Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

Abstract: A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.

Abstract: The alignment method includes detecting an extending direction of a groove formed on a wafer, based on an image of the wafer picked up by a camera, and performing alignment so as to adjust the extending direction of the groove to be parallel to an array direction of pixels of the camera by relatively rotating the wafer and the camera.

Abstract: A measuring device includes a table on which a workpiece is to be mounted, a first imaging unit configured to image the surface of the workpiece on the table, a second imaging unit configured to image the surface of the workpiece on the table, the second imaging unit allowing measurement of a shape and/or roughness of the surface of the workpiece according to a plurality of images taken by scanning the surface of the workpiece in a Z-axis direction, and an image processing unit configured to process the image of the surface of the workpiece taken by the first imaging unit and the plurality of images taken by scanning the surface of the workpiece in the Z-axis direction by the second imaging unit, so as to measure the shape and/or the roughness of the surface of the workpiece.

Abstract: The calibration method includes changing the emission direction of the measurement light to be emitted from the optical rotation probe by a minute angle from a reference direction set in advance, acquiring a shape error for a reference object after changing the emission direction by emitting the measurement light from the optical rotation probe toward the reference object while rotating the emission direction of the measurement light around an S axis and varying a relative position between the optical rotation probe and the reference object, and calculating an adjustment error of the emission direction of the measurement light with respect to the reference direction based on a theoretical value of the shape error for the reference object to be obtained in a case where the emission direction of the measurement light matches the reference direction and a measurement value of the acquired shape error for the reference object.

Abstract: A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are ?, ? and ? respectively, the measurement device satisfies a condition of (?+?)?1/2????(?+?)+1/2?.

Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

Abstract: The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.

Abstract: The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.

Abstract: An image processing device acquires a plurality of images of an object to be measured by an imaging device, the plurality of images being taken while varying a focal position, and corrects blurring in the acquired plurality of images based on a point spread function for each focal position of an image forming optical system in the imaging device. The image processing device also calculates, for the plurality of images after correction of the blurring, an evaluation value for a focusing degree for each pixel, and generates three-dimensional shape data of the object to be measured based on the calculated evaluation value for the focusing degree for each pixel.

Abstract: A branching element configured to branch a second laser light into a plurality of beams of branch light along a machining feed direction, and a second condenser lens configured to focus the plurality of beams of branch light branched by a branching element onto a street to be machined are provided, and a time period ? is expressed as ?=L/V, where L is a branch distance, which corresponds to spacing between adjacent leading and trailing spots for each of branch lights focused on the street by the second condenser lens, V is a machining speed, which corresponds to a speed of relative movement, and ? is the time period taken until the trailing spot overlaps a machining position of the leading spot, and ?>?1 is satisfied, where ?1 is a threshold value of the time period when deterioration of the machining quality of the second groove occurs.

Abstract: A workpiece diameter measurement method includes: detecting positions of a probe while relatively rotating an uncalibrated standard and a detector around a rotation center in a state where the probe is in contact with a circumferential face of the standard from one side in a displacement direction of the probe, detecting the positions of the probe while relatively rotating the standard and the detector around the rotation center in a state where the probe is in contact with the circumferential face from another side in the displacement direction, calculating the position of the rotation center based on the detected positions, relatively rotating a workpiece and the detector around the rotation center in a state where the probe is in contact with the workpiece from the other side, and calculating a diameter of a circumferential face of the workpiece.

Abstract: The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.

Abstract: A spherical aberration adjustment method for an objective optical system having an objective lens, and a diopter adjusting optical system arranged on an opposite side of a medium with respect to the objective lens, including changing an emittance or convergence of a luminous flux of laser light by the diopter adjusting optical system, and changing a depth of a focal point inside the medium with a diffraction limit of the objective optical system kept.

Abstract: An optical system that relays light to a machining lens to be used for machining on a workpiece includes a spatial light modulator and a second lens arranged between the spatial light modulator and the machining lens, a distance D from the second lens to a machining lens pupil is D = f2 - Mf2, and a distance D1 from the spatial light modulator to the second lens is D1 = f2 - f2/M, and the spatial light modulator has a conjugate relation with the machining lens pupil of the machining lens, where f2 is a focal length of the second lens, and M is a projection magnification from the spatial light modulator to the machining lens pupil of the machining lens.

Abstract: A shape measurement device includes: a displacement detector configured to detect displacement of a contact; a relative movement mechanism configured to relatively move the displacement detector with respect to the measurement object, and allow the contact to trace a surface to be measured of the measurement object; a position detecting sensor configured to detect a relative position of the displacement detector with respect to the measurement object; a camera configured to image the contact, and output a captured image of the contact; and a synchronization controller configured to repetitively execute three actions in synchronization together while the relative movement is being performed by the relative movement mechanism, the actions including detection of the relative position by the position detecting sensor, detection of the displacement by the displacement detector, and imaging by the camera.

Abstract: A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are ?, ? and ? respectively, the measurement device satisfies a condition of ? + ? ? 1 ? / ? 2 ? ? ? ? ? ? ? ? ? + ? + 1 ? / ? 2 ? .

Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Abstract: The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.