Patents Assigned to TECHNOLOGIES INC.
  • Electroplating solution for high speed plating of tin-copper solder
    Publication number: 20030131753
    Abstract: In accordance with the present invention, an electroplating solution is provided for electroplating satin bright tin-copper alloy solder coatings at high speed. The preferred solution comprises sulfonic acid, tin sulfonate, copper sulfonate, non-ionic surfactant, satin brightener and an antioxidant catechol. The preferred surfactant is polyoxyethylene-block-polyoxypropylene. The preferred satin brightener is formed by the oxidation of an aqueous solution of 1-phenyl-3-parazolidinone. The preferred sulfonic acid is methanesulfonic acid.
    Type: Application
    Filed: January 17, 2002
    Publication date: July 17, 2003
    Applicant: TECHNOLOGIES INC.
    Inventors: Oscar Khaselev, Igor S. Zavarine, Yun Zhang