Abstract: A system may include a first processing component arranged in a secure domain of the system. The system may include a second processing component arranged outside of the secure domain of the system. The system may include one or more hardware accelerators to perform operations in association with providing communication security for the system. The one or more hardware accelerators may be accessible by the first processing component via a channel in the secure domain. The one or more hardware accelerators may be accessible by at least the second processing component via a channel outside of the secure domain.

Abstract: An oscillator system includes a oscillator structure configured to oscillate about an axis; a driver configured to generate a driving signal to drive an oscillation of the oscillator structure about the axis with an oscillation phase and an oscillation frequency, wherein the driver includes a phase detector configured to generate a phase error signal representative of a phase error between a measured oscillation of the oscillator structure about the axis and an expected oscillation having the oscillation phase; and a phase controller configured to receive the phase error signal and generate an actuation value based on the phase error signal, wherein the phase controller is configured to adjust the actuation value based on the phase error signal to adjust an actuation phase of the oscillator structure about the axis to minimize the phase error. The driver is configured to generate the driving signal based on the actuation value.

Abstract: A pressure sensor module includes a pressure sensor configured to periodically measure an internal air pressure within an enclosure and generate a sensor signal having plurality of sensor values; a signal processing chain for conditioning the sensor signal to generate a plurality of conditioned sensor values; a memory configured to store each of the plurality of conditioned sensor values; and a processing circuit coupled to the pressure sensor via the signal processing chain for receiving a current conditioned sensor value and coupled to the memory for receiving a previous conditioned sensor value. The processing circuit is configured monitor for a fault, including calculating a delta pressure value between the current and previous conditioned sensor values, comparing the delta pressure value to a pressure threshold value, and triggering a diagnostic of the signal processing chain if the delta pressure value is greater than the pressure threshold value.

Abstract: A built-in magnetic filter module for filtering the working fluids of clutch separation systems, said built-in magnetic filter module comprising an air release valve and a magnetic filtration unit including a housing. The housing includes a pipe section providing passage for the working fluid. The magnetic filtration unit is installed on the circumference of the internal wall of said pipe section, and is configured to contact the working fluid and attract metallic foreign matter from within the working fluid.

Abstract: An apparatus for testing semiconductor devices is disclosed. In one example, the apparatus includes a rolling contactor comprising a first cylindrical rotatable holder, a plurality of test pin sets, each one of the test pin sets being connected to the cylindrical rotatable holder. Each one of the test pin sets comprises a plurality of test pins, and a substrate configured to support a plurality of semiconductor devices. The semiconductor devices comprising one or more contact elements on a main surface thereof remote from the substrate, wherein the first cylindrical rotatable holder and the substrate are arranged relative to each other so that due to a rotating movement of the first cylindrical rotatable holder the test pins of the test pin sets are successively contacted with the contact elements of the semiconductor devices.

Abstract: The disclosure relates to an inductive linear displacement sensor that includes a primary coil and two secondary coils inductively coupled to the primary coil. The linear displacement sensor has a calibration coil inductively coupled to the primary coil. The calibration coil is arranged such that a signal produced by the calibration coil has only one zero crossing at the center of the linear displacement sensor.

Abstract: A valve includes a valve housing and a piston. The housing has an end face with a first opening, a second opening with a closing edge, and a valve seat. The piston has a first surface pointing towards the end face, a first lateral surface, a control edge, and a second lateral surface. In a first switching mode, the first surface covers the first opening, the piston seals with the valve seat, the second opening is closed by the second lateral surface, and the control edge is between the closing edge and the valve seat. In a second switching mode, the second opening is closed by the second lateral surface and the control edge is between the closing edge and the valve seat. In the third switching mode, a section of the second opening is released to form a flow chamber permeably connecting the first opening and the second opening.

Abstract: A hydrodynamic torque converter and a torsional vibration damper for same, having a pump wheel connected on the drive side and a turbine wheel driven thereby, wherein a torsional vibration damper and an output part are provided between a housing of the hydrodynamic torque converter and an output hub. The torsional vibration damper having an input part that can be connected to the housing by a converter lock-up clutch, and said output part being connected to the output hub, wherein an intermediate flange arranged in each case counter to a spring device effective in the circumferential direction is provided between the input part and the output part. In order to protect the spring devices against damage in a manner not affecting the installation space, an angle of rotation of the intermediate flange counter to the effect of the spring devices is limited radially inside the spring devices.

Abstract: In some implementations, a sensing device associated with less than a 360 degree measurement range may obtain a set of signal values. The sensing device may be configured to sense a magnetic field present at the sensing device and collect sensor data based on the magnetic field. The set of signal values may be included in the sensor data collected by the sensing device and may correspond to one or more components of the magnetic field present at the sensing device. The sensing device may determine, based on the set of signal values, a set of calibration points and a set of angular positions. The sensing device may calculate a set of calibration parameters based on the set of calibration points and the set of angular positions. The sensing device may utilize the set of calibration parameters to perform one or more safety checks.

Abstract: A data processing device may include a processor, configured to combine a first data word and a second data word of a plurality of secret data words by storing, for each of the first data word and the second data word, for an Exclusive-Or sharing of the data word into multiple partial representatives, for at least one of the partial representatives, a transformed version of the partial representative in a processor register, and, if the combination of the data words requires a partial representative of the first data word to be combined with a partial representative of the second data word that is stored in a processor register after having been transformed, combining the partial representative of the first data word with the partial representative of the second data word with a processor operation that takes into consideration that the partial representative of the second data word has been transformed.

Abstract: Metal sheets are connected in that a hole is introduced into metal sheets of a first stack, and a region of metal sheets of a second stack are deformed in a stack direction. The deformed region can be plastically deformed in such a way that there is interlocking of the deformed region with at least one metal sheet lying below same. In embodiments, the hole has a shape with a reduced width at the center.

Abstract: A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.

Abstract: A wireless multimode system includes: an array of N antenna elements that includes a first portion of M antenna elements and a second portion of L antenna elements; M transmission amplifiers configured to transmit, via the M antenna elements, frames of transmit data, where the frames of transmit data include transmit radar signals and transmit communication signals; M reception amplifiers configured to receive, via the M antenna elements, frames of receive data, where the frames of receive data includes receive communication signals; and L reception amplifiers configured to receive, via the L antenna elements, receive radar signals; and a resource scheduler configured to allocate bandwidth for transmit radar signals and transmit communication signals within the frames of transmit data based on one or more predetermined parameters.

Abstract: A circuit board includes: an electrically insulating part and an electrically conductive part; at least one semiconductor chip embedded into the electrically insulating part in a part of the circuit board; and a cooling area above and below the at least one semiconductor chip. The electrically conductive part includes a first outer conductive layer on the first surface, a second outer conductive layer on the second surface, and a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the cooling area, or is electrically connected to the first outer conductive layer outside the cooling area.

Abstract: Sensor device, control system and method of communication between a sensor device and a control system. Sensor devices, control systems and methods for communication between sensor devices and control systems are provided. In these, sensor data are transmitted via first interfaces and redundant sensor data and/or other data are transmitted via second interfaces.

Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

Abstract: In an embodiment, a method includes: transmitting a plurality of radar signals using a millimeter-wave radar sensor towards a target; receiving a plurality of reflected radar signals that correspond to the plurality of transmitted radar signals using the millimeter-wave radar; mixing a replica of the plurality of transmitted radar signals with the plurality of received reflected radar signals to generate an intermediate frequency signal; generating raw digital data based on the intermediate frequency signal using an analog-to-digital converter; processing the raw digital data using a constrained L dimensional convolutional layer of a neural network to generate intermediate digital data, where L is a positive integer greater than or equal to 2, and where the neural network includes a plurality of additional layers; and processing the intermediate digital data using the plurality of additional layers to generate information about the target.

Abstract: An ESD protection device includes a semiconductor body having an upper surface, a plurality of p-type wells that each extend from the upper surface into the semiconductor body, a plurality of n-type wells that each extend from the upper surface into the semiconductor body, first isolation regions comprising an electrical insulator that laterally surrounds the p-type wells and extends from the upper surface into the semiconductor body at least as deep as the p-type wells, and second isolation regions comprising an electrical insulator that laterally surrounds the n-type wells and extends from the upper surface into the semiconductor body at least as deep as the n-type wells, wherein the p-type wells and the n-type wells alternate with one another a first direction, and wherein an isolating area of the first isolation regions is greater than an isolating area of the second isolation regions.

Abstract: Transistor devices are provided. In some example implementations, a magnetic field sensor chip is fitted on a load electrode of a transistor chip. In other example implementations, two magnetic field sensors are arranged on a load electrode of a transistor chip in such a way that they measure different effective magnetic fields in the event of current flow through the transistor chip.

Abstract: A semiconductor device and method is disclosed. In one embodiment, the semiconductor device comprises a semiconductor die comprising a first surface and a second surface opposite to the first surface, a first metallization layer disposed on the first surface of the semiconductor die, a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb, and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body, wherein the first contact member is connected with the Ni-based layer to the first solder layer.