Abstract: A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.

Abstract: A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.

Abstract: An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate.

Abstract: A thermoelectric device having at least one unipolar couple element (22) including two legs (22a) of a same electrical conductivity type. A first-temperature stage (24) is connected to one of the two legs. A second-temperature stage (28) is connected across the legs of the at least one unipolar couple element. A third-temperature stage (30) is connected to the other of the two legs. Methods for cooling an object and for thermoelectric power conversion utilize the at least one unipolar couple element to respectively cool an object and produce electrical power.

Abstract: A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.

Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.

Abstract: A substrate is provided including a growth surface that is offcut relative to a plane defined by a crystallographic orientation of the substrate at an offcut angle of about 5 degrees to about 45 degrees. A thermoelectric film is epitaxially grown on the growth surface. A crystallographic orientation of the thermoelectric film may be tilted about 5 degrees to about 30 degrees relative to the growth surface. The growth surface of the substrate may also be patterned to define a plurality of mesas protruding therefrom prior to epitaxial growth of the thermoelectric film. Related methods and thermoelectric devices are also discussed.

Abstract: Improved induction heating systems are provided for the cooking/heating of food products requiring stirring during preparation thereof, such as chilis or stews. The stems include an induction heating device (38) and an associated container-holding apparatus (32) having a cradle (52) operable to hold a food container (40) and allow shifting thereof between an upper loading/unloading positions and a lower cooking position. A drive mechanism (36) is provided for rotating the container (40) during induction heating thereof. The apparatus (30) and container (40) can be moved separately from the heating device (38), as required. The container (40) includes a plurality of circumferentially spaced apart temperature sensing assemblies (128) serving to wirelessly transmit temperature information to the heating device (38), in order to control the heating/cooking process.

Abstract: A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: Small, low-cost wireless temperature sensors (120) are provided for sensing the temperature of servingware (121). Each temperature sensor preferably includes a substrate (124); at least one sensor element (122) positioned on the substrate; and an adhesive (126) for securing the sensor element to the substrate and for securing the temperature sensor to the servingware so that the sensor element may sense a temperature of the servingware. The temperature sensors may be used in conjunction with a reader/detector (136) operable to generate a magnetic field of magnitude sufficient to cause re-magnetization responses of the temperature sensor element and optional data elements to detect such responses, and to use the detected responses to determine the temperature of the servingware by means of a decoding algorithm. The temperature sensors can be used in closed-loop heating systems capable of controlling the heating of the servingware.

Abstract: A thermoelectric generator may include first and second thermally conductive plates and a plurality of pairs of P-type and N-type thermoelectric elements. The first thermally conductive plate may be configured to generate heat responsive to solar radiation, and the first and second thermally conductive plates may be spaced apart. The P-type and N-type thermoelectric elements of each pair may be electrically coupled in series, and the P-type and N-type thermoelectric elements of each pair may be thermally coupled in parallel between the first and second thermally conductive plates.

Abstract: A method, computer program, and cooking device for detecting boiling of liquids. The invention is implemented with a computer program executed by a processor or other computing device of a cooking unit such as an induction range. The computer program comprises a code segment for receiving an indication of successive temperatures of the vessel and for calculating a slope of a curve representing the successive temperatures versus time; a code segment for detecting boiling of the liquid based on the slope of the curve; and a code segment for providing an output which may be used to indicate the boiling. The computer program may also include a code segment for receiving variables relating to parameters and/or characteristics of the cooking vessel to refine the boiling detection.

Abstract: The present invention provides an improved antenna assembly (66) designed to maintain RF communication between an object (22, 64, 148) to be heated, and a heating assembly (20, 60) such as an induction heater having a hob (34) equipped with an induction work coil (36). The antenna assembly (66) provides substantially continuous RF communication about the entirety of the hob (34), so that the object (22, 64, 148) can be rotated through substantially 360E, or displaced radially, without loss of RF communication. The preferred antenna assembly (66) includes an antenna (67) mounted upon a substrate (68) and presenting a plurality of continuous, conductive antenna loops (70, 72) oriented to cooperatively and substantially around the hob (34).

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.

Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

Abstract: A termoelectric thermoelectric device and method for manufacturing the thermoelectric device.