Patents Assigned to Technologies AG
  • Group III nitride device and method of fabricating an ohmic contact for a group III nitride-based device
    Patent number: 11302783
    Abstract: In an embodiment, a Group III nitride device includes a multilayer Group III nitride structure and a first ohmic contact arranged on and forming an ohmic contact to the multilayer Group III nitride device structure. The first ohmic contact includes a base portion having a conductive surface, the conductive surface including a peripheral portion and a central portion, the peripheral portion and the central portion being substantially coplanar and being of differing composition, a conductive via positioned on the central portion of the conductive surface and a contact pad positioned on the conductive via.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: April 12, 2022
    Assignee: Infineon Technologies AG
    Inventors: Albert Birner, Jan Ropohl
  • Method for operating a microcontroller and microcontroller by executing a process again when the process has not been executed successfully
    Patent number: 11301328
    Abstract: A method for operating a microcontroller, which includes a processor and a peripheral circuit on a common chip, the method including initiating a process in the peripheral circuit, in the peripheral circuit generating recovery data, executing the process, checking whether the process has been executed successfully and, in the event that the check reveals that the process has not been executed successfully, generating recovered data from the recovery data, and executing the process again.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: April 12, 2022
    Assignee: Infineon Technologies AG
    Inventors: Veit Kleeberger, Rafael Zalman
  • Handling exceptions in a program
    Patent number: 11301249
    Abstract: Handling an exception includes (i) executing a return from an exception; and (ii) executing a subsequent instruction with an additional functionality in case the additional functionality of the subsequent instruction can be triggered by a special instruction.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: April 12, 2022
    Assignee: Infineon Technologies AG
    Inventors: Albrecht Mayer, Neil Stuart Hastie, Pawel Jewstafjew
  • Composite wafer, semiconductor device and electronic component
    Patent number: 11302579
    Abstract: In an embodiment, a composite semiconductor substrate includes a first polymer layer and a plurality of semiconductor dies having a first surface, a second surface opposing the first surface, side faces extending between the first surface and the second surface and a first metallization structure on the first surface. Edge regions of the first surface and at least portions of the side faces are embedded in the first polymer layer. At least one metallic region of the first metallization structure is exposed from the first polymer layer. A second metallization structure is arranged on the second surface of the plurality of semiconductor dies. A second polymer layer is arranged on edge regions of the second surface of the plurality of semiconductor dies and on the first polymer layer in regions between the side faces of neighbouring ones of the plurality of semiconductor dies.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: April 12, 2022
    Assignee: Infineon Technologies AG
    Inventors: Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller, Martin Poelzl, Tobias Polster
  • Planetary gearing for a robot gearing arrangement
    Patent number: 11298817
    Abstract: A planetary gearing for a robot gearing arrangement includes a sun gear, a ring gear, and a planet carrier with at least three planetary gears rotatably mounted thereon. The planetary gears are arranged on planet pins arranged perpendicular to the planet carrier and are in meshing engagement with the sun gear and the ring gear. At least one first planetary gear is biased in a first circumferential direction and/or at least one second planetary gear is biased in a second circumferential direction. A first planet pin of the first planetary gear is at least partially elastically deformable in the second circumferential direction and/or the second planet pin of the second planetary gear is at least partially elastically deformable in the first circumferential direction.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 12, 2022
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Jochen Damerau
  • WHEEL HUB DRIVE FOR A VEHICLE
    Publication number: 20220106992
    Abstract: A wheel hub drive for a vehicle, having: a drive housing; a hub output mounted rotatably relative to the drive housing; a wheel brake for the hub output that has a stationary and a rotating braking partner, the stationary braking partner being connected to the drive housing for conjoint rotation therewith, and the rotating braking partner being connected to the hub output. The two braking partners are frictionally connected in a braking state, A parking brake for fixing the hub output relative to the drive housing. The stationary and rotating brake partners being movable relative to one another when the parking brake is actuated and being frictionally connected to one another in a parked state. The has a ramp mechanism for converting a rotary movement into a linear movement in order to transfer a parking force to the stationary and/or rotating brake partner.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 7, 2022
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Aurelien GRAUSS, Philippe WAGNER, Simon ORTMANN
  • INTERFERENCE DETECTION IN RADAR RECEIVER MONITORING SYSTEMS
    Publication number: 20220107385
    Abstract: A radio frequency (RF) circuit includes an input terminal configured to receive a reception signal from an antenna; an output terminal configured to output a digital output signal; a receive path including a mixer and an analog-to-digital converter (ADC), wherein the receive path is coupled to and between the input and output terminals, wherein the receive path includes an analog portion and a digital portion, and wherein the ADC generates a digital signal based on an analog signal received from the analog portion; a test signal generator configured to generate an analog test signal injected into the analog portion of the receive path; and a digital processor configured to receive a digital test signal from the digital portion, the digital test signal being derived from the analog test signal, analyze a frequency spectrum of the digital test signal, and determine a quality of the digital test signal.
    Type: Application
    Filed: October 2, 2020
    Publication date: April 7, 2022
    Applicant: Infineon Technologies AG
    Inventors: Alexander MELZER, Francesco LOMBARDO
  • SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL
    Publication number: 20220108949
    Abstract: One example of a semiconductor package includes a first die pad, a first die, a second die pad, and a second die. The first die pad includes a main portion and a U-shaped rail portion extending from the main portion. The first die is electrically coupled to the first die pad. The second die pad is proximate the U-shaped rail portion of the first die pad. The second die is electrically coupled to the second die pad. The second die includes a magnetic field sensor.
    Type: Application
    Filed: October 7, 2020
    Publication date: April 7, 2022
    Applicant: Infineon Technologies AG
    Inventors: Lee Shuang WANG, Thai Kee GAN, Teck Sim LEE
  • Wide band gap semiconductor device and method for forming a wide band gap semiconductor device
    Patent number: 11295951
    Abstract: A method for forming a wide band gap semiconductor device is provided. The method includes forming a gate insulation layer on a wide band gap semiconductor substrate and annealing the gate insulation layer using at least a first reactive gas species and a second reactive gas species, wherein the first reactive gas species differs from the second reactive gas species. The method can include forming a gate electrode on the gate insulation layer after annealing the gate insulation layer.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: April 5, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Aichinger, Gerald Rescher, Michael Stadtmueller
  • Predicated looping on multi-processors for single program multiple data (SPMD) programs
    Patent number: 11294690
    Abstract: Single Program, Multiple Data (SPMD) parallel processing of SPMD instructions can be generated among processors assigned to a task in a plurality of threads. The SPMD parallel processing can be increased in speed by performing predicated looping with the SPMD instructions in an activated SPMD mode of operation over a non-SPMD mode. Execution of overhead instructions is removed from the SPMD instructions associated with a thread in order to only execute the loop body of a loop associated with a data element of a data set in an enhanced Zero Loop Overhead (ZOL) device.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: April 5, 2022
    Assignee: Infineon Technologies AG
    Inventor: Prakash Balasubramanian
  • Formation of conductive connection tracks in package mold body using electroless plating
    Patent number: 11296000
    Abstract: An electronic circuit includes a first packaged semiconductor device having a first semiconductor die including a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound. A conductive track is formed in the outer surface of the first mold compound.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: April 5, 2022
    Assignee: Infineon Technologies AG
    Inventors: Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Khay Chwan Saw, Si Hao Vincent Yeo
  • Rolling element spring
    Patent number: 11293510
    Abstract: A spring configured to compress, expand, and provide a force is provided that includes a first ring, a second ring, a third ring, a first plurality of rolling elements arranged between the first and second rings, and a second plurality of rolling elements arranged between the first and third rings. When the spring is compressed, the first ring is configured to be elastically deformed in tension in a radially outwardly direction, and the second and third rings are configured to be elastically deformed in compression in a radially inwardly direction.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: April 5, 2022
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Luiz Siqueira Granja Junior, Rudoniel Cury, Marcelo Mariano Mariano Zavanella, Gustavo dos Santos Gioria
  • Panel having decorative layer and method for printing panels
    Patent number: 11292182
    Abstract: A printed image for the decor of a panel and a method for imprinting plates, in particular wall, ceiling or floor panels. The method includes the following steps: (i) providing a plate; (ii) applying a primer by means of a liquid curtain of coating material on/to a main surface of the plate; (iii) optionally drying and/or curing the primer; (iv) treating the surface of the primer by means of at least one of the following measures: a) corona treatment; b) plasma treatment; c) applying an oil in an aqueous dilution and (v) applying a decorative decor.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: April 5, 2022
    Assignee: Xylo Technologies AG
    Inventor: Dieter Döhring
  • Drive train unit for a hybrid vehicle, transmission unit and drive train
    Patent number: 11292331
    Abstract: A drive train unit for a hybrid vehicle includes an input shaft arranged for rotationally fixed attachment to an output of a transmission, an output shaft, an electric machine with a rotor, a clutch, and an actuating unit operatively connected to the clutch. The actuating unit has an actuator and an actuating bearing, displaceable by the actuator. The clutch may be a separating clutch operatively inserted between the rotor and the input shaft, or a friction clutch operatively inserted between the input shaft and the output shaft. The clutch may be a self-intensifying clutch with a leaf spring adjusted at a set angle relative to a reference plane oriented perpendicular to an axis of rotation such that, in a driving direction of a first clutch component, a first friction element is applied to a second friction element with an additional axial force.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: April 5, 2022
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Loyal George MacMillian, Götz Rathke
  • Clamping device
    Patent number: 11293530
    Abstract: A first clamping part and a second clamping part, which are movable relative to one another and to a base. A spring fixed between the first and second clamping parts. The spring applies force to the first and second clamping parts in a direction of the reciprocal movement thereof. A first locking part detachably locks the first and second clamping parts to each other when the spring is tensioned. A second locking part detachably locks the second clamping part to the base. The locking parts intermesh by forming a joint with limited motion.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: April 5, 2022
    Assignee: Schaeffler Technologies AG & CO. KG
    Inventor: Christof Faria
  • Die attach methods and semiconductor devices manufactured based on such methods
    Patent number: 11296015
    Abstract: A semiconductor device includes a carrier, a power semiconductor die that includes first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively, a die attach material arranged between the carrier and the first electrode, wherein the die attach material forms a fillet at the side surface of the power semiconductor die, wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die, wherein the height of the power semiconductor die is a length of the side surface, and wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: April 5, 2022
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Giovanni Ragasa Garbin, Chen Wen Lee, Benjamin Reichert, Peter Strobel
  • REDUDANT MAGNETIC FIELD SENSOR ARRANGEMENT FOR ERROR DETECTION AND METHOD FOR DETECTING ERRORS WHILE MEASURING AN EXTERNAL MAGNETIC FIELD USING REDUNDANT SENSING
    Publication number: 20220099761
    Abstract: The present disclosure relates to magnetic field sensor packages, including a sensor housing, a first sensor chip having an integrated first differential magnetic field sensor circuit, the first sensor chip being arranged in the sensor housing, and a second sensor chip having an integrated second differential magnetic field sensor circuit, the second sensor chip being arranged in the sensor housing.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 31, 2022
    Applicant: Infineon Technologies AG
    Inventors: Dirk HAMMERSCHMIDT, Helmut KOECK, Andrea MONTERASTELLI, Tobias WERTH
  • PACKAGE WITH PAD HAVING OPEN NOTCH
    Publication number: 20220102299
    Abstract: A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Applicant: Infineon Technologies AG
    Inventor: Adrian LIS
  • METHOD FOR ACTIVELY DAMPENING A START-UP RESONANCE OF A TORSIONAL DAMPER WHEN STARTING AN INTERNAL COMBUSTION ENGINE
    Publication number: 20220099061
    Abstract: A method actively dampens a start-up resonance of a torsional damper when starting an internal combustion engine. The torsional damper (4) is fixed between an internal combustion engine (1) and a secondary side (5) of a torsional elasticity, and the internal combustion engine (1) is started using a starter generator (3) arranged on a side of the internal combustion engine (1) counter to the torsional elasticity. A counter excitation is applied to a torque generated by the starter generator (3) when the internal combustion engine (1) is started, which counter excitation is modulated on the basis of a parameter of the internal combustion engine (1) which changes when the internal combustion engine (1) is being started.
    Type: Application
    Filed: December 10, 2019
    Publication date: March 31, 2022
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Thorsten Krause, Kai Schenck, Bertrand Pennec
  • Methods of assembly for wedge clutch with wedge chain
    Patent number: 11285527
    Abstract: A method of assembling a clutch includes assembling a wedge chain by connecting a plurality of wedges together with links such that the wedges are movable relative to each other, and wrapping the wedge chain around an inner race. The method further includes connecting an end one of the links to an end one of the wedges to secure the chain to the inner race. The may also include installing the inner race into an outer race such that the wedge chain is radially disposed between the inner and outer races.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: March 29, 2022
    Assignee: Schaeffler Technologies AG & CO. KG
    Inventors: Brian Lee, Carsten Ohr