Patents Assigned to Technologies AG
  • Publication number: 20230082969
    Abstract: A rolling bearing has an inner and an outer bearing ring. Each bearing ring has an inner and an outer shell surface. The roller bearing has rolling elements, which roll on raceways provided on the respective shell surfaces of the bearing rings, and a sealing disc connected to one of the bearing rings and operatively connected in a sealing manner to the other bearing ring. To connect the sealing disc to the bearing ring, one of the shell surfaces of the one bearing ring includes a first connecting means and the sealing disc includes a second connecting means. The first connecting means provide a rotating engagement in which the second connecting means engage in a connected state of the bearing ring and the sealing disc.
    Type: Application
    Filed: January 8, 2021
    Publication date: March 16, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Andreas Bierlein, Rainer Schroeder, Lukas Paehler, Simon Wolf
  • Publication number: 20230084446
    Abstract: A slave device is provided for a clutch system of a motor vehicle, in particular a clutch slave cylinder, in the form of a concentric slave cylinder. The slave device includes a housing element having, in its interior, a pressure chamber and an annular gap arranged on the outside of the housing element wherein the annular gap is in fluid communication with the pressure chamber. A clutch system for a vehicle includes the slave device, clutch apparatus for connecting an input side to an output side, a transmission housing on the output side, and seals of the slave device lying against the transmission housing in the radial direction for sealing the annular gap.
    Type: Application
    Filed: February 3, 2021
    Publication date: March 16, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Andreas Schiebenes, Manuel Bassler, Thomas Niesen
  • Publication number: 20230079618
    Abstract: A segment bearing device for supporting a first bearing partner relative to a second bearing partner about a pivot axis (S) includes a plurality of rolling elements, a segment cage for receiving the rolling elements, and a partial shell, the partial shell providing a race for the rolling elements. At least one of the plurality of rolling elements is arranged as a mounting rolling element in a first partial circle (TK1) in an operating state of the segment bearing device, and is held in a second partial circle (TK2) in a mounted state of the segment bearing device. The common center point of the partial circles (TK1, TK2) is defined by a center of curvature of the segment cage, and the first partial circle (TK1) has a smaller diameter than the second partial circle (TK2).
    Type: Application
    Filed: January 12, 2021
    Publication date: March 16, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Dieter Jauernig, Robert Dressel, Richard Frisch
  • Publication number: 20230079776
    Abstract: A first sensor signal and a second sensor signal are provided by a sensor unit to an evaluation unit. The first sensor signal is dependent on the angular position and is associated with a first detection position, and the second sensor signal is associated with a second detection position lying about the rotational axis perpendicular to the first detection position. An angular position of a rotational component is determined by the evaluation unit based on output from an atan2-function that takes the first and second sensor signals as input. A harmonic error is determined by the evaluation unit based on a periodic error signal that is superimposed on each of the sensor signals. An angular error of the angular position is determined by the evaluation unit based on the harmonic error. The angular position is updated by the evaluation unit based on the angular error.
    Type: Application
    Filed: January 12, 2021
    Publication date: March 16, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventor: Jie Zhou
  • Publication number: 20230080004
    Abstract: A method of manufacturing a module is disclosed. In one example, the method comprises providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion. At least one carrier, on which at least one electronic component is mounted, is placed in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 16, 2023
    Applicant: Infineon Technologies AG
    Inventors: Achim MUECKE, Arthur UNRAU
  • Patent number: 11605599
    Abstract: A semiconductor device includes a semiconductor die having a front side surface, a backside surface opposite the front side surface and side faces. A backside metallization layer is deposited over the backside surface and projects laterally outwards beyond the side faces. A side face protection layer covers the side faces.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: March 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Christian Gruber, Benjamin Bernard, Tobias Polster, Carsten von Koblinski
  • Patent number: 11603886
    Abstract: A guide carriage (1) of a linear guide includes a circulation channel (8) for rolling bodies (2), which is formed from a load section (3), two deflection sections (5) and a return section (4). A valve (16) arranged in a lubricant channel (10) to prevent the back flow of lubricant from the circulation channel (8) is arranged at a supply point (13) for supplying lubricating agent to one of the deflection sections (5), and the deflection section (5) is delimited by a deflection shell (9) located in an end piece (7). The valve (16) is formed integrally with at least one of the elements deflection shell (9) and end piece (7).
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: March 14, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Thomas Elicker, Martin Menges
  • Patent number: 11606013
    Abstract: An integration kit is disclosed herein that allows for mounting of a resolver trigger wheel relative to a bearing assembly, resolver, and rotor. The integration kit simplifies assembly and saves space. The integration kit includes a resolver integration sleeve that includes a first axial section including a radially inner surface defining a bearing support and radially inwardly extending flange defining an axial abutment surface. The resolver integration sleeve also includes a second axial section including at least one anti-rotation slot dimensioned to receive a portion of a trigger wheel, at least one anti-rotation tab extending axially towards the first axial section and dimensioned to be received by a rotor, at least one securing tab extending radially outward and configured to engage a trigger wheel, and a radially outwardly extending flange.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: March 14, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Guihui Zhong, Edward J. Wey, Marion Jack Ince, Charles Schwab, John Tate, Ryan Carlino
  • Patent number: 11604171
    Abstract: A fluid sensor includes a housing structure forming a cavity for an IR emitter for emitting an IR radiation in the cavity, wherein the IR radiation has a center wavelength for providing an interaction of the IR radiation with the target fluid resulting in a temperature change in the cavity or in the housing structure, which effects a mechanical pulse in the housing structure, and an inertial detection sensor mechanically coupled to the housing structure for sensing the mechanical pulse in the housing structure.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 14, 2023
    Assignee: Infineon Technologies AG
    Inventor: David Tumpold
  • Patent number: 11604259
    Abstract: A Light Detection and Ranging (LIDAR) receiver includes a receiver optics configured to receive at least one laser beam and direct the at least one laser beam along a receiver path; at least one silicon photomultiplier (SiPM) pixel including an array of single-photon avalanche diode (SPAD) pixels, the at least one SiPM pixel configured to generate at least one electrical signal based on the at least one laser beam; and a spatial filter arranged between the receiver optics and the at least one SiPM pixel, the spatial filter including an aperture located at a focal point of the receiver optics that is configured to permit a passage of the at least one laser beam therethrough and spread the at least one laser beam across the array of SPAD pixels in at least one direction.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: March 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Marcus Edward Hennecke, Boris Kirillov
  • Patent number: 11605572
    Abstract: An electronic component includes a mold layer and a semiconductor die including a low ohmic first portion and a high ohmic second portion. The low ohmic first portion has an active area. The high ohmic second portion is arranged on the mold layer.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: March 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Daniel Porwol, Thomas Fischer, Uwe Seidel, Anton Steltenpohl
  • Patent number: 11598441
    Abstract: A coolant control valve is provided that includes at least one actuator, a first rotary valve body and a second rotary valve body, each rotary valve body driveably connected to the at least one actuator. The second rotary valve body is arranged non-coaxially to the first rotary valve body.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: March 7, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Ashish Karve
  • Patent number: 11600902
    Abstract: A semiconductor device includes: a dielectric substrate; an integrated circuit (IC) die disposed inside an opening of the dielectric substrate, where the IC die is configured to transmit or receive radio frequency (RF) signals; a dielectric material in the opening of the dielectric substrate and around the IC die; a redistribution structure along a first side of the dielectric substrate, where a first conductive feature of the redistribution structure is electrically coupled to the IC die; a second conductive feature along a second side of the dielectric substrate opposing the first side; a via extending through the dielectric substrate, where the via electrically couples the first conductive feature and the second conductive feature; and an antenna at the second side of the dielectric substrate, where the second conductive feature is electrically or electromagnetically coupled to the antenna.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ashutosh Baheti, EungSan Cho, Saverio Trotta
  • Patent number: 11600701
    Abstract: A silicon carbide substrate has a trench extending from a main surface of the silicon carbide substrate into the silicon carbide substrate. The trench has a trench width at a trench bottom. A shielding region is formed in the silicon carbide substrate. The shielding region extends along the trench bottom. In at least one doping plane extending approximately parallel to the trench bottom, a dopant concentration in the shielding region over a lateral first width deviates by not more than 10% from a maximum value of the dopant concentration. The first width is less than the trench width and is at least 30% of the trench width.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Andreas Peter Meiser, Caspar Leendertz, Anton Mauder
  • Patent number: 11600558
    Abstract: A chip package is provided. The chip package includes a semiconductor chip having on a front side a first connecting pad and a second connecting pad, a carrier having a pad contact area and a recess, encapsulation material encapsulating the conductor chip, a first external connection that is free from or extends out of the encapsulation material, an electrically conductive clip, and a contact structure. The semiconductor chip is arranged with its front side facing the carrier with the first connecting pad over the recess and with the second connecting pad contacting the pad contact area. The clip is arranged over a back side of the semiconductor chip covering the semiconductor chip where it extends over the recess. The electrically conductive contact structure electrically conductively connects the first connecting pad with the first external connection.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic
  • Patent number: 11598626
    Abstract: An inductive angle sensor includes an inductive target arrangement with k-fold symmetry and a first pickup coil arrangement with k-fold symmetry and a second pickup coil arrangement with k-fold symmetry. A combination apparatus is designed to combine signals of the first pickup coil arrangement with signals of the second pickup coil arrangement and, on the basis thereof, to ascertain an angle-error-compensated rotation angle. The single pickup coils of the first and second pickup coil arrangements are each rotationally offset about the axis of rotation R by a geometric offset angle ? relative to one another. Additionally, the entire first pickup coil arrangement is rotationally offset relative to the entire second pickup coil arrangement about the axis of rotation R by a geometric offset angle ?.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventor: Udo Ausserlechner
  • Patent number: 11597243
    Abstract: A tire-pressure monitoring system (TPMS) sensor module comprises a pressure sensor, which is configured to measure an internal air pressure of a tire and to generate tire pressure information, an additional, optional sensor, a transmitting/receiving device, a microcontroller unit which is configured to operate the TPMS sensor module in one of three or more different operating modes, wherein a first operating mode includes an inactive standby state, a second operating mode includes a measurement of a physical parameter using the pressure sensor and/or the additional sensor and reading the pressure sensor and/or the additional sensor using the microcontroller unit, and a third operating mode, and wherein in the second operating mode the microcontroller unit is configured to initiate a changeover from the second operating mode to the third operating mode when reading out a specified measurement event.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Christoph Steiner, Michael Kandler, Matthias Eberl, Franz Michael Darrer
  • Patent number: 11598824
    Abstract: Methods and apparatuses are provided, in which a magnetic field is measured using a coil in a first operating mode and a magnetic field is generated using the coil in a second operating mode in order to test a further magnetic field sensor.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventor: Mario Motz
  • Patent number: 11600122
    Abstract: A method includes determining, by a first radio transceiver of an access-restricted environment, of first direction information of a first radio signal transmitted between the first radio transceiver and a wireless device. The method further includes determining, by a second radio transceiver of the access-restricted environment, of second direction information of a second radio signal transmitted between the second radio transceiver and the wireless device. The method further includes receiving, by the access-restricted environment, of angle information determined by an electronic key associated with the access-restricted environment. The method further includes determining, based on the first direction information, the second direction information and the angle information, whether the wireless device is a relay device or the electronic key. The method can be based, for example, on a Bluetooth technology.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Emanuele Bruno Bodini, Matthias Eberl
  • Patent number: 11600615
    Abstract: A method of forming a semiconductor device includes forming a first vertical protection device comprising a thyristor in a substrate, forming a first lateral trigger element for triggering the first vertical protection device in the substrate, and forming an electrical path in the substrate to electrically couple the first lateral trigger element with the first vertical protection device.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: March 7, 2023
    Assignee: Infineon Technologies AG
    Inventors: Vadim Valentinovic Vendt, Joost Adriaan Willemen, Andre Schmenn, Damian Sojka