Abstract: Provided are a displacement detector, a surface shape measuring apparatus, and a roundness measuring apparatus capable of measuring displacement in a plurality of directions, having a simple configuration, and capable of highly accurate measurement. A displacement measurer includes: a detector body; a substantially L-shaped stylus having a contactor to be in contact with a measuring surface of an object to be measured; a stylus holding part that is provided in the detector body and holds the stylus in a swingable manner, with a swing plane being a plane including a first direction and a second direction that are perpendicular to each other; and a displacement detecting unit that is provided in the detector body and detects displacement of the contactor associated with contact between the contactor and the measuring surface.

Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.

Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.

Abstract: Processing device for uniformly grinding wafers held by a plurality of chucks, and a method for setting the processing device. A processing device includes a coarse grinding device and a fine grinding device that are provided in a column straddling over a holding device. The holding device includes: an index table; chucks concentrically disposed about a rotation shaft; a first movable support unit on the outer peripheral side of the chuck in the radial direction of the index table; and a first fixed support unit on the inner peripheral side of the chuck in the radial direction of the index table. The first movable support unit is interposed between the index table and the chuck, and can be freely expanded and contracted in a vertical direction.

Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: Provided are a displacement detector, a surface shape measuring apparatus, and a roundness measuring apparatus capable of measuring displacement in a plurality of directions, having a simple configuration, and capable of highly accurate measurement. A displacement measurer includes: a detector body; a substantially L-shaped stylus having a contactor to be in contact with a measuring surface of an object to be measured; a stylus holding part that is provided in the detector body and holds the stylus in a swingable manner, with a swing plane being a plane including a first direction and a second direction that are perpendicular to each other; and a displacement detecting unit that is provided in the detector body and detects displacement of the contactor associated with contact between the contactor and the measuring surface.

Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: To provide a wafer processing method which can simplify the wafer processing process and efficiently obtain chips of stable quality. A wafer processing method includes: a tape attaching step of attaching a back grinding tape to the front surface of a wafer; a modified region forming step of applying a laser beam from the back surface of the wafer along a cut line to form modified regions inside the wafer; a back surface processing step of processing the back surface of the wafer having the modified regions to reduce a thickness of the wafer; and a dividing step of, in a state in which the back grinding tape is attached to the front surface of the wafer, applying a load to the cut line from the back surface of the wafer to divide the wafer along the cut line and obtain individual chips.

Abstract: A three-dimensional coordinate measurement apparatus capable of reducing shaking of a Y carriage and improving measurement accuracy. The Y carriage is supported by two strut members which are across a surface plate and movable in a Y-axis direction. The two strut members include a first strut member having a driving mechanism and a second strut member which moves following the first strut member. A guide portion parallel to the Y-axis direction is formed in the surface plate on a first strut member side. Side surface support members support the first strut member on the surface plate by holding both opposed side surfaces of the guide portion. The driving mechanism includes a roller having an axis perpendicular to a surface plate surface, and the roller is brought into contact with one side surface of the guide portion and rolled to move the Y carriage relatively to the surface plate.

Abstract: A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: A linear drive mechanism which moves a detector having sensitivity in a first axial direction, relatively to a workpiece in a second axial direction orthogonal to the first axial direction, the linear drive mechanism includes: a drive shaft extending in the second axial direction; a mover which is supported in a non-contact fashion by the drive shaft and configured to move along the drive shaft integrally with the detector or the workpiece; a guide provided at a position deviated relative to the drive shaft in a third axial direction orthogonal to both the first axial direction and the second axial direction, the guide parallel to the drive shaft; and a resistance force generator which is provided on one of the mover and the guide, and is in contact with the other of the mover and the guide, the resistance force generator generates a resistance force which resists against movement of the mover.

Abstract: Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion.

Abstract: Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion.

Abstract: A linear drive mechanism which moves a detector having sensitivity in a first axial direction, relatively to a workpiece in a second axial direction orthogonal to the first axial direction, the linear drive mechanism includes: a drive shaft extending in the second axial direction; a mover which is supported in a non-contact fashion by the drive shaft and configured to move along the drive shaft integrally with the detector or the workpiece; a guide provided at a position deviated relative to the drive shaft in a third axial direction orthogonal to both the first axial direction and the second axial direction, the guide parallel to the drive shaft; and a resistance force generator which is provided on one of the mover and the guide, and is in contact with the other of the mover and the guide, the resistance force generator generates a resistance force which resists against movement of the mover.

Abstract: To provide a wafer processing method which can simplify the wafer processing process and efficiently obtain chips of stable quality. A wafer processing method includes: a tape attaching step of attaching a back grinding tape to the front surface of a wafer; a modified region forming step of applying a laser beam from the back surface of the wafer along a cut line to form modified regions inside the wafer; a back surface processing step of processing the back surface of the wafer having the modified regions to reduce a thickness of the wafer; and a dividing step of, in a state in which the back grinding tape is attached to the front surface of the wafer, applying a load to the cut line from the back surface of the wafer to divide the wafer along the cut line and obtain individual chips.

Abstract: Provided is a prober capable of suppressing the increase in installation area and the increase in device cost, and also improving the throughput, while maintaining the accuracy of the moving position of an alignment device shared by each of measuring units. The prober includes: a plurality of measuring units, each of which has a probe card electrically connected to a test head; a wafer chuck that holds a wafer in which a plurality of chips are formed; an alignment device which performs relative alignment between the probe card and the wafer held by the wafer chuck; a moving device which moves the alignment device among the measuring units; and a positioning and fixing device which is provided for every of the measuring units, and positions and fixes the alignment device which is moved to each of the measuring units.