Patents Assigned to Technologies AG
  • Dual-sided radar systems and methods of formation thereof
    Patent number: 11733347
    Abstract: A method of forming a radar system includes forming a first receive antenna and a first ground plane region by patterning a first conductive layer on a first surface of a first laminate layer of a radar package, forming a transmit antenna and a second ground plane region by patterning a second conductive layer on a second surface of the first laminate layer, forming a second laminate layer of the radar package over the second conductive layer, forming a third conductive layer over the second laminate layer, forming a second receive antenna by patterning the third conductive layer, and attaching a radio frequency integrated circuit chip to the radar package. The radio frequency integrated circuit chip is coupled to the transmit antenna, the first receive antenna, and the second receive antenna. The second surface is opposite the first surface.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: August 22, 2023
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Reinhard-Wolfgang Jungmaier, Adrian Mikolajczak, Ashutosh Baheti
  • Angle based speed sensor device
    Patent number: 11733260
    Abstract: A sensor device is provided with a magnetic field sensitive element being positioned in a magnetic field of a magnet. The magnetic field sensitive element is configured to sense an orientation angle of the magnetic field in the range between 0° and 360° and generate a sensing signal. The electronic circuitry is configured to receive and process the sensing signal from the magnetic field sensitive element to generate an angle signal indicating the orientation angle of the magnetic field and an angular speed of the shaft.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: August 22, 2023
    Assignee: Infineon Technologies AG
    Inventors: Helmut Koeck, Leo Aichriedler, Dirk Hammerschmidt, Andrea Monterastelli, Friedrich Rasbornig, Peter Slama, Dietmar Spitzer, Tobias Werth, Harald Witschnig
  • Voltage regulator
    Patent number: 11733725
    Abstract: In accordance with one embodiment, a voltage regulator includes a transistor having a load current path connecting an input node with an output node, wherein the input node is configured to receive an input voltage and the output node is configured to provide an output voltage. The voltage regulator further includes a main control loop coupled between the output node and a control electrode of the transistor and configured to control a voltage applied to the control electrode so that the output voltage matches a set-point. Furthermore, the voltage regulator includes a supplemental control loop that is coupled between the output node and the control electrode of the transistor and configured to detect a transient in the output voltage and to adjust the voltage applied to the control electrode in response to the detection of a transient. A corresponding method is described.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: August 22, 2023
    Assignee: Infineon Technologies AG
    Inventors: Cristian-Valentin Raducan, Alina-Teodora Cirlescu, Marius-Georghe Neag
  • ANTI-RATTLE FEATURE FOR CLUTCH PLATE
    Publication number: 20230258235
    Abstract: A drive assembly including a primary inertia plate and clutch plate is disclosed herein. The primary inertia plate is configured to be rotationally driven via a crankshaft. The clutch plate includes a body with a rotational axis (X). The clutch plate is configured to be rotationally driven by the primary inertia plate. The clutch plate includes at least one imbalance feature such that a center of gravity of the clutch plate is positioned away from the rotational axis (X). The imbalance feature generates a centrifugal force that counteracts or prevents rattling from being imparted to the clutch plate via engine vibrations through the primary inertia plate.
    Type: Application
    Filed: February 14, 2022
    Publication date: August 17, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventor: Nicholas Wurst
  • RADIAL FOIL BEARING FOR SUPPORTING A SHAFT
    Publication number: 20230258227
    Abstract: A radial foil bearing for supporting a shaft includes a sleeve-like bearing housing with an inner circumference and at least three foil packs distributed over the inner circumference and covering a portion of the inner circumference. Each of the at least three foil packs has an elastic corrugated foil resting against the inner circumference and a top foil. The elastic corrugated foil includes axially opposite side edges running in a circumferential direction and a narrowed portion disposed on at least one of the axially opposite side edges to reduce an axial width and a radial spring rigidity of the elastic corrugated foil at the narrowed portion. The top foil has an underside resting on the elastic corrugated foil and a top side forming a bearing surface for the shaft.
    Type: Application
    Filed: June 9, 2021
    Publication date: August 17, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Bernhard Jakob, Michael Plogmann, Wolfgang Braun, Hermann Geyer, Christoph Neufeld, Viktor Pfarherr
  • BALL SCREW DRIVE AND METHOD FOR OPERATING A BALL SCREW DRIVE
    Publication number: 20230258249
    Abstract: A ball screw drivel, in particular for a parking brake, comprises a threaded spindle, a spindle nut, and rolling bodies, namely balls, which are arranged in a thread turn between the threaded spindle and the spindle nut, Spring elements are arranged in the thread turn between nut-side stops. There is at least one setting of the threaded spindle and the spindle nut in which the balls and the spring elements are arranged in the thread turn with backlash.
    Type: Application
    Filed: June 8, 2021
    Publication date: August 17, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Nicky Heinrich, Sedat Oezdemir, Robert Drechsler
  • OVERLOAD CLUTCH FOR E-MOTOR ROTOR
    Publication number: 20230261533
    Abstract: A hybrid drive assembly having an e-motor with a housing fixed stator and a rotor that connects to a transmission. The e-motor rotor includes a rotor support having a mounting flange with a stop at one end. A diaphragm spring clamps a second rotor ring, a rotor stack, and a first rotor ring against the stop to rotationally fix the rotor stack to the mounting flange. A drive plate assembly for connection to a crankshaft includes an output flange that is: (a) frictionally engaged to the diaphragm spring and/or the second rotor ring such that upon application of a torque spike the output flange rotates relative to the diaphragm spring and/or the second rotor ring, or (b) rotationally fixed to the diaphragm spring such that upon application of a torque spike the diaphragm spring rotates relative to the mounting flange, forming in each case an overload clutch.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 17, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventor: Eric UBELHART
  • Method for manufacturing an electronic component
    Patent number: 11728073
    Abstract: A method for manufacturing an electronic component includes providing a substrate and a functional layer supported by the substrate; forming a structured protection layer on a side of the substrate to which the functional layer is attached, wherein the structured protection layer has a recess so that a portion of the functional layer is exposed; applying a dispersion comprising a solvent and electrically conductive components to the exposed portion of the functional layer so that the recess is at least partially filled with the dispersion; drying the dispersion in order to create an electrically conductive layer; and removing the structured protection layer.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Markus Meyer, Jorge Eduardo Adatti Estevez, Alexandra Marina Roth
  • Semiconductor device including first gate electrode and second gate electrode
    Patent number: 11728417
    Abstract: A semiconductor device includes a drift region of a first conductivity type in a semiconductor body having a first main surface, and a body region of a second conductivity type between the drift region and the first main surface. Trenches extend into the semiconductor body from the first main surface and pattern the semiconductor body into mesas including a first mesa between first and second trenches, and a second mesa between second and third trenches. An electrode in the first trench is one electrode out of an electrode group of an electrode electrically coupled to a first gate driver output, an electrode electrically coupled to a second gate driver output, and an electrode electrically connected to a first load contact. An electrode in the second trench is another electrode out the electrode group, and an electrode in the third trench is a remaining electrode out of the electrode group.
    Type: Grant
    Filed: August 14, 2021
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventor: Roman Baburske
  • Robust high speed sensor interface for remote sensors
    Patent number: 11728916
    Abstract: Systems, methods, and apparatuses are discussed that enable robust, high-speed communication of sensor data. One example system includes a sensor bus, an electronic control unit (ECU), and one or more sensors. The ECU is coupleable to the sensor bus and configured to generate a synchronization signal, and is configured to output the synchronization signal to the sensor bus. The one or more sensors are also coupleable to the sensor bus, and at least one sensor of the one or more sensors is configured to sample sensor data in response to the synchronization signal and to output the sampled sensor data to the sensor bus.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventor: Leo Aichriedler
  • Analog-digital converter apparatus, sensor system and method for analog-digital conversion
    Patent number: 11728823
    Abstract: Apparatuses and methods for analog-digital conversion and corresponding systems having a sensor and an apparatus of this type are provided. Demodulation is executed with no variable preamplification, followed by continuous-time analog-digital conversion, at least in time segments, which further employs chopper techniques.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Mario Motz, Florian Brugger, Carlos Humberto Garcia Rojas, Tobias Werth
  • Dual fingerprint sensor credentialing
    Patent number: 11727097
    Abstract: A credential authorization device having a first fingerprint sensor, configured to detect first sensor data representing one or more elements of a finger from a first person in contact with the first fingerprint sensor; a second fingerprint sensor, configured to detect second sensor data representing one or more elements of a finger from a second person in contact with the second fingerprint sensor; and one or more processors, configured to determine an authorization for a transaction based on an authentication of the first sensor data and the second sensor data.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventor: Valentin Stoia
  • Mesa contact for a power semiconductor device and method of producing a power semiconductor device
    Patent number: 11728420
    Abstract: A power semiconductor device includes: a semiconductor body with a drift region; a plurality of trenches, wherein two adjacent trenches laterally confine a mesa of the semiconductor body. Each trench extends along a vertical direction and includes a trench electrode, and has a trench width along a first lateral direction and a trench length along a second lateral direction perpendicular to the first lateral direction, the trench length amounting to at least five times the trench width. The device further includes: a semiconductor body region of a second conductivity type in the mesa; a source region in the mesa; an insulation layer above and/or on the source region; a contact plug that extends at least from an upper surface of the insulation layer along the vertical direction so as to contact both the source region and the semiconductor body region.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Anton Mauder, Hans-Juergen Thees
  • Torque converter damper assembly
    Patent number: 11725717
    Abstract: A torque converter includes a front cover arranged to receive a torque. The torque converter further includes a lock-up clutch engaged with the front cover and including a clutch plate. The torque converter further includes a damper assembly engageable with the lock-up clutch. The damper assembly includes a cover plate defining a spring retainer extending about an axis. The damper assembly further includes a spring disposed in the spring retainer. The damper assembly further includes a spring support plate fixed to the cover plate. The spring support plate includes inner tabs and outer tabs disposed radially outside of the inner tabs. The outer tabs are configured to radially constrain the spring in the spring retainer. The inner tabs are configured to position the clutch plate relative to the axis.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: August 15, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Alberto Jared Sanchez
  • Clip having locking recess for connecting an electronic component with a carrier in a package
    Patent number: 11728309
    Abstract: A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Melvin Levardo, Ryan Ross Agbay Alinea, Markus Dinkel
  • Group III nitride device having an ohmic contact
    Patent number: 11728389
    Abstract: In an embodiment, a Group III nitride device includes a multilayer Group III nitride structure and a first ohmic contact arranged on and forming an ohmic contact to the multilayer Group III nitride device structure. The first ohmic contact includes a base portion having a conductive surface, the conductive surface including a peripheral portion and a central portion, the peripheral portion and the central portion being substantially coplanar and being of differing composition, a conductive via positioned on the central portion of the conductive surface and a contact pad positioned on the conductive via.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Albert Birner, Jan Ropohl
  • Disconnect clutch assembly shaft with cap
    Patent number: 11725701
    Abstract: A clutch assembly includes a shaft, a seal plate supported by the shaft, and a cap connect to the shaft. The shaft includes a first end and a second end axially spaced from each other. The cap is disposed at the second end. The cap includes a base covering the second end, and a wall extending from the base towards the first end. The wall is configured to axially constrain the seal plate.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: August 15, 2023
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Edward Goodwill
  • Sensor devices having soft magnets and associated production methods
    Patent number: 11726148
    Abstract: A sensor device includes a current conductor designed to carry a measurement current, and a magnetic field sensor chip having a sensor element, wherein the magnetic field sensor chip is designed to detect a magnetic field at the location of the sensor element. The sensor device furthermore includes an encapsulation material, wherein the magnetic field sensor chip is encapsulated by the encapsulation material, and a soft magnet secured to the encapsulation material and designed to concentrate the magnetic field at the location of the sensor element. The magnetic field sensor chip and the soft magnet are galvanically isolated from one another by the encapsulation material.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Volker Strutz
  • RF switch with switching time acceleration
    Patent number: 11728800
    Abstract: A radio frequency (RF) switch includes a switchable RF path including a plurality of transistors coupled in series; a gate bias network including a plurality of resistors, wherein the gate bias network is coupled to each of the plurality of transistors in the switchable RF path; and a bypass network including a first plurality of transistors coupled in parallel to each of the plurality of transistors in the switchable RF path and a second plurality of transistors coupled in parallel to each of the plurality of resistors in the gate bias network.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Semen Syroiezhin, Valentyn Solomko, Matthias Voelkel, Aleksey Zolotarevskyi
  • Semiconductor chip comprising a multiplicity of external contacts, chip arrangement and method for checking an alignment of a position of a semiconductor chip
    Patent number: 11728257
    Abstract: A semiconductor chip includes a mounting surface having a plurality of first conductive contacts and a second conductive contact, wherein each of the first contacts in the plurality is arranged in a regularly spaced apart array such that centroids of immediately adjacent ones of the first contacts are separated from one another in a first direction by a first distance, each of the first contacts in the plurality have an identical first lateral extent, and the second conductive contact is arranged between two of the first conductive contacts in the first direction such that first and second distances between the at least one second conductive contact and the two of the first conductive contacts are each less than the first distance.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventor: Dietrich Bonart