Abstract: A memory includes: bit lines extending along a first direction and word lines extending along a second direction; a column selection circuit and a plurality of memory modules that are arranged along the first direction; column-select lines extending along the first direction, wherein the column-select lines each are electrically connected to the column selection circuit, and the column selection circuit drives a corresponding amplification unit through one of the column-select lines; a read-write control driver circuit, wherein the read-write control driver circuit and the column selection circuit are located, respectively, on two adjacent sides of the plurality of memory modules as a whole; and a global data line extending along the second direction and an electrical connection line extending along a third direction, wherein the global data line is electrically connected to the read-write control driver circuit through the electrical connection line.

Abstract: A semiconductor structure includes a semiconductor substrate, a first isolation dam, a plurality of switching transistors and a second isolation dam. The semiconductor substrate includes a trench, an isolation region formed by a region where the trench is located, a plurality of active regions defined by the isolation region, and an electrical isolation layer, the electrical isolation layer being located on one side, away from an opening of the trench, of the trench; the first isolation dam fills the trench; the switching transistor is at least partially embedded in the active region of the semiconductor substrate; and the second isolation dam is at least partially located between the first isolation dam and the electrical isolation layer.

Abstract: A solid state drive (SSD) wafer device includes first and second semiconductor wafers coupled together. The first wafer may include a number of memory dies with die bond pads, and the second wafer may include a number of electrical interconnects, each including first and second terminals at opposed ends of the electrical interconnect. When the wafers are bonded together, the first terminals of the second wafer are bonded to the die bond pads of the memory dies of the first wafer. The second terminals are left exposed to couple with an SSD controller, which controls the transfer of data and signals between the memory dies of the first wafer and a host device such as a server in a datacenter.

Abstract: A deflection pad may include a body. The body may include a recess to accommodate a fastener configured to attach the deflection pad to a support structure. The base of the deflection pad may include a bottom surface configured to engage a surface of the support structure. The deflection pad may be included in a system that includes a torsion beam and one or more support racks to which multiple PV modules may be attached, where the support are racks attached to the torsion beam. One or more deflection pads may be positioned between the PV modules and the support rack so as to cushion impact.

Abstract: There are provided a semiconductor structure and a method for manufacturing the same, and a memory. The method for manufacturing a semiconductor structure includes: providing a stack structure including a first dielectric layer containing a first element; forming a first groove at least penetrating through the first dielectric layer by a first etching process, wherein after the first etching process, a first etch residue is formed in the first groove; forming a first protective layer covering a side wall, at the first dielectric layer, of the first groove; and performing a first cleaning on the stack structure formed with the first protective layer to remove the first etch residue. The first groove is configured for forming a storage cell.

Abstract: A method for forming a semiconductor structure and a method for forming a laminate structure include the following operations. A laminate structure is provided, the laminate structure including a plurality of sacrificial layers and a plurality of support layers alternately stacked on one another, each support layers includes a plurality of doped areas and a plurality of body areas. A first etching process is performed to form a plurality of first gaps penetrating through the plurality of body areas and the plurality of sacrificial layers in the laminate structure. A first material layer is deposited on inner walls of the plurality of first gaps. A second etching process is performed to remove the plurality of doped areas and the plurality of sacrificial layers to form a second gap between any two adjacent first gaps.

Abstract: A device includes an armature, a coil, and a circuit. The armature is configured to move between a close position that electrically couples the armature to a contact and an open position that is not electrically coupled to the contact. The coil is configured to release a voltage configured to de-magnetize the coil, thereby causing the armature to move from the close position to the open position. The circuit is configured to provide reverse driving current to the coil during a period of time when the armature moves from the close position to the open position.

Abstract: A defect detecting method for a Word Line (WL) driving circuit includes: m WLs correspondingly connected to m different WL driving circuits are selected from a memory cell array and corresponding WL driving circuit arrays to serve as m WLs to be tested, one of which is set as a first WL and the remaining m-1 ones are set as second WLs; first potential is written into memory cells correspondingly connected to the m WLs to be tested; second potential is written into memory cells correspondingly connected to the first WL; real-time potentials of the memory cells connected to respective second WLs are sequentially read, and when difference value between the real-time potential of one target memory cell and the first potential is greater than first pre-set value, it is determined that the WL driving circuit connected to the second WL corresponding to the target memory cell has a defect.

Abstract: A positioning method for particles on a reticle includes: data of positions passed by a target reticle within a preset period of time is determined according to path data of the target reticle that includes particle information of the target reticle at each scan moment; position information of the target reticle when particles are present on a surface of the target reticle is determined according to the data of positions, to obtain target position data of the target reticle; reticle position data of the target reticle within adjacent scan moments is determined according to the target position data, and a particle source position of the particles on the surface of the target reticle is determined from the reticle position data according to position priorities; and a particle position analysis report of the target reticle within the preset period of time is generated according to the particle source position.

Abstract: A semiconductor structure processing method and forming method are provided. The semiconductor structure processing method includes the steps of: providing a semiconductor substrate, which is provided with feature portions having a mask layer on their top surfaces; ashing a semiconductor structure comprising the semiconductor substrate, the feature portions and the mask layer; removing the mask layer; cleaning the semiconductor structure, and forming an oxide layer on surfaces of the feature portions after the feature portions are cleaned; drying the semiconductor structure; and removing the oxide layer. During drying, one feature portion of at least one group of adjacent feature portions is inclined towards a feature portion adjacent thereto, and a distance between the inclined feature portion and the feature portion adjacent thereto after drying is smaller than a distance there between before drying.

Abstract: An electrical safety monitoring system is provided. The system includes an analog circuit having line inputs for hardwiring an L1, an L2, an L3, and a GND three-phase connections, the analog circuit configured to monitor if voltage exists between any two of the line inputs, a heartbeat circuit electrically connected to the analog circuit to provide a heartbeat signal indicative of voltage present on any of the line inputs, an isolated voltage source electrically connected to the heartbeat circuit to power the heartbeat circuit with a VDC+ and a VDC?, and a logic circuit in operative communication with the heartbeat circuit for monitoring input from the heartbeat circuit and decoding the input from the heart beat circuit. The isolated voltage source may be supplied by a programmable logic controller (PLC) and the logic circuit may be implemented within the same PLC as a function block.

Abstract: A system and method for transmission of a signal for a powered assistive device has a sensor node with a wireless transmitter adapted for digitally transmitting a transmitted signal, the sensor node adapted for receiving and monitoring a sensor signal from a sensor attached to a user, and a master node with a controller and a wireless receiver for receiving the transmitted signal from the wireless transmitter. The master node processes the transmitted signal and communicates a control signal to the powered assistive device. The wireless transmitter transmits the transmitted signal at a first rate when the wireless transmitter adapted to transmit the transmitted signal at a first rate when the sensor signal is indicative of the rest state and to transmit the transmitted signal at a second rate when the sensor signal is indicative of the active state, the second rate being greater than the first rate.

Abstract: Apparatus and methods for additive manufacturing with variable extruder profiles are described herein. An extruder print head with multiple nozzles placed at different angles allows for additional degrees of freedom to additively manufacture parts with complex shapes. In addition with the use of shape memory alloy materials, the diameter of one or more nozzles can be adjusted during the additive manufacturing process. This allows for independent control of the build resolution and of the build rate.

Abstract: A memory, comprising: a plurality of storage groups, first signal lines and second signal lines. The plurality of storage groups is arranged along a first direction, each one of the storage groups includes multiple banks, which are arranged along a second direction, and the first direction is perpendicular to the second direction; the first signal lines extend along the first direction, each first signal line is arranged correspondingly to more than one of the multiple banks, and configured to transmit storage data of the more than one of the multiple banks; and the second signal lines extend along the first direction, each one of the second signal lines is arranged correspondingly to a respective bank, and configured to transmit the storage data of the respective bank; wherein the first signal lines exchange the storage data with the second signal lines through respective data exchange circuits.

Abstract: Architectures and techniques are presented that can facilitate improved design and function of certain air handler devices. Architectures directed to an improved air handler device can be designed to improve temperature control demands such as, e.g., concurrently heat and cool air and reducing device dimensions (e.g., size, weight) that can reduce costs and mitigate shipping and installation difficulties.

Abstract: According to one embodiment, a transformer-based in-phase and quadrature (IQ) includes a differential balun having a first inductor and a second inductor. The first inductor has a first input terminal and a first output terminal. The second inductor has a second input terminal and a second output terminal. Additionally, the IQ generator circuit includes a third inductor magnetically coupled with the first inductor. The third inductor has a first isolation terminal and a third output terminal. The IQ generator circuit also includes a fourth inductor magnetically coupled with the second inductor. The fourth inductor has a second isolation terminal and a fourth output terminal. The IQ generator circuit additionally includes a first transistor coupled to the first input terminal of the first inductor. Further, the generator circuit includes a second transistor coupled to the second input terminal of the second inductor.

Abstract: Methods, apparatuses, systems, and computer program products for configuring a tire monitoring system are disclosed. In a particular embodiment, configuring a tire monitoring system includes determining a model identifier for a tire; identifying, in a database, one or more stiffness coefficients corresponding to the model identifier of the tire; and transmitting the one or more stiffness coefficients to a component of the tire monitoring system.

Abstract: A lithotripter tip configured for use within an invasive lithotripter probe may include a lithotripter tip body dimensioned and configured to be threaded through a human vein or artery of a patient and delivered to a position directly adjacent to a concretion within the patient. The lithotripter tip body may define an interior region in communication with an aperture at a distal end of the lithotripter tip body and the lithotripter tip body may define at least one port in communication with the interior region that is configured to receive a liquid and provide a path for the liquid to flow into the interior region of the body.

Abstract: Systems, methods, and related technologies for segmentation management are described. In certain aspects, an entity communicatively coupled to a network is selected and one or more characteristics of the entity may be determined. A segmentation policy may be selected based on the one or more characteristics of the entity and one or more tags to be assigned to the entity based on the segmentation policy may be determined. A zone for the entity based on the one or more tags may be determined and one or more enforcement points associated with the zone for the entity may be determined. One or more enforcement actions may then be assigned to the one or more enforcement points based on the zone associated with the entity.

Abstract: A test system is disclosed. The test system includes a programmable switching array including input terminals, output terminals, and an array of programmable switches configured for selectively connecting any one of the input terminals to any one of output terminals; and a current supply device comprising a multiplexed digital bus and a plurality of a power supplies connected in parallel between the multiplexed digital bus and the input terminals of the programmable switching array.