Patents Assigned to Technologies AG
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Patent number: 11879801Abstract: A controller for an environmental sensor provides digital environmental measurement values from analog environmental measurements performed by analog circuitry, the digital environmental measurement values lying in a global scale range. The controller subjects the global scale range to a subdivision into scale subranges that are proper subranges of the global scale range. The controller selects, among the scale subranges, one scale subrange in which an analog environmental measurement is to be performed, selects an offset information and a gain information that are associated with the selected scale subrange and that are indicative of an offset and a gain to be applied by the analog circuitry to perform an analog environmental measurement in the selected scale subrange, and to provide the offset information and the gain information to the analog circuitry.Type: GrantFiled: April 21, 2022Date of Patent: January 23, 2024Assignee: Infineon Technologies AGInventors: Andreas Wiesbauer, Alessandro Caspani, Christian Jenkner, Athanasios Kollias
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Publication number: 20240016613Abstract: The invention relates to a medical implant (100) extending along a plane (P) perpendicular to a first axis (A1), wherein the medical implant (100) comprises a felt material (F) comprising a plurality of fibers (101), wherein a density of said fibers (101) varies along said plane (P), and/or a percentage of said fibers (101) aligned in a circumferential direction (C) in respect of said first axis (A1) differs along said plane (P), a method for manufacturing the medical implant (100) by felting and a method for customizing the medical implant (100). Furthermore, the invention relates to s medical product (300) comprising the medical implant (100) and a transparent packaging (310) comprising printed markings (320), and to a felting instrument (200) comprising a felting needle (210) comprising at least one barb (211).Type: ApplicationFiled: November 12, 2021Publication date: January 18, 2024Applicant: ZURIMED TECHNOLOGIES AGInventors: Elias BACHMANN, Xiang Li, Danilo MENGHINI
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Publication number: 20240019019Abstract: The disclosure relates to a belt pulley decoupler for a motor vehicle drive train that includes a hub constituent part configured for attachment to a crankshaft of an internal combustion engine, a flexible drive element pulley supported in a spring-damped manner relative to the hub constituent part, and a vibration absorber. The vibration absorber includes a mounting plate that extends from a fastening region, which is supported on the hub constituent part and connected to the hub constituent part in a positively locking and/or non-positive manner, radially outwards to a collar region which receives at least one mass element, has a plate portion which is supported axially on a flange element of the hub constituent part and which is held relative to the hub constituent part via an axially running dome portion formed either by the mounting plate or the flange element.Type: ApplicationFiled: July 15, 2021Publication date: January 18, 2024Applicant: Schaeffler Technologies AG & Co. KGInventors: Roman Weisenborn, Pascal Strasser, Andreas Stuffer
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Publication number: 20240022149Abstract: An electrical machine arrangement including an electrical axial flux machine having a stator and having a rotor, a component supporting the stator, and a rotor shaft which is in contact with the rotor so as to rotate therewith. The rotor is arranged inside the electrical machine arrangement in a manner rotatably mounted by means of at least one bearing point. The stator has at least one stator half which is axially spaced apart from the rotor by an air gap. At least one spacer element is provided for axially orienting at least two of the assemblies: first stator half, second stator half (and rotor relative to one another.Type: ApplicationFiled: October 26, 2021Publication date: January 18, 2024Applicant: Schaeffler Technologies AG & Co. KGInventors: Dirk Reimnitz, Ivo Agner
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Publication number: 20240021512Abstract: A die package and method is disclosed. In one example, the die package includes a die having a first die contact on a first side and a second die contact on a second side opposite the first side, and insulating material laterally adjacent to the die. A metal structure substantially directly contacts the surface of the second die contact, wherein the metal structure is made of the same material as the second die contact. A first pad contact on the first side of the die electrically contacts the first die contact, and a second pad contact on the first side of the die electrically contacts the second die contact via the metal structure. The insulating material electrically insulates the metal structure from the first die contact.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Applicant: Infineon Technologies AGInventor: Petteri PALM
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Publication number: 20240018929Abstract: A generator module for a vehicle includes a housing with a first conical surface, a rotor assembly with a second conical surface, aligned with the first conical surface, and a spring arranged to push the second conical surface into contact with the first conical surface. In an example embodiment, the first conical surface or the second conical surface includes a plastic surface or a friction paper surface. In an example embodiment, the rotor assembly is axially displaceable within the housing to compress the spring and move the second conical surface away from the first conical surface.Type: ApplicationFiled: July 14, 2022Publication date: January 18, 2024Applicant: Schaeffler Technologies AG & Co. KGInventors: John Ramsey, Matthew Payne, Michael Condo, Aaron Mueller
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Patent number: 11874298Abstract: A sensor device includes a magnetic field sensor component, including a chip carrier having a connection conductor and a magnetic field sensor chip arranged on the chip carrier, and a magnet, wherein the magnetic field sensor component is arranged on a mounting surface of the magnet, wherein the mounting surface has an elevation and the connection conductor is bent around the elevation.Type: GrantFiled: March 9, 2021Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Gernot Binder, Ferdinand Gastinger, Stephanie Jankowski, Thomas Lassleben
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Patent number: 11874563Abstract: The present invention relates to novel photoaligning polymer materials, to their use as orienting layer for liquid crystals, which are used for the production of non-structured and structured optical elements, electro-optical elements, multi-layer systems or in nanoelectronics.Type: GrantFiled: August 8, 2018Date of Patent: January 16, 2024Assignee: ROLIC TECHNOLOGIES AGInventors: Cedric Klein, Fabien Xavier Delbaere, Richard Frantz
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Patent number: 11876028Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.Type: GrantFiled: October 15, 2021Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang
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Patent number: 11876324Abstract: An electrical connector system includes a first connector body defining a locking fin, a second connector body configured to receive the first connector body, and a flexible locking arm defined by the second connector body configured to releasably engage the locking fin. A plunger is slidably attached to the second connector body and is moveable from an engaged position in which the plunger holds the locking arm in engagement with the locking fin to a disengaged position in which the plunger disengages the locking arm from the locking fin. A spring is disposed between the plunger and the second connector body and is configured to urge the plunger into the engaged position.Type: GrantFiled: January 31, 2022Date of Patent: January 16, 2024Assignee: Aptiv Technologies AGInventors: Rachel O'Neill, Shawna Higgins, Marcia Lytle, Prasanna Ramakrishnan, Rangarajan Sundarakrishnamachari
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Patent number: 11874325Abstract: One exemplary embodiment describes an integrated circuit, comprising a multiplicity of scan flip-flops, a multiplicity of ring oscillator circuits, wherein each ring oscillator circuit comprises a chain of logic gates comprising a plurality of logic gates connected in succession, an input multiplexer for the chain, and a feedback line from an output connection of the last logic gate of the chain to a data input connection of the input multiplexer. Each ring oscillator circuit is assigned a scan flip-flop group that contains at least one of the multiplicity of scan flip-flops.Type: GrantFiled: September 14, 2022Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Tobias Kilian, Martin Huch, Heiko Ahrens, Daniel Tille
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Patent number: 11876509Abstract: A method of driving a transistor between switching states includes controlling a transition of a gate voltage at a gate terminal of a transistor during each of a plurality of turn-off switching events to turn off the transistor, wherein the transistor is configured to be turned off according to a desaturation time during each of the plurality of turn-off switching events; measuring a transistor parameter indicative of a voltage slew rate of the transistor for a first turn-off switching event during which the transistor is transitioned from an on state to an off state; and regulating a duration of the desaturation time for a next turn-off switching event based on the measured transistor parameter.Type: GrantFiled: July 28, 2022Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Guang Zeng, Franz-Josef Niedernostheide, Mark-Matthias Bakran, Zheming Li
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Patent number: 11873870Abstract: A method for controlling a friction clutch actuated by an actuation system using an actuation pressure ambiguously applied along an actuation path includes providing the friction clutch and the actuation system, detecting a time curve of an actuation processes of the friction clutch, and comparing the time curve with the actuation pressure to ascertain an unambiguous friction clutch actuation path. The method may also include using the time curve to determine whether the friction clutch is in an opening state or a closing state and whether the actuation pressure is applied to an opened friction clutch actuation path or a closed friction clutch actuation path, and starting from a set actuation pressure, carrying out a directional control of the friction clutch by specifying the actuation pressure.Type: GrantFiled: August 26, 2020Date of Patent: January 16, 2024Assignee: Schaeffler Technologies AG & Co. KGInventors: Carsten Mayer, Marco Grethei, Yunfan Wei
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Patent number: 11876133Abstract: A silicon carbide device includes a transistor cell with a source region and a gate electrode. The source region is formed in a silicon carbide body and has a first conductivity type. A first low-resistive ohmic path electrically connects the source region and a doped region of a second conductivity type. The doped region and a floating well of the first conductivity type form a pn junction. A first clamp region having the second conductivity type extends into the floating well. A second low-resistive ohmic path electrically connects the first clamp region and the gate electrode.Type: GrantFiled: September 29, 2021Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Joachim Weyers, Franz Hirler, Wolfgang Jantscher, David Kammerlander, Ralf Siemieniec
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Patent number: 11874303Abstract: A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptacle in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptacle and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptacle. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.Type: GrantFiled: July 6, 2021Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Tomas Manuel Reiter, Christoph Koch, Dietmar Spitzer
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Patent number: 11874403Abstract: Techniques for obtaining reflectance measurements using a time-of-flight (ToF) measurement device. An example method comprises obtaining a distance measurement, using one or more pixels in a ToF sensor, obtaining an intensity measurement corresponding to the distance measurement, using the one or more pixels, and calculating a reflectance value, based on the distance measurement, the intensity measurement, and a reflectance calibration factor. In some embodiments, the calibration distance is obtained by measuring a reference distance to a calibration surface, using a reference pixel in the ToF sensor, and obtaining the calibration distance from the measured reference distance.Type: GrantFiled: May 17, 2019Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventor: Hannes Plank
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Patent number: 11874191Abstract: An elastic transmission element is part of a strain wave gear. Such strain wave gears are also referred to as Harmonic Drives. The elastic transmission element is also referred to as a flexspline and has an outer toothing (03). The elastic transmission element is equipped with at least one strain gauge (04) for measuring a mechanical strain on the elastic transmission element. The one strain gauge (04) or the plurality of strain gauges (04) extends at least as a whole about a circumference of a lateral surface or an axial lateral face of the elastic transmission element.Type: GrantFiled: September 24, 2019Date of Patent: January 16, 2024Assignee: Schaeffler Technologies AG & Co. KGInventors: Jens Heim, Jochen Damerau, Masato Izumi
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Patent number: 11876007Abstract: A method is provided for producing a hermetically sealed housing having a semiconductor component. The method comprises introducing a housing having a housing body and a housing cover into a process chamber. The housing cover closes off a cavity of the housing body and is attached in a gas-tight manner to the housing body. At least one opening is formed in the housing. At least one semiconductor component is arranged in the cavity. The method furthermore comprises generating a vacuum in the cavity by evacuating the process chamber, and also generating a predetermined gas atmosphere in the cavity and the process chamber. The method moreover comprises applying sealing material to the at least one opening while the predetermined gas atmosphere prevails in the process chamber.Type: GrantFiled: February 18, 2022Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Rainer Markus Schaller, Horst Theuss
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Patent number: 11874682Abstract: A circuit includes: a first load circuit and a second load circuit coupled in parallel between a first node and a reference voltage node, where the first load circuit and the second load circuit are configured to receive a first input signal and a second input signal, respectively; a first pass device and a first switch coupled in series between a voltage supply node and the first node; a second pass device and a second switch coupled in series between the voltage supply node and the first node; and an amplifier, where a first input terminal and a second input terminal of the amplifier are configured to be coupled to a reference input voltage and the first node, respectively, where an output terminal of the amplifier is coupled to a first control terminal of the first pass device and a second control terminal of the second pass device.Type: GrantFiled: December 6, 2022Date of Patent: January 16, 2024Assignee: INFINEON TECHNOLOGIES AGInventors: Andrea Tollot, Thomas Santa, Andrea Bandiziol
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Patent number: 11872853Abstract: A tire pressure monitoring system (TPMS) includes a communication interface device configured to communicate with a target TPMS sensor module. The communication interface device include a radio frequency (RF) transceiver configured to generate at least one wake-up signal; an antenna array configured to transmit each wake-up signal as a directional RF beam; a processing circuit configured to monitor for a response signal in response to the antenna array transmitting the at least one wake-up signal; and a power amplifier configured to set a power of each wake-up signal according to an adjustable power setting such that the power of each subsequent wake-up signal is increased in discrete steps until the response signal is received by the RF transceiver.Type: GrantFiled: June 1, 2021Date of Patent: January 16, 2024Assignee: Infineon Technologies AGInventors: Michael Kandler, Thomas Engl, Tuncay Erdoel, Maximilian Werner, Maciej Wojnowski