Abstract: A rotor bearing of a wind turbine, in particular a rotor bearing having an improved and simplified axial introduction of force into the inner ring. It is specified for this purpose that the inner ring of the rolling bearing has a greater axial length with respect to the axial length of the outer ring of the rolling bearing by a section of the inner ring that corresponds to the axial length of the outer ring and has the length being adjoined by additional sections, wherein the axial lengths of these sections differ in size.

Abstract: A bandgap reference circuit includes a bandgap reference core circuit that includes a first bipolar transistor having a first emitter current density and a first base-emitter voltage, a second bipolar transistor having a second emitter current density that is smaller than the first emitter current density and having a second base-emitter voltage, a resistor that is connected to the emitter of the second bipolar transistor, and a differential amplifier circuit that is configured to control first and second emitter currents through the first and second bipolar transistors, respectively, such that a sum of the second base-emitter voltage and a voltage drop across the resistor approximates the first base-emitter voltage. The bandgap reference circuit further includes a first replica bipolar transistor that emulates an operating point of the first bipolar transistor and a second replica bipolar transistor that emulates an operating point of the second bipolar transistor.

Abstract: A package is disclosed. In one example, the package comprises a carrier, a semiconductor chip having a first connection area at which the semiconductor chip is mounted at a first vertical level on or above the carrier, and a connection body. The semiconductor chip is bent to thereby be connected at a second connection area of the semiconductor chip at a second vertical level, being different from the first vertical level, with the connection body.

Abstract: A device is suggested for processing input data including a hardware accelerator generating a first hash value based on a first portion of the input data and a second hash value based on a second portion of the input data, wherein the first hash value is generated based on a first configuration of the hardware accelerator and wherein the second hash value is generated based on a second configuration of the hardware accelerator. Also, a method for operating such device is provided.

Abstract: An actuating assembly includes a body; a plunger axially movable with respect to the body; a linear actuator configured for being activated to axially move the plunger in a first direction into engagement with the body such that the plunger and body are rotationally fixed with respect to each other; a barrel movable with respect to the body for contacting the plunger and the body depending on an axial position of the plunger; and a spring for biasing the barrel toward the plunger. The barrel is configured such that the spring forces the barrel into circumferential engagement with the body in two different axial positions of the barrel with respect to the body when the linear actuator is inactive depending on a rotational orientation of the barrel.

Abstract: A power semiconductor module arrangement includes: a substrate arranged within a housing; at least one semiconductor body arranged on a top surface of the substrate; and a first layer arranged on a first surface within the housing. The first layer includes inorganic filler which is impermeable to corrosive gases and a casting material which fills spaces present in the inorganic filler.

Abstract: A damper apparatus for a belt element of a belt transmission includes a sliding surface, a bearing receptacle, a first rail half and a second rail half. The sliding surface is arranged to contact a strand of the belt element to dampen the belt element. The bearing receptacle is arranged to align the sliding surface with the strand such that the sliding surface defines a strand travel direction, normal to a transversal direction. The first rail half has a first plunge opening with a first hook lid, and the second rail half has a second plunge opening with a second hook lid. The first rail half and the second rail half are interlockingly connected in contact to each other crosswise to the strand travel direction, and the first hook lid is arranged to plunge into the second plunge opening behind the second hook lid in a gripping manner.

Abstract: An electrically operable drive train of a motor vehicle, including an electric motor and a transmission arrangement, in which drive train the electric motor and the transmission arrangement form a structural unit, and the structural unit includes a first housing part and a second housing part, the first housing part and/or the second housing part having fastening means which bring about predefined positioning of the first housing part relative to the second housing part, and the first housing part is formed from a metal material, the second housing part being shaped from a plastics material by means of primary shaping processes, in particular by means of an injection moulding process, and having at least one insert part which is surrounded by plastics material in such a way that it is arranged in the second housing part such that it transmits axial and/or radial force and/or torque.

Abstract: A connection ring terminal. The connection ring terminal is used for connecting to a lead-out end of a connection ring of a motor; and the connection ring terminal comprises a main body and a connection part located at one end of the main body, wherein the connection part is used for surrounding the lead-out end at least in the circumferential direction of the lead-out end, such that the connection ring terminal can be positioned relative to the lead-out end in the radial and circumferential directions of the connection ring. A connection ring and a motor is also provided.

Abstract: A microphone includes a MEMS device having an output node for generating an analog voltage in response to an input sound wave or vibration; a source follower having a control node coupled to the output node of the MEMS device, a current path coupled between a first controlled node and a second controlled node, and a bulk node, wherein the first controlled node is configured for providing a microphone output voltage, and wherein the second controlled node is coupled to a reference voltage; a current source coupled to the first controlled node; and a voltage differential between the first controlled node and the bulk node, wherein a nonzero value of the voltage differential is configured such that a first 1% total harmonic distortion (THD) cross-point of the microphone output voltage is greater than a second 1% THD cross-point of the microphone output voltage using a zero value voltage differential.

Abstract: An electronic device with a multi-layer contact and a system is disclosed. In an embodiment, a semiconductor device includes a semiconductor substrate having a first electrode terminal located on a first surface and a second surface electrode terminal located on a second surface, the first surface being opposite to the second surface, an electrical contact layer disposed directly on the first electrode terminal, a functional layer directly disposed on the electrical contact layer, an adhesion layer directly disposed on the functional layer, a solder layer directly disposed on the adhesion layer; and a protection layer directly disposed on the solder layer, wherein the semiconductor device is a power semiconductor device configured to provide a vertical current flow.

Abstract: A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality of first wire bonds to the first bond pad of the semiconductor die through a plurality of openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die. Additional methods and related semiconductor packages produced from such methods are also described.

Abstract: According to an embodiment, a current monitoring circuit includes a signal shaping unit configured to receive a current sense signal and provide a modified current signal; a filter configured to receive the modified current signal and to provide a respective filtered signal; a comparator configured to receive the filtered signal and a threshold value and to indicate when the filtered signal exceeds the threshold value. The signal shaping unit is configured to calculate a level of the modified current signal from a corresponding level of the current sense signal in accordance with non-linear function.

Abstract: Represented and described is a resealable pouring element for cardboard/plastic composite packages, in particular beverage packages, with a base element having a circumferential fastening flange as well as an external thread, with opening means arranged at least in the unopened state of the pouring element in the interior of the base element and with a screw cap with internal thread, wherein the opening means are designed such that when the composite package is initially opened by unscrewing the screw cap by breaking the composite material of the package or a barrier layer located in the base element, a pour opening is created inside the pouring element and wherein at least one tamper-evident seal is arranged between the base element and the screw cap.

Abstract: A semiconductor device includes a contact metallization layer that includes aluminum and is arranged on a semiconductor substrate, an inorganic passivation structure arranged on the semiconductor substrate, an organic passivation layer comprising a first part that is arranged on the contact metallization layer, and a second part that is arranged on the inorganic passivation structure, a first layer structure including a first part that is in contact with the contact metallization layer, a second part that is contact with the inorganic passivation structure, and a third part that is disposed on the semiconductor substrate laterally between the inorganic passivation structure and the organic passivation layer.

Abstract: A power connector is provided that is configured to conduct a current. The power connector includes a base structure, an extension structure, and a connector head structure that define a current path for the current. The base structure is coupled to an output node of a primary conductor and receives the current from the primary conductor. The connector head structure is configured to output the current from the power connector to the load. The extension structure is coupled to and extends between the base structure and the connector head structure. The extension structure includes a current constriction region configured to increase a magnetic flux density of a magnetic field produced by the current flowing through the current constriction region at a position of a magnetic current sensor that generates a sensor signal based on the magnetic field magnetic field produced by the current flowing through the current constriction region.

Abstract: A circuit is provided, comprising a transformer having a first coil that is arranged on a substrate and a second coil that is arranged on the substrate above the first coil, and a dielectric between the first coil and the second coil. The circuit furthermore comprises a guard ring around the transformer. The circuit furthermore comprises a diagnostic circuit (55) that is configured so as to ground the guard ring in a normal operating mode and to measure a measurement voltage or a measurement current at a measurement impedance between the guard ring and the ground potential in a diagnostic operating mode.

Abstract: A method for trimming an antenna applied on a carrier, the method including pressing a region of the carrier out from a carrier plane of the carrier, the region having a portion of the antenna and the region being selected according to a target property of the antenna, and removing at least a part of the portion of the antenna from the pressed-out region of the carrier.

Abstract: A method is provided for driving a half bridge circuit that includes a first transistor and a second transistor. The method includes generating an off-current during a plurality of turn-off switching events to control a gate voltage of the second transistor; measuring a transistor parameter of the second transistor during a first turn-off switching event during which the second transistor is transitioned to an off state, wherein the transistor parameter is indicative of an oscillation at the first transistor during a corresponding turn-on switching event during which the first transistor is transitioned to an on state; and activating a portion of the off-current for the second turn-off switching event, including regulating an interval length of the second portion for the second turn-off switching event based on the measured transistor parameter measured during the first turn-off switching event.

Abstract: A sensor device is provided. The sensor device includes an image sensor having a plurality of photo-sensitive pixels configured to measure light received from a scene. The image sensor is configured to output image data indicative of measurement values of at least part of the plurality of photo-sensitive pixels. Additionally, the sensor device includes processing circuitry configured to determine a histogram based on the image data. The histogram represents a distribution of the measurement values. The processing circuitry is further configured to determine whether an object is present in the scene based on the histogram. In addition, the sensor device includes interface circuitry configured to output presence data indicating whether the object is present in the scene.