output channel and the frequency-divided signal received by the second radar chip—a signal indicating a phase angle of the output signal relative to the received frequency-divided signal.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Alexander Melzer, Clemens Pfeffer
  • Patent number: 11679461
    Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Alfons Dehe, Reinhard Gabl, Ulrich Krumbein
  • Patent number: 11681025
    Abstract: Techniques for simultaneous time-of-flight (ToF) measurement and information signal transmission. An information signal is superimposed on a series of light pulses by emitting the series of light pulses in groups of N regularly-spaced pulses and selectively varying time intervals between successive groups of pulses, such that the resulting varying time intervals between successive groups of emitted pulses are indicative of values of the information signal. Pixels configured to demodulate received light using a pulsed reference signal derived from the modulating signal are controlled to generate pixel signal values, each being indicative of a time-of-flight from the ToF measurement device to an object and back. This controlling comprises varying time intervals between successive groups of reference signal pulses in the same way time intervals between the emitted pulses are varied, so that the superimposition of the information signal has no effect on the ToF measurements.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Hannes Plank, Armin Schoenlieb
  • Patent number: 11681011
    Abstract: The description below relates to a method for a radar system that can be used to detect perturbations in the received radar signal. According to an example implementation, the method comprises providing a digital radar signal using a radar receiver, wherein the digital radar signal comprises a multiplicity of segments; calculating an envelope signal that represents the envelope of a segment of the digital radar signal; and ascertaining a time of the onset of an interference signal contained in the considered segment of the digital radar signal by using at least one statistical parameter of the envelope signal.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Paul Meissner, Mate Andras Toth
  • Patent number: 11679661
    Abstract: The present invention provides a power split hybrid power system and a hybrid vehicle. The hybrid power system comprises two planetary gear mechanisms sharing planetary carriers and ring gears, two motors and one engine. An output shaft of the engine is in transmission connection with a first sun gear shaft of a first sun gear, an input/output shaft of a first motor is in transmission connection with a second sun gear shaft of a second sun gear, and an input/output shaft of a second motor is in transmission connection with the ring gears. The output shaft of the engine, the input/output shaft of the first motor and the input/output shaft of the second motor can be relatively fixed to a housing of a transmission through a braking mechanism.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 20, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Zhenye Lu, Mingxi Guan
  • Patent number: 11679670
    Abstract: A two-gear bridge driving system. A speed changer of the two-gear bridge driving system includes a dual-planetary gear mechanism, the dual-planetary gear mechanism has only one sun gear, the sun gear is fixed with respect to a speed changer input gear, and the sun gear and one planetary gear in the dual gear are always in an engagement state. Compared with the two-gear bridge driving system in the prior art, the two-gear bridge driving system provided here is simpler in structure, lower in costs and lower in weight, and good NVH control is easily achieved. Also provided is a vehicle including the two-gear bridge driving system.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: June 20, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Lei Liu, Qingquan Li
  • Patent number: 11682611
    Abstract: A power semiconductor module includes a leadframe having a first die pad, a second die pad separated from the first die pad, a first power lead formed as an extension of the first die pad, a second power lead separated from the first and second die pads, and a first connection region formed as an extension of the second power lead alongside the second die pad. A first plurality of power semiconductor dies is attached to the first die pad and electrically coupled in parallel. A second plurality of power semiconductor dies is attached to the second die pad and electrically coupled in parallel. A first electrical connection extends between the first plurality of power semiconductor dies and the second die pad in a first direction. A second electrical connection extends between the second plurality of power semiconductor dies and the first connection region in the first direction.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: June 20, 2023
    Assignee: Infineon Technologies AG
    Inventors: Michael Niendorf, Ludwig Busch, Oliver Markus Kreiter, Christian Neugirg, Ivan Nikitin
  • Publication number: 20230184889
    Abstract: A radio frequency (RF) circuit includes a signal path coupled between two RF inputs and at least one baseband output terminal. The signal path includes a 90° hybrid coupler including a first port that receives a first RF signal and a second port that receives a second RF signal. The 90° hybrid coupler generates a first coupler output signal based on the first RF signal and the second RF signal and generates a second coupler output signal based on the first RF signal and the second RF signal. The signal path includes a quadrature down-converter configured to down-convert the first coupler output signal into a first baseband signal and down-convert the second coupler output signal into a second baseband signal. The RF circuit includes a baseband combiner circuit configured to combine the first baseband signal and the second baseband signal to generate at least one of output signal.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 15, 2023
    Applicant: Infineon Technologies AG
    Inventor: Vincenzo FIORE
  • Publication number: 20230184292
    Abstract: A method of providing electrical insulation for at least one portion of a bearing element is disclosed herein. The method includes electrostatically spraying a polymer coating to the at least one portion of the bearing element, and the polymer coating comprises a thermoset epoxy coating or a self-adhering nylon powder coating. The bearing element can be grounded during the electrostatic spraying. The method includes heating the polymer coating in an oven at a temperature less than or equal to 220° C. for a predetermined time, such that after removal from the oven, the polymer coating has a porosity of less than 10%. The coated bearing element has a resistance of at least 50 M? resistance under dry conditions and 10 M? resistance under wet conditions.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Mahdi Amiriyan, Mitchell Valaitis, Rashid Farahati
  • Patent number: 11674791
    Abstract: A magnetic angle sensor system includes a first magnetic sensor configured to generate a first sensor signal, a second magnetic sensor configured to generate a second sensor signal, and at least one signal processor configured to: generate an angle signal including an angular value corresponding to an orientation of a magnetic field based on the first sensor signal and the second sensor signal; generate a vector length signal comprising a plurality of vector lengths corresponding to the first sensor signal and the second sensor signal; and extract at least one spectral component of the vector length signal, the at least one spectral component being indicative of a vector length variance between at least two consecutively sampled vector lengths of the plurality of vector lengths.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: June 13, 2023
    Assignee: Infineon Technologies AG
    Inventor: Dirk Hammerschmidt
  • Patent number: 11675060
    Abstract: A receiver for a light detection and ranging system includes detecting elements, each configured to convert light into an analog detection signal. The receiver includes a first converting element configured to provide a first digital detection signal in response to a first analog detection signal. The first converting element is configured to use a first number of bits to represent the first analog detection signal. The receiver includes a second converting element configured to provide a second digital detection signal. The second converting element is configured to use a second number of bits to represent the second analog detection signal. The second number of bits is greater than the first number of bits. The receiver comprises a processing module configured to determine a first parameter of an object using the first digital detection signal and a second parameter of the object using the second digital detection signal.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: June 13, 2023
    Assignee: Infineon Technologies AG
    Inventors: Stefan Mendel, Franz Michael Darrer, Thomas Gigl, Michiel Helsloot, Boris Kirillov, Francesco Secli, Christoph Steiner
  • Patent number: 11677247
    Abstract: A method for regulating a decentralized energy generating system with a plurality of inverters (IN) is disclosed. The method includes receiving at the PPC a detected active power, reactive power and voltage amplitude at a grid connection point (PCC) of the energy generating system; and regulating, in a normal operating mode of the energy generating system, the reactive power and the active power to target values stipulated by a grid operator by virtue of the central control unit (PPC) dividing the stipulated target values into individual target stipulations for the plurality of inverters (IN) and communicating individual target stipulations to the inverters (IN). The method further includes selectively changing to a special operating mode of the energy generating system if particular criteria are present at the grid connection point (PCC) in a stipulated time interval.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: June 13, 2023
    Assignee: SMA Solar Technology AG
    Inventors: Daniel Premm, Cornelius Fuetterer, Oliver Glitza
  • Patent number: 11676879
    Abstract: A semiconductor package includes: a carrier having a first side and a second side opposite the first side, the first side having a plurality of contact structures; a semiconductor die having a first side and a second side opposite the first side, the first side of the semiconductor die having a plurality of pads attached to the plurality of contact structures at the first side of the carrier; a metal plate attached to the second side of the semiconductor die, the metal plate having a size that is independent of the size of the carrier and based on an expected thermal load to be presented by the semiconductor die; and an encapsulant confined by the carrier and the metal plate and laterally surrounding an edge of the semiconductor die. Corresponding methods of production are also provided.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: June 13, 2023
    Assignee: Infineon Technologies AG
    Inventors: Stefan Woetzel, Chee Yang Ng
  • Patent number: 11674550
    Abstract: A method of forming a bearing cage is generally disclosed herein. The method includes (i) forming a bearing cage from either titanium or a titanium alloy; and (ii) applying a plasma-nitriding treatment to at least one surface of the bearing cage to form a compound layer of titanium nitride including TiN and Ti2N on an outer region of the at least one surface. Step (ii) further forms a diffusion zone adjacent to the outer region, in one aspect. A surface hardness of the bearing cage that is treated by the plasma-nitriding step is at least 1000 HV. The bearing cage is configured to be used in a turbofan, turboprop, or turboshaft engine or in a helicopter gearbox, in one aspect.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: June 13, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Roland Plum, Peter Glöckner, Johannes Bedenk
  • Patent number: 11675061
    Abstract: Provided is a method for determining depth motion relative to a time-of-flight camera in a scene sensed by the time-of-flight camera. The method includes determining a first auxiliary depth image from a first set of phase images out of a sequence of phase images of the scene. The sequence of phase images is taken by the time-of-flight camera for a single time-of-flight depth measurement. A second auxiliary depth image is determined from a second set of phase images out of the sequence of phase images. The phase images of the second set of phase images are different from the phase images of the first set of phase images. Information about depth motion relative to the time-of-flight camera for at least part of the scene is determined based on a comparison of depth values represented by pixels in the first auxiliary depth image and the second auxiliary depth image.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 13, 2023
    Assignee: Infineon Technologies AG
    Inventor: Hannes Plank
  • Patent number: 11673732
    Abstract: A method for treating open cut edges of a packaging sleeve, blank or web material of a packaging material rolled up into a roll, in particular a composite cardboard/plastics material, by applying or introducing a disinfectant-containing treatment agent to or into the outer region of the cut edges. To provide a particularly resource-efficient composite packaging and a production method required for this purpose, it is proposed that at least some of the treatment agent is not applied directly to the cut edges, but that a load carrier is loaded, which load carrier absorbs the treatment agent so that an actively sterilising atmosphere which is created then acts on the open cut edges of the packaging sleeve, blank or web material and performs the desired sterilisation. The invention also relates to a packaging material, to a combipack produced therefrom and to a container for receiving the packaging material.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 13, 2023
    Assignee: SIG Technology AG
    Inventor: Hans-Willi Mainz
  • Patent number: 11676881
    Abstract: A semiconductor package is disclosed. In one example, the semiconductor package includes a chip carrier, a semiconductor chip attached to the chip carrier, an encapsulation body encapsulating the semiconductor chip, and a mounting hole configured to receive a screw for screw mounting a heatsink onto a first side of the semiconductor package. A second side of the semiconductor package opposite the first side is configured to be surface mounted to an application board.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: June 13, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Teck Sim Lee, Klaus Schiess, Xaver Schloegel, Lee Shuang Wang, Mohd Hasrul Zulkifli