Patents Assigned to Tokyo Seimitsu Co., Ltd.
  • Publication number: 20250038035
    Abstract: A wafer chuck having a holding surface for holding a wafer, the wafer chuck includes: a heating and cooling unit configured to heat or cool the wafer chuck; at least one temperature sensor disposed in the wafer chuck; and a heat flow sensor which is disposed in the wafer chuck, and in which a plurality of thermocouples are connected in series and connecting parts between thermocouples adjacent to each other are alternately disposed at a first depth position from the holding surface and at a second depth position deeper than the first depth position. The heat flow sensor has a plurality of temperature measurement points provided for the respective thermocouples, and the plurality of temperature measurement points are disposed over an entirety of the wafer chuck when the wafer chuck is seen in plan view.
    Type: Application
    Filed: October 16, 2024
    Publication date: January 30, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Takenori TAKAHASHI
  • Publication number: 20250035426
    Abstract: A three-dimensional shape measuring device includes: an interference objective lens including an interfering unit configured to separate part of measurement light as reference light and generate multiplexed light of the measurement light returning from the surface to be measured and the reference light returning from a reference surface, and an objective lens configured to cause the measurement light to focus on the surface to be measured; a scanning unit configured to cause the interference objective lens to scan relatively with respect to the surface to be measured; an image capturing unit configured to repeatedly capture an image of the multiplexed light and output a plurality of captured images during scanning; and a first signal processing unit configured to calculate the three-dimensional shape of the surface to be measured, based on a result of comparing the sharpness of each pixel on the same coordinate of the plurality of captured images.
    Type: Application
    Filed: September 20, 2024
    Publication date: January 30, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Takashi OGURA, Xiaonan WANG
  • Publication number: 20250018605
    Abstract: Provided is a dicing device capable of favorably performing a maintenance work, even when a workpiece is large. A dicing device includes a housing that accommodates inside thereof, a worktable configured to hold and move a workpiece, and a spindle configured to be rotatable while holding a blade, wherein the housing has: an end face provided in a moving direction of the worktable, the end face being on a side where a maintenance work of the dicing device is performed; and a slider constituting a part of the end face, and the slider is configured to be freely slidable in a direction to shorten a distance from the end face to the spindle.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Yusuke KANESHIRO
  • Publication number: 20250018502
    Abstract: The laser light correction method includes: a step of performing trimming machining on a positioning workpiece in which a laser irradiation surface includes a material that facilitates detection of a laser-irradiation mark, the trimming machining in which a split laser is focused on the laser irradiation surface via a laser optical system while moving the laser optical system in the machining feed direction relative to the positioning workpiece to form a first groove having two rows parallel to each other in a machining feed direction, and performing hollowing machining in which a line laser is focused on the laser irradiation surface via the laser optical system to form a second groove; a step of detecting the first groove and the second groove by a microscope; and a step of correcting focus positions of the split laser and the line laser based on detection results of the first and second grooves.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Chikara AIKAWA, Satoru IWAKI
  • Publication number: 20250018504
    Abstract: A laser optical system and an adjustment method therefor, and a laser machining device and method capable of adjusting laser light so as to satisfy criteria of laser machining are provided. The adjustment method of a laser optical system including a plurality of optical element units which are arranged in series on an optical path of laser light and each of which includes a half-wave plate and a Wollaston prism, the laser optical system configured to branch the laser light incident on the Wollaston prism through the half-wave plate into two beams of branched laser light, includes a step of rotating the half-wave plate around the optical path to adjust branching ratios of the branched laser light and a step of rotating the Wollaston prism around the optical path to adjust branching directions of the branched laser light.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Chikara AIKAWA, Hirokazu HAYASHI
  • Publication number: 20250022744
    Abstract: To provide an expansion retaining ring that may maintain an annular shape of a ring body while ensuring flexibility of a ring-shaped lip. The expansion retaining ring includes a ring body and a ring-shaped lip formed of a material softer than the ring body, the ring-shaped lip being able to be detachably attached to an outer circumferential surface of the ring body and protruding outward from the outer circumferential surface of the ring body.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Ryo HIRUMA, Tasuku SHIMIZU
  • Publication number: 20250018501
    Abstract: Provided are a method and a device for adjusting an optical axis of laser light, capable of accurately grasping change in the state of the laser light and maintaining the quality of laser processing. The method for adjusting an optical axis of laser light includes: a step of detecting a position of laser light by position sensitive detectors arranged at two or more detection positions on an optical path of the laser light that is output from a laser light source toward a workpiece; and a step of adjusting, based on the detected position of the laser light, at least one of a position and an angle of optical elements arranged at two or more positions on the optical path of the laser light, to adjust an optical axis of the laser light.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Chikara AIKAWA, Takashi MORIMOTO, Hirokazu HAYASHI
  • Publication number: 20250012563
    Abstract: A surface shape measurement device includes: a first image capturing system configured to capture a first captured image of a measurement object while scanning relative to the measurement object; a second image capturing system that is separate from the first image capturing system and configured to capture a second captured image of the measurement object or a support body thereof in synchronization with the first image capturing system; a calculating unit configured to calculate a surface shape of the measurement object based on first captured images; a storage unit configured to store coordinate system transformation information for transforming a second coordinate system to a first coordinate system; a displacement detecting unit configured to detect displacement of the measurement object based on second captured images; and a correcting unit configured to correct the surface shape based on a detection result of the displacement and on the coordinate system transformation information.
    Type: Application
    Filed: September 24, 2024
    Publication date: January 9, 2025
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Kyohei HAYASHI
  • Publication number: 20240426600
    Abstract: The shape measuring device includes: a relative movement unit that relatively moves a probe along a surface to be measured and scans the surface with measurement light; a detecting unit that, while the relative movement is performed, repeatedly detects, multiplexed light generated by a multiplexing unit for each of measurement point of the surface on which the measurement light is incident; a distance calculating unit that detects a beat frequency from a detection signal of the multiplexed light detected by the detecting unit and calculates a distance from the probe to the measurement point based on the beat frequency for each measurement point; a position calculating unit that calculates a position of each measurement point; and a position correcting unit that corrects the position of the measurement point based on a Doppler shift amount of the measurement light reflected at the measurement point, for each measurement point.
    Type: Application
    Filed: September 6, 2024
    Publication date: December 26, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Kyohei HAYASHI
  • Patent number: 12173939
    Abstract: The chiller system includes an internal circulation path, an external circulation path, and a control device. The internal circulation path is equipped with a refrigerant tank, an internal circulation pump, and a freezer. The external circulation path includes a feed path and a return path the feed path being equipped with an external circulation pump and a temperature sensor. A communication path that provides communication between the return path and the refrigerant tank is equipped with throttle means. The internal circulation path is equipped with an on-off control valve, with one end of the pressurizing path being connected to an upstream side of the on-off control valve in the internal circulation path and the other end being connected to an upstream side of the throttle part in the communication path. The control device controls operation of the on-off control valve based on a measurement result of the temperature sensor.
    Type: Grant
    Filed: July 12, 2024
    Date of Patent: December 24, 2024
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventor: Katsuhiko Suzuki
  • Patent number: 12160663
    Abstract: An image processing device acquires a plurality of images of an object to be measured by an imaging device, the plurality of images being taken while varying a focal position, and corrects blurring in the acquired plurality of images based on a point spread function for each focal position of an image forming optical system in the imaging device. The image processing device also calculates, for the plurality of images after correction of the blurring, an evaluation value for a focusing degree for each pixel, and generates three-dimensional shape data of the object to be measured based on the calculated evaluation value for the focusing degree for each pixel.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: December 3, 2024
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventor: Kyohei Hayashi
  • Publication number: 20240393104
    Abstract: A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.
    Type: Application
    Filed: August 6, 2024
    Publication date: November 28, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Yoshiyuki KAWATA, Katsufumi MORIYAMA, Hideki MORII
  • Publication number: 20240393097
    Abstract: A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.
    Type: Application
    Filed: August 6, 2024
    Publication date: November 28, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Yoshiyuki KAWATA, Katsufumi MORIYAMA, Hideki MORII
  • Publication number: 20240393098
    Abstract: An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.
    Type: Application
    Filed: August 6, 2024
    Publication date: November 28, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Yoshiyuki KAWATA, Katsufumi MORIYAMA, Hideki MORII
  • Publication number: 20240385067
    Abstract: An automatic balancer comprising: a balance head configured to rotate integrally with a rotating body around a rotation axis of the rotating body, the balance head including a balance correction mechanism configured to correct imbalance of the rotating body, and a case having a cylindrical outer peripheral surface parallel to the rotation axis and configured to house the balance correction mechanism; a stator provided separately from the balance head and having a shape which is along a circumferential direction of the outer peripheral surface with a clearance from the outer peripheral surface; and a rotor part provided at a position where the rotor part faces the stator on the outer peripheral surface, configured to rotate integrally with the balance head, the rotor part having a shape along the circumferential direction of the outer peripheral surface, wherein the stator and the rotor part are configured to perform wireless communication therebetween.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 21, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Kelvin WOLTRING, William KERNAN, Joseph CANFIELD, Jeremy ROSE
  • Publication number: 20240369623
    Abstract: The wafer test system includes: a prober including a chuck that holds a semiconductor wafer and a probe card having probe needles thereon, and brings the probe needles in contact with semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips; an overhead hoist transport that delivers the cassette that houses the plurality of semiconductor wafers to be inspected to the prober and withdraws, from the prober, the cassette that houses the semiconductor wafers that have been inspected; a conveying control unit that controls the overhead hoist transport to convey the probe card between a replacement position of the probe card predetermined in the prober and a storage of the probe card located in a place different from the prober; and a card conveying mechanism that conveys the probe card between a holding position in the prober and the replacement position.
    Type: Application
    Filed: July 16, 2024
    Publication date: November 7, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Akira YAMAGUCHI, Yuta SATO, Naoki KASAI, Naoyuki YAMAZOE, Tetsuya YASUNAKA, Kazuma TAKII, Teppei AOKI, Wataru KAWASAKI, Hiroki ISHIDA, Yasuhito IGUCHI
  • Publication number: 20240369270
    Abstract: The chiller system includes an internal circulation path, an external circulation path, and a control device. The internal circulation path is equipped with a refrigerant tank, an internal circulation pump, and a freezer. The external circulation path includes a feed path and a return path the feed path being equipped with an external circulation pump and a temperature sensor. A communication path that provides communication between the return path and the refrigerant tank is equipped with throttle means. The internal circulation path is equipped with an on-off control valve, with one end of the pressurizing path being connected to an upstream side of the on-off control valve in the internal circulation path and the other end being connected to an upstream side of the throttle part in the communication path. The control device controls operation of the on-off control valve based on a measurement result of the temperature sensor.
    Type: Application
    Filed: July 12, 2024
    Publication date: November 7, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Katsuhiko SUZUKI
  • Publication number: 20240328769
    Abstract: The present disclosure provides a groove shape measuring method and a groove shape measuring apparatus, capable of achieving reduction in processing load and acquisition of a more accurate cross-sectional profile. The groove shape measuring method includes: a setting step of dividing a processing groove into a plurality of measurement regions with a predetermined pitch and further setting, for each of the measurement regions, N number of sub-measurement regions in the measurement region; a coordinate data acquisition step of acquiring a plurality of coordinate data on the processing groove in respective M-th sub-measurement regions in the measurement regions; and a cross-sectional profile generation step of generating a cross-sectional profile by projecting the coordinate data, corresponding to the M-th sub-measurement regions acquired for the respective measurement regions in the coordinate data acquisition step, onto a two-dimensional plane.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 3, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Satoru IWAKI, Tasuku SHIMIZU
  • Publication number: 20240329617
    Abstract: A machining state detection apparatus acquires an environmental temperature history, a blade supply water temperature history, and a heat source supply water temperature history, and derives an environmental temperature history feature amount, a blade supply water temperature history feature amount, and a heat source supply water temperature history feature amount, and when a machining error is predicted based on a temperature history feature amount including the environmental temperature history feature amount, the blade supply water temperature history feature amount and the heat source supply water temperature history feature amount, with a learning model which is trained using the temperature history feature amount and the machining error as learning data and which outputs a prediction value of the machining error, when the temperature history feature amount is input.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 3, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Hiroya SHINOHARA, Tasuku SHIMIZU
  • Publication number: 20240319264
    Abstract: A housing for a prober having a multi-layer structure in which measuring parts are stacked includes: floor bases configured to floor surfaces of respective layers of the multi-layer structure; and at least one side frame body which is arranged between a floor base of one layer and a floor base of another layer positioned above the one layer among the plurality of layers, and which is positioned in both side parts of the measuring parts, wherein the side frame body includes: a first side frame which is erected on the floor base of the one layer and which supports a lower surface side of the floor base of the another layer; and a second side frame which is erected on the floor base of the one layer at a position different from that of the first side frame, and supports a measuring part constituent member arranged in the measuring part.
    Type: Application
    Filed: May 31, 2024
    Publication date: September 26, 2024
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Hideaki NAGASHIMA