Abstract: An RC IGBT with an n-barrier region in a transition section between a diode section and an IGBT section is presented.

Abstract: A centrifugal pendulum absorber, including: a first pendulum mass; a second pendulum mass; a center plate axially located between the first pendulum mass and the second pendulum mass, connected to the first pendulum mass and the second pendulum mass, and arranged to receive rotational torque; a first resilient bumper axially located between the first pendulum mass and the second pendulum mass, and connected to the first pendulum mass and the second pendulum mass; and a first radial travel stop connected to the first pendulum mass or to the second pendulum mass, located radially outward of the first resilient bumper, radially aligned with at least a portion of the first resilient bumper, and free of contact with the first resilient bumper when the centrifugal pendulum absorber is at rest.

Abstract: A hybrid module for a drive train of a motor vehicle includes a dual clutch which has a first sub-clutch and a second sub-clutch for selectively transmitting torque from a first drive unit to a drive shaft. The hybrid module further includes a disconnect clutch for coupling a second drive unit and for transmitting torque from the second drive unit to the drive shaft. At least one rotary feedthrough is provided which is configured on one hand for conveying actuating oil, which is designed for actuation of the disconnect clutch, or on the other hand for conveying cooling oil, which is designed for cooling the disconnect clutch and/or the dual clutch.

Abstract: A method ascertains a characteristic variable of a clutch installed into the powertrain of a vehicle for transmitting torque between a clutch input and a clutch output. A first electric motor is connected to the clutch input to introduce a first drive torque into the clutch. The torque is ascertained when the vehicle is at a standstill in that the clutch is first opened; the first electric motor is regulated at a first rotational speed; the clutch output is regulated at a second rotational speed; a counter torque which counteracts the transmission torque is applied to the clutch output; the clutch is then closed in order to assume a slipping state in which a specific differential rotational speed between the clutch input and the clutch output is present; the first drive torque is then ascertained; and the transmission torque is determined on the basis of the first drive torque.

Abstract: A method for ensuring emergency operation of an actuator of a motor vehicle in the event of failure of an electrical supply line for a control unit of the actuator includes supplying at least one driver for the actuator with electrical voltage by a capacitor. The capacitor may be charged from an energy store of the motor vehicle or kept in a charged state during normal operation. A logic module of the control unit may undergo a reset in order to trigger the emergency operation.

Abstract: A coupling arrangement for a hydraulic device, in particular for a brake hose of a hydraulic brake of a vehicle. The coupling arrangement includes first and second coupling components, and the first and second coupling components can be transferred from an uncoupled state into a coupled state. The first coupling component has a hydraulic chamber which is prefilled with a first hydraulic liquid, and the second coupling component has a hydraulic cylinder which is prefilled with a second hydraulic liquid. The hydraulic chamber and the hydraulic cylinder are fluidically connected to one another in the coupled, a first flow opening is incorporated in the hydraulic chamber, and the first coupling component has a first sealing device which closes the first flow opening in a flow-tight manner in the uncoupled state and frees it in the coupled state.

Abstract: A busbar assembly is disclosed that includes a carrier, and a plurality of conductors arranged within the carrier such that at least a portion of each of the plurality of conductors are exposed in a radial direction and define electrical contact sites.

Abstract: A method of manufacturing a semiconductor package is provided. The method may include singulating a wafer including a plurality of dies fixed to an auxiliary carrier to generate dies having released side surfaces, covering at least the side surfaces of the dies with a passivation layer using a deposition process at a temperature below the melting temperature of the auxiliary carrier, keeping a gap between the passivation layers at the side surfaces of adjacent dies of the plurality of dies.

Abstract: A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.

Abstract: A rotor (1) for an electrical machine, including a rotor laminated core (2) which has a plurality of axially layered rotor laminates (3) which are each arranged at a predetermined rotation angle in relation to an axially adjacent rotor laminate (3), and including a rotor shaft (4) on which the rotor laminates (3) are fitted. The rotor shaft (4) forms a torque-transmitting connection (5) with slots (6) which are formed in the rotor laminates (3), and the rotation angle and the width of the slots (6) are matched to one another such that a duct (10), which extends axially through the rotor (1), for fluid guidance is formed.

Abstract: A wheel module for a vehicle, in particular for an electric motorcycle or electric scooter, includes a wheel axle and a wheel. The wheel having a wheel rim and said wheel rim being rotatably mounted on the wheel axle; and including a brake device for the wheel. The brake device having a brake pad and a brake disc for co-operating with the brake pad, said brake disc being axially movable in order to brake the wheel.

Abstract: A pivot cradle bearing (1) having a pivoting element (2) which is mounted to pivot in a housing (3) is provided in which an inner bearing shell (7), on which rolling bodies (4) are rolling, is held on the pivoting element (2). The inner bearing shell (7) is held by rivets (10) in a form-fitting manner on the pivoting element (2) in the circumferential direction of the bearing shell (7).

Abstract: The disclosure discloses a control panel and an outdoor device with the control panel, which can discharge accumulated water in the control panel to prevent water accumulation. A control panel for preventing water accumulation includes a display sheet which is transparent or translucent and used for covering and protecting a circuit board and/or component, an interface label having functional areas allowing a user to observe or operate the circuit board and/or component, and an adhesive layer connected between areas of the display sheet and the interface label except for the functional areas so as to adhere the display sheet and the interface label together. Cavities are formed between the functional areas of the interface label and corresponding locations of the display sheet so as to form a display window and/or key windows. The water guiding grooves are provided in the adhesive layer for communicating the cavities with the outside so as to discharge the accumulated water.

Abstract: A sensor device comprises an electrically conductive chip carrier, wherein the chip carrier comprises an auxiliary structure, wherein the auxiliary structure comprises a first precalibration current terminal and a second precalibration current terminal, a magnetic field sensor chip arranged on a mounting surface of the chip carrier, wherein the magnetic field sensor chip comprises a sensor element, wherein the shape of the auxiliary structure is embodied such that an electrical precalibration current flowing from the first precalibration current terminal to the second precalibration current terminal through the auxiliary structure induces a predefined precalibration magnetic field at the location of the sensor element, wherein during measurement operation of the precalibrated sensor device, no precalibration current flows between the first precalibration current terminal and the second precalibration current terminal.

Abstract: A hybrid module includes a housing, an electric motor, a hydraulic coupling, a first clutch, a second clutch, and a flow plate assembly. The electric motor includes a stator fixed to the housing and a rotor rotatable relative to the housing. The hydraulic coupling is at least partially radially inside of the electric motor. The first clutch is for drivingly connecting the rotor to the engine. The second clutch is arranged in parallel with the hydraulic coupling for drivingly connecting the rotor to an input shaft of the planetary transmission. The flow plate assembly is fixed to the housing and includes a first flow plate and a second flow plate. The first flow plate has a radial groove forming a first portion of a radial flow channel. The second flow plate is fixed to the first flow plate and forms a second portion of the radial flow channel.

Abstract: In a method for producing a buried cavity in a semiconductor substrate, trenches are produced in a surface of a semiconductor substrate down to a depth that is greater than cross-sectional dimensions of the respective trench in a cross section perpendicular to the depth, wherein a protective layer is formed on sidewalls of the trenches. Isotropic etching through bottom regions of the trenches is carried out. After carrying out the isotropic etching, the enlarged trenches are closed by applying a semiconductor epitaxial layer to the surface of the semiconductor substrate.

Abstract: A power inverter includes a bridge circuit including a first half-bridge and a second half-bridge, each half-bridge including a high-side device and a low-side device, and a gate driver circuit connected with each gate of the high-side device and low-side power device of the first and second half-bridges and operable to provide each gate with a respective voltage to control operation of the respective power device. The gate driver is operable to provide a first voltage which is higher than a first threshold voltage of the respective power device, and a second voltage which is higher than a surge threshold of the respective power device. The surge threshold is higher than the first threshold and defines the onset of a surge current operation area of the respective power device at which the power device becomes conducts a surge current that is larger than the rated current of the device.

Abstract: A semiconductor flip-chip package includes a substrate having a first main face, a second main face opposite to the first main face, and one or more conductive structures disposed on the first main face, one or more pillars disposed on at least one of the conductive structures, a semiconductor die having one or more contact pads on a main face thereof, the semiconductor die being connected to the substrate so that at least one of the contact pads is connected with one of the pillars, and an encapsulant disposed on the substrate and the semiconductor die.

Abstract: A semiconductor device includes a conductive frame comprising a die attach surface that is substantially planar, a semiconductor die comprising a first load on a rear surface and a second terminal disposed on a main surface, a first conductive contact structure disposed on the die attach surface, and a second conductive contact structure on the main surface. The first conductive contact structure vertically extends past a plane of the main surface of the semiconductor die. The first conductive contact structure is electrically isolated from the main surface of the semiconductor die by an electrical isolation structure. An upper surface of the electrical isolation structure is below the main surface of the semiconductor die.

Abstract: A method for forming semiconductor devices includes attaching a glass structure to a wide band-gap semiconductor wafer having a plurality of semiconductor devices. The method further includes forming at least one pad structure electrically connected to at least one doping region of a semiconductor substrate of the wide band-gap semiconductor wafer, by forming electrically conductive material within at least one opening extending through the glass structure.