Patents Assigned to Thermal Solutions, Inc.
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Patent number: 11859915Abstract: Embodiments relate to a system and method for dissipating heat from a heat generating component. The system and method an assembly of a fenestrated housing and a plenum and positioning of the assembly relate to the heat generating component. The plenum accommodates a fluid mover relative to the fenestrated housing. The fenestrations function to support multi-directional fluid flow created by the fluid mover and accommodated by the fenestrations, which function as ports to direct fluid with respect to the heat generating component.Type: GrantFiled: January 31, 2019Date of Patent: January 2, 2024Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Patent number: 11653478Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.Type: GrantFiled: April 19, 2021Date of Patent: May 16, 2023Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Geng Qian, Anatoly Pikovsky
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Patent number: 11510337Abstract: A fan-equipped heatsink includes: a heat receiving substrate made of metal; a centrifugal fan disposed on an upper surface side of the heat receiving substrate; a plate-shaped wall that is made of metal, is provided so as to stand at a position, on the upper surface of the heat receiving substrate, which is around and opposed to an outer peripheral portion having an air discharge opening of the centrifugal fan, and are provided with a plurality of through-holes that are open in a plate surface opposed to the centrifugal fan; and a lid member fixed to an upper end of the plate-shaped wall 4 and configured to close a space on the inner side of the plate-shaped wall.Type: GrantFiled: September 4, 2019Date of Patent: November 22, 2022Assignee: LOTUS THERMAL SOLUTION INC.Inventors: Takuya Ide, Masaaki Murakami, Tomiyuki Numata
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Publication number: 20210274679Abstract: A fan-equipped heatsink includes: a heat receiving substrate made of metal; a centrifugal fan disposed on an upper surface side of the heat receiving substrate; a plate-shaped wall that is made of metal, is provided so as to stand at a position, on the upper surface of the heat receiving substrate, which is around and opposed to an outer peripheral portion having an air discharge opening of the centrifugal fan, and are provided with a plurality of through-holes that are open in a plate surface opposed to the centrifugal fan; and a lid member fixed to an upper end of the plate-shaped wall 4 and configured to close a space on the inner side of the plate-shaped wall.Type: ApplicationFiled: September 4, 2019Publication date: September 2, 2021Applicant: Lotus Thermal Solution Inc.Inventors: Takuya IDE, Masaaki MURAKAMI, Tomiyuki NUMATA
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Patent number: 10955202Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.Type: GrantFiled: June 28, 2017Date of Patent: March 23, 2021Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati, Anatoly Pikovsky
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Patent number: 10925219Abstract: An air heating cooling and dehumidification device for maintaining room air at a desired humidity and temperature includes an air to air cross flow heat exchanger (105) formed with cross flow first and second air flow paths (A) and (B), a primary air to liquid heat exchanger (110) in fluid communication with a liquid cooling fluid source (150) for dehumidifying air flow and a secondary air to liquid heat exchanger (115) for reheating the air flow after dehumidification.Type: GrantFiled: October 10, 2018Date of Patent: February 23, 2021Assignee: GS THERMAL SOLUTIONS INC.Inventors: Ken Nguyen, Ming Zhang
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Patent number: 10692798Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.Type: GrantFiled: April 9, 2015Date of Patent: June 23, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Publication number: 20180003451Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.Type: ApplicationFiled: June 28, 2017Publication date: January 4, 2018Applicant: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati, Anatoly Pikovsky
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Publication number: 20160153709Abstract: A beverage held in a container is rapidly cooled by placing the container in a flexible sleeve defining a sleeve chamber that is cooled, either directly or by a secondary loop of heat transfer fluid, by a closed refrigeration circuit. An agitation assembly is selectively operable to oscillate the sleeve about a yaw axis. During active cooling, a cooled fluid (such as refrigerant or a secondary heat transfer fluid) flows through the sleeve chamber while the agitation assembly is simultaneously operated to rapidly cool the beverage held within the container.Type: ApplicationFiled: June 13, 2013Publication date: June 2, 2016Applicant: Creative Thermal Solutions, Inc.Inventors: Stefan Elbel, Scott S. Wujek, Chad D. Bowers, Davi Luis Goergen, Carlos Alberto Montoya Ocampo
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Patent number: 9190592Abstract: A method of fabricating a thermoelectric device includes providing a substrate having a plurality of inclined growth surfaces protruding from a surface thereof. Respective thermoelectric material layers are grown on the inclined growth surfaces, and the respective thermoelectric material layers coalesce to collectively define a continuous thermoelectric film. A surface of the thermoelectric film opposite the surface of the substrate may be substantially planar, and a crystallographic orientation of the thermoelectric film may be tilted at an angle of about 45 degrees or less relative to a direction along a thickness thereof. Related devices and fabrication methods are also discussed.Type: GrantFiled: March 15, 2013Date of Patent: November 17, 2015Assignee: Nextreme Thermal Solutions, Inc.Inventors: Robert P. Vaudo, Philip A. Deane, Thomas Peter Schneider, Christopher D. Holzworth, Joseph Robert Williamson
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Publication number: 20150296662Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.Type: ApplicationFiled: April 9, 2015Publication date: October 15, 2015Applicant: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Patent number: 8623687Abstract: A method of forming a thermoelectric device may include forming a first electrically conductive trace, and bonding a thermoelectric element to the first electrically conductive trace. After bonding the thermoelectric element to the first electrically conductive trace, a metal post may be formed on the thermoelectric element so that the thermoelectric element is between the first electrically conductive trace and the metal post. After forming the metal post, the metal post may be bonded to a second electrically conductive trace so that the metal post is between the second electrically conductive trace and the thermoelectric element. Other related methods and structures are also discussed.Type: GrantFiled: June 21, 2006Date of Patent: January 7, 2014Assignee: Nextreme Thermal Solutions, Inc.Inventors: Brooks O'Quinn, Rama Venkatasubramanian, Edward Siivola
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Patent number: D835590Type: GrantFiled: June 27, 2018Date of Patent: December 11, 2018Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
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Patent number: D837753Type: GrantFiled: June 27, 2018Date of Patent: January 8, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
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Patent number: D856944Type: GrantFiled: January 31, 2019Date of Patent: August 20, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Patent number: D856945Type: GrantFiled: January 31, 2019Date of Patent: August 20, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Patent number: D876372Type: GrantFiled: June 27, 2018Date of Patent: February 25, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
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Patent number: D877098Type: GrantFiled: June 27, 2018Date of Patent: March 3, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Vineet Sunil Barot, Anatoly Pikovsky
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Patent number: D896767Type: GrantFiled: December 2, 2019Date of Patent: September 22, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Anatoly Pikovsky, Gregory Wong
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Patent number: D969760Type: GrantFiled: April 24, 2020Date of Patent: November 15, 2022Assignee: Advanced Thermal Solutions, Inc.Inventors: Anatoly Pikovsky, Gregory Wong