Patents Assigned to Technologies AG
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Patent number: 11320032Abstract: A torque converter comprises a cover arranged to receive torque, an impeller including an impeller shell fixed to the cover, and a turbine fluidly coupled to the impeller. A lock-up clutch is provided that includes a dam plate non-rotatably connected to the cover, and a piston plate disposed, at least partially, between the cover and the dam plate. A fluid diversion plate is disposed between the dam plate and the turbine, wherein the dam plate is connected to the piston plate on a first axial side and connected to the fluid diversion plate on a second axial side, opposite the first axial side.Type: GrantFiled: March 8, 2021Date of Patent: May 3, 2022Assignee: Schaeffler Technologies AG & Co. KGInventors: Kyle Nelson, Victor Norwich
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Patent number: 11322400Abstract: A method of manufacturing a semiconductor wafer having a roughened metallization layer surface is described. The method includes immersing the semiconductor wafer in an electrolytic bath. Gas bubbles are generated in the electrolytic bath. A surface of a metallization layer on the semiconductor wafer is electrochemically roughened in the presence of the gas bubbles by applying a reversing voltage between the metallization layer and an electrode of the electrolytic bath.Type: GrantFiled: June 19, 2020Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Carsten von Koblinski, Tobias Polster
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Patent number: 11320398Abstract: In some examples, a circuit arrangement has a first output node for connection to a first electrode of the electrochemical cell, a second output node for connection to a second electrode of the electrochemical cell and a third output node for connection to a third electrode of the electrochemical cell. The circuit arrangement further has an interface circuit designed to output a first voltage at the first output node and further designed to output a third voltage at the third output node, which third voltage is set such that a second voltage at the second output node corresponds to a reference voltage. A control unit is designed to set the first voltage such that a predetermined cell voltage is applied between the first and the second output node. The control circuit is further designed to adjust the reference voltage depending on the electrical state of the electrochemical cell.Type: GrantFiled: June 17, 2019Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Christoph Steffan, Inge Siegl
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Patent number: 11324087Abstract: A method for driving a set of light emitting diodes (LEDs) may include receiving a write access frame by a driver via a bus configured for connection with a controller and the driver. The write access frame includes brightness information. The method may further include controlling, by the driver, the set of LEDs based on the brightness information and determining, by the driver, safety information while controlling the set of LEDs based on the brightness information. The method may further include outputting, by the driver and at the bus, the safety information to acknowledge receipt of the write access frame.Type: GrantFiled: December 23, 2020Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Hans-Peter Kreuter, Christof Michenthaler, Franco Mignoli, Salvatore Sanna, Alfonso Nasciuti, Andrea Scenini
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Patent number: 11320030Abstract: A two-speed transmission alternately establishes two speed ratios between a primary drive pulley and one or more accessories pulleys of an accessory drive system. The two-speed transmission includes concentric input and output shafts fixed to input and output pulleys respectively. When an actuator is disengaged, a one-way clutch transfers power between the input shaft and the output shaft. The input shaft is fixed to the planet carrier of a planetary gear set and the output shaft is fixed to the sun gear of the planetary gear set. When the actuator is engaged, the ring gear of the planetary gear set is held establishing an overdrive speed relationship between the input pulley and the output pulley.Type: GrantFiled: November 10, 2020Date of Patent: May 3, 2022Assignee: Schaeffler Technologies AG & Co. KGInventor: Nicholas Hrusch
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Patent number: 11318985Abstract: A steering actuator comprising a shaft having an input coaxial with an output, wherein the output is in drivable communication with one or more wheels of a vehicle, and a locking mechanism configured to enable the shaft to rotate in both a first direction and a second direction in response to torque provided at the input, and prevent the shaft from rotating in both the first direction and the second direction in response to torque provided at the output.Type: GrantFiled: October 24, 2018Date of Patent: May 3, 2022Assignee: Schaeffler Technologies AG & CO. KGInventors: Shaun Tate, Mark Brown
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Patent number: 11322451Abstract: A power semiconductor module includes a power semiconductor die attached to the first metallized side, a passive component attached to the first metallized side, a first isolation layer encapsulating the power semiconductor die and the passive component, a first structured metallization layer on the first isolation layer, and a first plurality of electrically conductive vias extending through the first isolation layer from the first structured metallization layer to the power semiconductor die and the passive component.Type: GrantFiled: January 16, 2019Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg
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Patent number: 11318688Abstract: A method for joining at least two joining partners includes performing a plurality of ultrasonic joining operations in direct succession, wherein performing an individual ultrasonic joining operation includes, with a second joining tool, applying pressure to a second joining partner arranged adjacent to a first joining partner, thereby pressing the second joining partner against the first joining partner, and, with the second joining tool, applying high-frequency ultrasonic vibrations to the joining partners. The method further includes, during at least one intermediate time interval between two directly successive ultrasonic joining operations, at least one of actively cooling and heating the second joining tool.Type: GrantFiled: February 27, 2020Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Georg Troska, Olga Simon
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Patent number: 11322461Abstract: A package is disclosed. In one example the package comprises a carrier having a plurality of leads and an electronic component mounted on the carrier and comprising at least one pad. An impedance structure electrically couples the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped.Type: GrantFiled: August 13, 2020Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Eduardo Schittler Neves, Dan Horia Popescu
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Patent number: 11318836Abstract: An electrical bridge driving system for a vehicle includes: an electric motor; a transmission shaft connected for co-rotation with the electric motor; a first gear provided on the transmission shaft; a second gear engaged with the first gear; a planetary gear apparatus, wherein the second gear is connected for co-rotation to an input end of the planetary gear apparatus; and a differential mechanism, wherein an output end of the planetary gear apparatus is connected for co-rotation to an input end of the differential mechanism. The second gear, the planetary gear apparatus, and the differential mechanism are coaxial. The electrical bridge driving system can have a larger transmission ratio in a compact space.Type: GrantFiled: May 7, 2018Date of Patent: May 3, 2022Assignee: Schaeffler Technologies AG & Co. KGInventors: Lei Liu, Qingquan Zhai
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Patent number: 11321442Abstract: The present disclosure relates to authenticity and data security for bus-based communication networks in a vehicle. The present disclosure teaches a protocol frame, a sender on data link layer, and a receiver on data link layer providing such authenticity and data security as well as a communication network in a vehicle employing the protocol frame, the sender and the receiver according to the present disclosure.Type: GrantFiled: March 20, 2020Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Alexander Zeh, Harald Zweck
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Publication number: 20220128587Abstract: A sensor device includes at least one first sensor element that generates a first sensor signal based on sensing a varying magnetic field; at least one second sensor element that generates a second sensor signal based on sensing the varying magnetic field; a signal tracking circuit that generates a trigger signal having trigger pulses that are generated based on crossings of the first sensor signal with an adaptive threshold and extracts vibration relevant information using the first sensor signal and the second sensor signal; an output controller that generates an output signal having output pulses that are triggered by the trigger pulses during a non-vibration event and suppress the output pulses during an entire duration of a vibration event; and a vibration detection circuit that detects the vibration event based on the extracted vibration relevant information and indicates the vibration event to the output controller.Type: ApplicationFiled: October 27, 2020Publication date: April 28, 2022Applicant: Infineon Technologies AGInventors: Johannes GUETTINGER, Peter Alfred FRIESSNEGGER, Simon HAINZ
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Publication number: 20220128131Abstract: A damper device for a wrap-around means of a wrap-around transmission includes a carrier body formed from a composite reinforced plastic and comprising a surface, a sliding surface forming a first part of the surface, and a bearing surface for a pivoting means, the bearing surface forming a second part of the surface. The sliding surface or the bearing surface may be formed from a separate layer free of composite reinforcing means. The separate layer may be produced as a step of a multi component injection molding method with the carrier body being produced in a common injection mold in another step, as a coating on the carrier body, or as a separate component mechanically connected to the carrier body.Type: ApplicationFiled: November 18, 2019Publication date: April 28, 2022Applicant: Schaeffler Technologies AG & Co. KGInventors: Nicolas Schehrer, Stephan Penner
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Publication number: 20220129025Abstract: The present disclosure describes a device for determining information regarding a connection of a circuit component that is connected to an output of a regulator in order to reduce fluctuations of an output signal at the output of the regulator. The device includes a processing unit that is configured to generate a statistical value that is a measure of fluctuations of the measurement signals, and thus of the output signal at the output of the regulator, based on a plurality of measurement signals, each of which has information regarding the output signal of the regulator and is recorded while a load component generates an electrical load at the output of the regulator. The processing unit is configured to compare the statistical value with a limit value and to determine the information regarding the connection of the circuit component based on the result of the comparison.Type: ApplicationFiled: October 19, 2021Publication date: April 28, 2022Applicant: Infineon Technologies AGInventors: Ronny Andreas SCHOMACKER, Markus HUEMER, Christoph SCHERTZ
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Publication number: 20220127463Abstract: A package and method of manufacturing a package is disclosed. In one example, a package for encapsulating an electronic component includes a first cured mold compound, wherein the first cured mold compound includes a resin and filler particles embedded in the resin. The filler particles include a second cured mold compound. The first cured mold compound is based on a first curing act and the second cured mold compound is based on a second curing act different from the first curing act.Type: ApplicationFiled: October 15, 2021Publication date: April 28, 2022Applicant: Infineon Technologies AGInventors: Andreas WATERLOO, Stefan SCHWAB
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Publication number: 20220131296Abstract: Power module has press-fit pins for the electrical and mechanical connection for the terminals, insertable into sleeves on the substrate. The substrate rests on a baseplate. Potential alignment frame ensures the accuracy of all elements. The mechanical and electrical connection of the power and signal terminals is realized by multiple (high-current) or single press-fit connections. When inserting the pins, they are fitting tightly in these sleeves by overcoming a frictional force and after fitting is established, for each single pin-fit, an electrical contact over a surface is established.Type: ApplicationFiled: October 22, 2021Publication date: April 28, 2022Applicant: SwissSEM Technologies AGInventors: Sven MATTHIAS, Raffael M. SCHNELL, Chantal I.T. TOKER
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Publication number: 20220128122Abstract: A plate link chain for a motor vehicle drive having a continuously variable transmission includes a pressure piece with a first bearing face and a second bearing face, and a plate with a third bearing face and a fourth bearing face. The first bearing face and the third bearing face bear against one another to form a force transmitting outer contact region relative to a rotation direction of the plate link chain, and the outer contact region forms an outer contact face that is linear or flat and encloses an angle ? that is ?160° and ?180°. The second bearing face and the fourth bearing face bear against one another to form a force transmitting inner contact region relative to the rotation direction, and the inner contact region forms an inner contact face enclosing an angle that is ?90° and ?135°.Type: ApplicationFiled: February 6, 2020Publication date: April 28, 2022Applicant: Schaeffler Technologies AG & Co. KGInventor: Manuel Falk
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Patent number: 11313444Abstract: A threaded nut of a ball-screw for a brake booster is constructed as a hydraulic piston and is produced from the group of martensitically hardening steels which are non-corroding with respect to brake fluid and which has in percent by weight: between 0.4% and 1.3% carbon (C), up to 2% silicon (Si), up to 2% manganese (Mn), between 12% and 20% chromium (Cr), and phosphorus (P) and sulphur (S) together at less than 0.015%, the balance being iron and, where applicable, melting-related impurities. Addition of the following materials to the above-described steel may be advantageous: up to 2% molybdenum (Mo), up to 0.2% vanadium (V), and up to 3% nickel (Ni).Type: GrantFiled: July 23, 2018Date of Patent: April 26, 2022Assignee: Schaeffler Technologies AG & Co. KGInventors: Sigurd Wilhelm, Dieter Adler, Ernst Strian
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Patent number: 11316292Abstract: A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.Type: GrantFiled: November 4, 2019Date of Patent: April 26, 2022Assignee: Infineon Technologies AGInventors: Tomas Manuel Reiter, Mark Nils Muenzer, Marco Stallmeister
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Patent number: D950377Type: GrantFiled: May 31, 2019Date of Patent: May 3, 2022Assignee: SIG Technology AGInventors: Norman Gierow, Matthias Krusche