Patents Assigned to The Furukawa Electric Co., Ltd.
  • Publication number: 20210139664
    Abstract: A cellulose-fiber dispersion polyethylene resin composite material, formed by dispersing a cellulose fiber into a polyethylene resin, wherein a proportion of the cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and wherein water absorption ratio satisfies the following formula; and a formed body and a pellet using the same, a production method therefor, and a recycling method for a cellulose-fiber adhesion polyethylene thin film piece. (water absorption ratio)<(cellulose effective mass ratio)2×0.01??[Formula].
    Type: Application
    Filed: August 23, 2017
    Publication date: May 13, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jirou HIROISHI, Hidekazu HARA, Yuka SAWADA, Masami TAZUKE, Toshihiro SUZUKI, Shingo MITSUGI
  • Patent number: 11001520
    Abstract: A method of manufacturing an optical fiber glass preform, the method comprising depositing glass particles on a base material, the glass particles being generated by glass making feedstock gas being supplied while a burner and the base material that is rotating are reciprocated relatively to each other, wherein when a portion corresponding to an outer diameter equal to or more than 0.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: May 11, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Seiichi Shinada, Akihiro Kanao
  • Patent number: 11002909
    Abstract: An optical integrated device includes a substrate a passive waveguide region and an active region. The active region and the passive waveguide region include a first mesa structure having an upper cladding portion formed of a same material as the upper cladding layer. The passive waveguide region includes a second spot size converter having the first mesa structure, a second mesa structure having a first core portion, a lower cladding portion, and a second core portion that are formed of same materials as the first core layer, the lower cladding layer, and the second core layer, respectively. The second mesa structure has a width wider than a width of the first mesa structure, and the width of the first mesa structure continuously changes along a longitudinal direction in which light is guided through the second core portion, the width being along a direction perpendicular to the longitudinal direction.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: May 11, 2021
    Assignee: FURUKAWA ELECTRIC CO,. LTD.
    Inventors: Yusuke Saito, Tatsuro Kurobe, Tatsuya Kimoto, Shinichi Kamiya
  • Patent number: 11006556
    Abstract: A first braided wire and a second braided wire that are two cylindrical flexible shield members are fixed with a crimp member at different positions in the circumferential direction on a cross section perpendicular to the longitudinal direction of the electromagnetic shield pipe. Thus, the cylindrical end portions of the braided wires are loosened, and each of sheet-like portions is formed on the end portion, and the sheet-like portions of the end portions of the braided wires are disposed at different positions in the circumferential direction of the electromagnetic shield pipe and fixed with the crimp member on a metal layer of the electromagnetic shield pipe. That is, the braided wires are fixed in a section crimped by the crimp member without being overlapped with each other in the circumferential direction of the electromagnetic shield pipe.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: May 11, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Hiroaki Yokoyama, Yoshikazu Tanaka
  • Publication number: 20210130968
    Abstract: The surface-treated material (10) according to the present invention is a surface-treated material including an electroconductive substrate (1) and a surface treatment coating film (2) including at least one metal layer formed above the electroconductive substrate (1), wherein a lowermost metal layer (21), as a metal layer included in the at least one metal layer and formed above the electroconductive substrate (1), is made of nickel, nickel alloy, cobalt, cobalt alloy, copper, or copper alloy, the surface-treated material includes an intervening layer (3) between the electroconductive substrate (1) and the surface treatment coating film (2), the intervening layer (3) containing a metal component of the electroconductive substrate (1), a metal component of the surface treatment coating film (2), and an oxygen component, and the mean thickness of the intervening layer (3) is in the range of 1.00 nm or larger and 40 nm or smaller as measured in the vertical cross-section of the surface-treated material.
    Type: Application
    Filed: December 26, 2017
    Publication date: May 6, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Miho YAMAUCHI, Yoshiaki KOBAYASHI
  • Publication number: 20210129206
    Abstract: A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.
    Type: Application
    Filed: December 22, 2020
    Publication date: May 6, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Chiyoshi SASAKI, Masakazu ISEMURA, Takahiro KATAYAMA
  • Publication number: 20210135422
    Abstract: An optical power transmission apparatus includes: a light emitting unit including a first optical gain generating means and a first light reflecting means; an optical fiber; a second light reflecting means; and a light receiving means. Further, the second light reflecting means is arranged nearer to the light receiving means than the optical fiber is, a first laser resonator is formed, between the first light reflecting means and the second light reflecting means, by optical connection between the first optical gain generating means and the optical fiber, and first laser light generated by the first laser resonator is configured to be incident on the light receiving means.
    Type: Application
    Filed: January 14, 2021
    Publication date: May 6, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Noriyuki YOKOUCHI, Kengo WATANABE
  • Patent number: 10998108
    Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 ?m/?m2 or less; a method of producing the same; and a terminal.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: May 4, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yoshikazu Okuno, Yoshiaki Kobayashi, Tatsuya Nakatsugawa, Kengo Mitose, Akira Tachibana, Shingo Kawata
  • Patent number: 10996001
    Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: May 4, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 10988646
    Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: April 27, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
  • Patent number: 10992102
    Abstract: A submount on which a semiconductor device is mounted and which is mounted on a base made of metal, the submount including: a substrate; a first coating layer formed on a first surface of the substrate and made of a material having a higher coefficient of thermal expansion than that of the substrate; and a second coating layer formed on a second surface, positioned on a side opposite to the first surface, of the substrate and made of a material having a higher coefficient of thermal expansion than that of the substrate, in which a coating area of the second coating layer is smaller than a coating area of the first coating layer.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 27, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Ryuichiro Minato, Yutaka Ohki
  • Patent number: 10988694
    Abstract: A flame retardant resin composition containing from 30 to 300 parts by mass of a boehmite and an aluminum hydroxide as a total with respect to 100 parts by mass of the resin, wherein a content ratio of the boehmite and the aluminum hydroxide [content of boehmite:content of aluminum hydroxide] is from 85:15 to 15:85; a formed part; and a wiring material each using the same.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 27, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masaki Nishiguchi, Arifumi Matsumura
  • Publication number: 20210116265
    Abstract: A cable comprising: a plurality of optical fiber cores; and one or more optical fiber core wires including one or more of the optical fiber cores. Further, at least one of the optical fiber core wire is fixed at a plurality of positions in a longitudinal direction of the cable so as to achieve substantially no displacement in a cable radial direction, at least a pair of the optical fiber core wires are fixed in a plane perpendicular to the longitudinal direction of the cable so as to achieve substantially no displacement relative to each other, and sensing of a strain profile in the longitudinal direction of at least the pair of the optical fiber core wires leads to achievement of sensing of a shape of the cable in the longitudinal direction.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masateru TADAKUMA, Shigehiro TAKASAKA, Ryuichi SUGIZAKI
  • Patent number: 10981525
    Abstract: A rotary connector device capable of reducing the number of components and enhancing assembly workability provided with: a stationary member; a rotary member to be attached to the stationary member to be capable of relative rotation with respect to the stationary member, the rotary member including a steering wheel insertion hole into which an insertion convex portion of a steering wheel is to be inserted; and an intermediate stationary member provided to be movable between a locked position and a lock released position with respect to the rotary member, wherein the intermediate stationary member is provided with a regulating portion, the regulating portion being configured to, at the locked position, regulate relative rotation of the rotary member when the regulating portion is engaged with the stationary member.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: April 20, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventor: Kenji Hiroki
  • Patent number: 10985526
    Abstract: A laser device that is easily assembled and can be manufactured at a low cost and a light-source device using the same are provided. The laser device includes a mount member including a mount surface, and a semiconductor laser element placed on the mount surface of the mount member. An upper side and lateral sides of the semiconductor laser element on the mount surface are exposed.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: April 20, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Etsuji Katayama, Atsushi Oguri, Hajime Mori
  • Publication number: 20210110951
    Abstract: A wire harness manufacturing system including a plurality of processing zones and configured to manufacture a wire harness by using a subassembly including a plurality of electrical lines to each of which a connection component is attached includes a conveyance device provided along the plurality of processing zones and including: work boards in a number at least corresponding to the number of the plurality of processing zones; a circulation conveyer configured to sequentially convey each work board in a horizontal state from an upstream side to a downstream side on a downstream conveyance path along the plurality of processing zones and then return the work board from the downstream side to the upstream side on an upstream conveyance path; and a raiser configured to set the work board to a stand-up state in which one of edge parts extending in a conveyance direction of the work board is positioned on an upper side of the other edge part in the work board, and to set the work board in the stand-up state to th
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Eiji ARAMAKI, Koji KATO, Mitsuyuki AKAI, Takayuki OKUBO, Nobuyuki MINAMI
  • Patent number: 10976112
    Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: April 13, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Yoshikatsu Inagaki
  • Patent number: 10978851
    Abstract: Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: April 13, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jun Miyokawa, Masakazu Miura, Kazuki Yamaoka
  • Patent number: 10971387
    Abstract: A mask-integrated surface protective tape for production of semiconductor chips, with the production containing steps (a) to (d), which tape comprises a base film and a mask material layer provided thereon, wherein a wetting tension of the base film on the side from which the mask material layer has been peeled is from 20.0 mN/m to 48.0 mN/m, and wherein a surface roughness Ra of the base film on the side from which the mask material layer has been peeled is within a range from 0.05 ?m to 2.0 ?m when measured in conformity to JIS B0601, (a) a specific laminating step; (b) a specific peeling step; (c) a specific plasma-dicing step; and (d) a specific ashing step.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: April 6, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke Goto, Hirotoki Yokoi
  • Publication number: 20210095930
    Abstract: The vapor chamber includes a container having a hollow cavity and formed of one plate-shaped member and another plate-shaped member facing the one plate-shaped member that are layered on each other, a working fluid enclosed in the cavity, and a wick structure provided in the cavity. The wick structure includes a first wick part extending from a heat receiving part to a heat discharge part and having a first wick member using a linear member, and a second wick part provided to the heat receiving part and having a second wick member using a linear member. An average diameter the linear member of the second wick member is smaller than an average diameter of the linear member of the first wick member or an aperture dimension of the second wick member is smaller than an aperture dimension of the first wick member.
    Type: Application
    Filed: November 24, 2020
    Publication date: April 1, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu Inagaki, Hirofumi Aoki, Daiki Takemura, Hiroshi Okada, Kazuaki Aotani